00197902-03_UM_X-Serie-S_EN.pdf - 第138页
3 Technical data and assemblies User manual SIPLACE X-Series 3.5 Placement head From software version 710.0 Edition 12/2016 138 3.5.3 SIPLACE SpeedSt ar C&P20 P for very high sp eed placement 3 Fig. 3.5 - 5 SIPLACE C…
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.5 Placement head
137
3.5.2.2 Technical data SIPLACE SpeedStar (C&P20 M)
3
SIPLACE SpeedStar (C&P20 M)
With component camera type
41
Component range
*a
03015 mmto 2220, Melf, SOT,
SOD, Bare-Die, Flip-Chip
Component spec.
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
4 mm
0.08 mm
0.03 mm
0.10 mm
0.05 mm
0.12 mm x 0.12 mm
6 mm x 6 mm
1 g
Programmable set-down force 1.5 - 4.5 N
Nozzle types 10xx, 11xx, 12xx
X/Y accuracy
*b
SIPLACE X4 S micron
Without "High Precision" option
With "High Precision" option
SIPLACE X4i S micron
± 25 µm/3σ
± 20 µm/3σ
± 25 µm/3σ
Angular accuracy
SIPLACE X4 S micron
SIPLACE X4i S micron
± 0.5° / 3σ
± 0.5° / 3σ
Illumination level 5
Possible illumination level settings 256
5
Standard functions Vacuum sensor, force measurement, PCB warpage check,
individual image of each component
Options Nozzle changer, special nozzles
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)b The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set out
in the SIPLACE scope of service and supply.
3 Technical data and assemblies User manual SIPLACE X-Series
3.5 Placement head From software version 710.0 Edition 12/2016
138
3.5.3 SIPLACE SpeedStar C&P20 P for very high speed placement
3
Fig. 3.5 - 5 SIPLACE C&P20 P - overview
(1) Compressed air connection for 20 Venturi nozzles in the pickup/placement and holding circuit
(2) "Vacuum sensor hold circuit" board
(3) Star motor
(4) Handle
(5) DP drive, 20 drives
(6) Star with 20 nozzles
(7) Pressure control valve
(8) Z motor (linear motor)
(9) Return cylinder
(5)
(1)
(7)
(2)
(3)
(4)
(6)
(8)
(9)
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 710.0 Edition 12/2016 3.5 Placement head
139
3.5.3.1 Description
The SIPLACE SpeedStar (C&P20) functions according to the Collect&Place principle, i.e. twenty
components are picked up by the placement head within a single cycle. At the pick-up and place-
ment position the component sensor checks that the component is present at the nozzle. On their
way to the placement position the components are optically centered and rotated into the required
placement angle. Finally forced air sets down the component gently and accurately on the board.
The C&P20 P head further enhances placement performance. The compact design of the C&P20
P head also facilitates very short cycle times. In this case, the star axis is at an angle to the PCB
level. This geometry allows the segments to be arranged in a very small space.
The component camera is still integrated into the C&P20 P head. This saves additional traveling
distances to external centering cameras. Each segment also has its own DP drive for rotating the
nozzle. The nozzles are therefore no longer rotated into the correct position at a single head sta-
tion. They can be rotated into their placement position at any time and independently of one an-
other.
Each segment has a separate vacuum generator. This greatly reduces the time taken to switch
between vacuum and air kiss. It also allows a vacuum check to be carried out in the holding circuit
for each individual nozzle.
The Z drive for the segments is implemented with a linear motor with linear path measuring sys-
tem, and is thus extremely precise. In the pick-up/placement position, the Z drive moves the seg-
ments up or down in the vertical direction.