FX-1R-FX-1动作说明书.pdf - 第4页

Ｒｅｖ 2.00 动作说明书 ii 3-6-4． θ 轴驱动速度·加速度·驱动时间 .......................................... 3-37 3-7. 芯片跳起检测 .................................................... ............ 3-39 3-7-1．概要 ......................................…

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动作说明书

1．电气装备部概要 ................................................................... 1-1

1-1．电气装备部的布局 ............................................................. 1-1

2．XY、Z、θ 轴的说明................................................................ 2-1

2-1．Y－大型轴（以下记载为 YB 轴） ................................................. 2-1

2-2．Y-TBL 轴（以下记载为 YA 轴） ................................................. 2-3

2-3．X 轴 .......................................................................... 2-4

2-4．Z、θ 轴 ...................................................................... 2-5

2-4-1．Z 轴 ...................................................................... 2-6

2-4-2．θ 轴 ..................................................................... 2-6

3．关于功能 ......................................................................... 3-1

3-1．起动时的各部 LED 显示 ......................................................... 3-1

3-1-1．控制装置 ................................................................. 3-1

3-1-2．马达驱动器 ............................................................... 3-2

3-1-3．其他 ..................................................................... 3-2

3-2．原点复位动作 ................................................................. 3-3

3-2-1．整体的原点复位 ........................................................... 3-3

3-2-2．θ 轴的原点复位 ........................................................... 3-4

3-2-3．Z 轴的原点复位 ............................................................ 3-4

3-2-4．XY 轴的原点复位 ........................................................... 3-6

3-2-5．支撑台的原点复位 ........................................................ 3-10

3-2-6．宽度调整马达的原点复位 .................................................. 3-11

3-3. 基板传送 .................................................................... 3-12

3-3-1．CENTER 马达 .............................................................. 3-13

3-3-2．支撑台 .................................................................. 3-14

3-3-3．基板传送时间曲线图 ...................................................... 3-15

3-3-4．传送异常错误 ............................................................ 3-16

3-4．吸嘴更换动作 ................................................................ 3-17

3-4-1．有 θ 修正时 ............................................................. 3-17

3-4-2．无 θ 修正时 ............................................................. 3-18

3-4-3．激光测定 ................................................................ 3-20

3-5．激光识别元件的贴装流程 ...................................................... 3-21

3-6．Zθ 轴动作 ................................................................... 3-22

3-6-1．Z 轴的速度区分 ........................................................... 3-22

3-6-2．Z 轴的动作行程 ........................................................... 3-23

3-6-3．Z 轴驱动速度、加速度、驱动时间 ........................................... 3-28

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动作说明书

3-6-4．θ 轴驱动速度·加速度·驱动时间 .......................................... 3-37

3-7. 芯片跳起检测 ................................................................ 3-39

3-7-1．概要 .................................................................... 3-39

3-7-2．判定方法 ................................................................ 3-39

3-8. 真空时间 .................................................................... 3-43

3-8-1．类别的分类 .............................................................. 3-43

3-8-2．吸附时的真空时间 ........................................................ 3-43

3-8-3．贴装时的真空时间 ........................................................ 3-45

3-8-4．废弃元件时的真空时间 .................................................... 3-48

3-9．激光识别动作 ................................................................ 3-51

3-9-1．測定 .................................................................... 3-51

3-9-2．SWEEP 测定时的参数设定 ................................................... 3-52

3-9-3．预供料姿势的决定 ........................................................ 3-56

3-10．供料器的驱动 ............................................................... 3-57

3-11．BOC 标记识别 ................................................................ 3-59

3-11-1．动作时间 ............................................................... 3-59

3-11-2．识别顺序 ............................................................... 3-60

3-11-3．指定标记的修正方法 ..................................................... 3-61

3-11-4．OCC（Offset Correction Camera）的说明 .................................. 3-64

3-12．坏标记检测 ................................................................. 3-67

3-12-1．坏标记检测 ............................................................. 3-67

3-12-2．全球坏标记检测 ......................................................... 3-68

4．人机部的说明 ..................................................................... 4-1

4-1．人机部的构成 ................................................................. 4-1

4-2．人机部的功能 ................................................................. 4-1

5．机器控制部的说明 ................................................................. 5-1

5-1-1．CPU 基板 .................................................................. 5-2

5-1-2．位置板 ................................................................... 5-4

5-1-3．母线桥基板 ............................................................... 5-4

5-1-4．MCM 基板 .................................................................. 5-4

5-1-5．SAFETY 基板、CONVEYOR 基板 ................................................ 5-5

5-1-6．BASE-FEEDER 基板、温度传感器基板 .......................................... 5-6

5-1-7．I/O 控制器基板 .......................................................... 5-9

5-1-8．贴装头主基板 ............................................................ 5-10

5-1-9．操作基板 ................................................................ 5-17

5-1-10． LIGHT CTRL 基板 ........................................................ 5-17

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动作说明书

iii

5-1-11．IP-X3 基板 .............................................................. 5-18

5-2．马达的控制方式 .............................................................. 5-19

5-2-1．XY 轴的控制方式 .......................................................... 5-19

5-2-2．Z、θ 轴的控制方式 ....................................................... 5-22

5-2-3．基板传送部的控制方式 .................................................... 5-23

6．故障处理 ......................................................................... 6-1

6-1．元件贴装 ..................................................................... 6-1