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8.19 New Feeder Types ........................................................................................ 133
8.19.1 Multiple JEDEC Tray Feeder ......................................................................... 133
8.19.2 JEDEC Tray Stack Feeder ............................................................................ 134
8.19.3 SIPLACE Wafer Systems 12 1&3 and 12 2&4 ............................................... 134
8.20 Multiple LDU-X Modules on One Table ......................................................... 135
8.21 FCCS Calibration within the Line ................................................................... 135
8.22 Virtual Ink Spot Handling ............................................................................... 136
8.23 Indicator Lamps and Audible Signals – Enhancements ................................. 136
8.24 SMEMA Pass/Fail Conveyor Option .............................................................. 137
8.25 Short Tape Handling for X-Feeders ............................................................... 138
8.26 SIPLACE Vision Enhancements .................................................................... 140
8.26.1 New Camera Interface GigE .......................................................................... 140
8.26.2 Binning Can Be Disabled ............................................................................... 140
8.26.3 Measuring Dies with Pattern Matching .......................................................... 140
8.26.4 New Pin Types: THT Round Pin and THT Square Pin ................................... 140
8.26.5 Storing Vision Data ........................................................................................ 140
8.27 Supported SIPLACE Pro Enhancements ....................................................... 141
8.28 Twin Head / CPP Placement Heads on SIPLACE CA-Series ........................ 141
8.29 C&P20 P Placement Head on SIPLACE X-Series S ...................................... 142
8.30 WPC5/WPC6 on SIPLACE X-Serie S ............................................................ 142
8.31 SIPLACE X4i S micron – Enhancements....................................................... 142
8.32 Placement Process for Springs ..................................................................... 143
8.33 Displaying Cutting Times per Compressed Air Cylinder on the GUI ............... 143
8.34 SIPLACE Vision Enhancements .................................................................... 144
8.34.1 Reading PCB Barcodes with the PCB Camera .............................................. 144
8.34.2 Displaying Polygon Shapes ........................................................................... 144
8.34.3 Accuracy of Polygon Circles .......................................................................... 144
8.34.4 Displaying Component Shape when Teaching Local Fiducials ...................... 144
8.34.5 M
ultiple Measurements with CPP Placement Head ....................................... 144
SIPLACE Station Software 70x / Feature Description Ausgabe 05/2014 Edition
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1 SIPLACE Station Software – Feature Description
This document contains a description of all new features of the 701.x – 707.x SIPLACE station
software versions.
● Chapter 2: Feature Description – Station Software Versions 701.x on page 11.
● Chapter 3: Feature Description – Station Software Versions 702.x on page 13.
● Chapter 4: Feature Description – Station Software Versions 703.x on page 19.
● Chapter 5: Feature Description – Station Software Versions 704.x on page 31.
● Chapter 6: Feature Description – Station Software Versions 705.x on page 41.
● Chapter 7: Feature Description – Station Software Versions 706.x on page 57.
● Chapter 8: Feature Description – Station Software Versions 707.x on page 119.
NOTICE
If not differently described, the features of the previous versions are contained in the
higher versions.
Detailed information about the single functions can be found in the online help of the
station software.
Product Release
701.02 07-Aug-08
701.03 31-Mar-09
702.01 16-Feb-09
703.01 30-Jun-09
703.02 27-Nov-09
703.02 SP1 20-Aug-10
703.03 17-Dec-10
704.01 30-Apr-10
704.02 10-Dec-10
704.03 31-Jul-11
704.03 SP1 28-Oct-11
704.03 SP2 29-Jun-12
705.03 28-Feb-11
705.04 19-Sep-11
705.04 SP1 28-Oct-11
705.04 SP2 29-Jun-12
706.0 13-Apr-12
706.1 30-Nov-12