IPC-D-859.pdf - 第3页
ANSI/IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits Developed by the Hybrid Design T ask Group of the Hybrid & Related T echnologies Committee of the Institute for Interconnecting and Packaging E…
Standardization
In May 1995 the IPC’s Technical Activities Executive Committee adopted Prin-
ciples of Standardization as a guiding principle of IPC’s standardization efforts.
Standards Should:
• Show relationship to DFM & DFE
• Minimize time to market
• Contain simple (simplified) language
• Just include spec information
• Focus on end product performance
• Include a feed back system on use and problems for future improvement
Standards Should Not:
• Inhibit innovation
• Increase time-to-market
• Keep people out
• Increase cycle time
• Tell you how to make something
• Contain anything that cannot be defended with data
Notice
IPC Standards and Publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitat-
ing interchangeability and improvement of products, and assisting the pur-
chaser in selecting and obtaining with minimum delay the proper product for
his particular need. Existence of such Standards and Publications shall not
in any respect preclude any member or nonmember of IPC from manufacturing
or selling products not conforming to such Standards and Publication, nor
shall the existence of such Standards and Publications preclude their voluntary
use by those other than IPC members, whether the standard is to be used
either domestically or internationally.
Recommended Standards and Publications are adopted by IPC without regard to
whether their adoption may involve patents on articles, materials, or processes.
By such action, IPC does not assume any liability to any patent owner, nor
do they assume any obligation whatever to parties adopting the Recommended
Standard or Publication. Users are also wholly responsible for protecting
themselves against all claims of liabilities for patent infringement.
The material in this standard was developed by the Hybrid Design Task
Group of the Hybrid & Related Technologies Committee of the Institute for
Interconnecting and Packaging Electronic Circuits.
Copyright © 1996 by the Institute for Interconnecting and Packaging Electronic Circuits. All rights reserved. Published 1996. Printed in the
United States of America.
No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permission
of the publisher. 1996
ANSI/IPC-D-859
Design Standard for
Thick Film Multilayer
Hybrid Circuits
Developed by the Hybrid Design Task Group of the Hybrid &
Related Technologies Committee of the Institute for Interconnecting
and Packaging Electronic Circuits
Users of this standard are encouraged to participate in the
development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
T
HE
I
NSTITUTE FOR
I
NTERCONNECTING
AND
P
ACKAGING
E
LECTRONIC
C
IRCUITS
Acknowledgment
As with all IPC documents, this
standard is possible only because a
large number of people volunteered
to share their time and expertise in
producing it. While the principle
members of the IPC Hybrid Design
Task Group are shown below, it is
not possible to include the names of
all those who assisted in developing
this standard. To each of them, the
members of the IPC extend their
gratitude.
Hybrid & Related
Technologies Committee
Hybrid Design Task Group Technical Liaison of the IPC
Board of Directors
Chairman
Bob Lomerson
General Dynamics
Chairman
Richard E. Park, Jr.
Raytheon
Gene Hendrickson
Tektronix
Hybrid Design Task Group
F.E. Bader, Bell Laboratories
J. Barton, Dept. of Defense
D. Benezra, Boeing Electronics Co.
S.T. Bora, Smiths Industries
P. Boudreau, Hughes Aircraft Co.
J. Carow, Unisys Corp.
Dr. R. Castonguay, Hicks & Otis
Prints Inc.
S. Clark, Bendix Oceanics Division
J.R. Dinitto, Electro Films Inc.
C.J. Dumas, Methode Electronics Inc.
R.E. Egloff, Acheson Colloids Co.
S. Ethridge, Hughes Aircraft Co.
J. Fjelstad, J.C. Fjelstad & Associates
M. Furukawa, Mitsui Toatsu
Chemicals Inc.
K.J. Gainor, Texas Instruments, Inc.
E.C. Galgoci, Shell Development Co.
S. Gazit, Rogers Corp.
G. Ginsberg, Component Data
Associates
R. Glaessgen, Coates Circuit
Products/USA
W.J. Greig, Wm. J. Greig Assoc. Inc.
B. Gutek, Dow Corning Corp.
D.H. Hundrieser, Northern Telecom
S. Jain, Climax Specialty Metals
M.P. Kalliat, AT&T Bell Laboratories
G.W. Kenealey, Control Data Corp.
H. King, DIT MCO International
G. Kromholtz, Eldec Corp.
B. Leider, Magnavox Electronics
Systems
G.F. Love, Martin-Marietta Missile
Systems
B. Mahler, Ohmega Technologies,
Inc.
R. Maki,3M Co.
M. Marken, Texas Instruments, Inc.
J. Mc Donald, Rensselaer Polytechnic
Inst.
J. Mislak, Dept. of Defense
J. Mitchell, E.I. DuPont De Nemours
& Co.
R.B. Nami, Palomar Systems
L.J. Nielsen, Raytheon Co.
C.T. Ray, Fairchild
L. Razzetti, Westinghouse Electric
Corp.
M.A. Savrin, Kulicke & Soffa
Industries Inc.
D. Seck, DIT MCO International
J.P. Smigie
Lt. W. Stewart, Rome Air
Development Center
T. Suppelsa, Motorola Inc.
J.R. Thome, Motorola Inc.
J.S. Tucker, Unisys Corp.
F.W. Verdi, AT&T Bell Laboratories
W. Vitriol, Hughes Aircraft Co.
T.M. White, Boeing Electronics Co.
C.A. Willey, MSN-Products (PTY)
Ltd.
Dr. A. Wilson, Texas Instruments Inc.
G. Yau, Unisys Corp.
N.S. Yokoro, Hughes Aircraft Co.
E. Zimmerman, Boeing
Special Note of Appreciation
A special note of appreciation goes to
the following individuals who met
repeatedly to help develop this
document:
Tracy Merlin, Unisys
George Smith, Trace
Thomas Newton, Norplex/Oak
Les Hymes, GE
George Harman, National Bureau
of Standards
Dennis Fritz, Mac Dermid
Don Dinella, AT&T
Al Cafferty, NCR
Winston Veazey, TI
Richard Douglas, Douglas
& Associates
Robert Lomerson, General Dynamics
Richard Park Jr., Raytheon
December 1989 IPC-D-859
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