00197385-03_SR70x_FeatureDescription_DE_EN.pdf - 第7页
7 8.19 New Feeder Types ........................................................................................ 133 8.19.1 Multiple JEDEC Tray Feeder .....................................................................…
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7.33 DX4 Placement Machine - PCB Barcode Reader Functions ............................ 94
7.34 Automatic Deactivation of the Component Sensor ........................................... 95
7.35 Automatic Deactivation of the Compressed Air ................................................ 95
7.36 Automatic Pin Positioning with Smart Pin Support ........................................... 95
7.37 SIPLACE GlueFeeder Feeder Type ................................................................ 96
7.38 Feeder Parameter Management ...................................................................... 97
7.38.1 Handling Options ............................................................................................. 97
7.38.2 Setting and Changing Authorizations ............................................................... 97
7.38.3 Parameter Changes at the Feeder Operator Panel ......................................... 98
7.38.4 No Automatic Pitch Setting in Dependance of the Pick-up Position at the
Feeder ............................................................................................................. 98
7.38.5 Displaying Deviating Feeder Parameter Settings ............................................. 99
7.38.6 Limited Correction Area for the Pick-up Position ............................................ 103
7.38.7 Saving the XY Pick-up Position ..................................................................... 106
7.38.8 Grafical Display of the Feeder Pick-up Position ............................................. 107
7.38.9 Tape Pocket Detection of Component Shape 0603 ....................................... 108
7.39 Fault-tolerant Operation of Twin Head ........................................................... 109
7.40 Error Message "Narrow edges on the encoder's track signals" ...................... 111
7.41 Automatic Backspacing to Lower Activity Level ............................................. 111
7.42 SIPLACE LED Pairing ................................................................................... 111
7.43 PCB Barcode Detection with Molex Traceability Pad ..................................... 112
7.44 Tape Security Flag in X-Feeder ..................................................................... 113
7.45 Improved Behavior at Conveyor Problems .................................................... 113
7.46 Requesting Shutdown Reason on the GUI .................................................... 114
7.47 New Positions for Fixed Rails in SX1/SX2 V2 ................................................ 115
7.48 Checking Insufficiently Fixed Filter Disks ....................................................... 115
7.49 Extension of Nozzle Maintenance Intervals by Cyclic Cleaning ..................... 116
7.50 Additional Error Detection Options................................................................. 117
7.51 C&P12 Placement Head on SX1/SX2 V2 ...................................................... 117
7.52 "Set full" Function Linked to Activity Level ..................................................... 118
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53 New Nozzle Types: 1008 and 1009 ............................................................... 118
8 Feature Description – Station Software V707.x 119
8.1 SIPLACE CA Series Placement Machines .................................................... 119
8.1.1 Individual Pick-up Positions for Flip-Chip Nozzles ......................................... 121
8.2 SIPLACE X2 S Placement Machine .............................................................. 121
8.3 SIPLACE X4 S micron Placement Machine ................................................... 122
8.4 SIPLACE X4i S micron Placement Machine .................................................. 122
8.5 SIPLACE SX1/SX2 V2 Placement Machine with Twin VHF – Placement of
Tall Components ........................................................................................... 122
8.6 SIPLACE X4i S Placement Machine with C&P20 P Placement Head ............ 123
8.6.1 Vacuum Pump Operation on SIPLACE X4i S ................................................ 123
8.6.2 Temperature Management ............................................................................ 123
8.7 Teaching Component from Deactivated Track ............................................... 124
8.8 Changing Data without Running Empty ......................................................... 124
8.9 Editing Incomplete Waffle-Pack Tray Descriptions ........................................ 125
8.10 Position Detection of Waffle-Pack Trays ........................................................ 128
8.11 Changing Acceleration Value for Waffle-Pack Tray ....................................... 129
8.12 Error Handling after Vision and Pickup Errors ............................................... 129
8.13 Changing the Feeder Parameters – Enhancements ...................................... 130
8.13.1 Orientation Check for Components................................................................ 130
8.13.2 Measuring the Pickup Position before Pickup ................................................ 130
8.13.3 Enhanced Measuring Rule for Tape Pockets ................................................. 130
8.14 Faster Unlocking/Locking of SX Component Changeover Tables .................. 131
8.15 Improved Error Message for Lost Components ............................................. 131
8.16 Checking Board Position after Placement...................................................... 132
8.17 Vision Measurement before and after Dipping ............................................... 133
8.18 Smart Pin Support – Fast Configuration Change ........................................... 133
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8.19 New Feeder Types ........................................................................................ 133
8.19.1 Multiple JEDEC Tray Feeder ......................................................................... 133
8.19.2 JEDEC Tray Stack Feeder ............................................................................ 134
8.19.3 SIPLACE Wafer Systems 12 1&3 and 12 2&4 ............................................... 134
8.20 Multiple LDU-X Modules on One Table ......................................................... 135
8.21 FCCS Calibration within the Line ................................................................... 135
8.22 Virtual Ink Spot Handling ............................................................................... 136
8.23 Indicator Lamps and Audible Signals – Enhancements ................................. 136
8.24 SMEMA Pass/Fail Conveyor Option .............................................................. 137
8.25 Short Tape Handling for X-Feeders ............................................................... 138
8.26 SIPLACE Vision Enhancements .................................................................... 140
8.26.1 New Camera Interface GigE .......................................................................... 140
8.26.2 Binning Can Be Disabled ............................................................................... 140
8.26.3 Measuring Dies with Pattern Matching .......................................................... 140
8.26.4 New Pin Types: THT Round Pin and THT Square Pin ................................... 140
8.26.5 Storing Vision Data ........................................................................................ 140
8.27 Supported SIPLACE Pro Enhancements ....................................................... 141
8.28 Twin Head / CPP Placement Heads on SIPLACE CA-Series ........................ 141
8.29 C&P20 P Placement Head on SIPLACE X-Series S ...................................... 142
8.30 WPC5/WPC6 on SIPLACE X-Serie S ............................................................ 142
8.31 SIPLACE X4i S micron – Enhancements....................................................... 142
8.32 Placement Process for Springs ..................................................................... 143
8.33 Displaying Cutting Times per Compressed Air Cylinder on the GUI ............... 143
8.34 SIPLACE Vision Enhancements .................................................................... 144
8.34.1 Reading PCB Barcodes with the PCB Camera .............................................. 144
8.34.2 Displaying Polygon Shapes ........................................................................... 144
8.34.3 Accuracy of Polygon Circles .......................................................................... 144
8.34.4 Displaying Component Shape when Teaching Local Fiducials ...................... 144
8.34.5 M
ultiple Measurements with CPP Placement Head ....................................... 144