SIPLACE X-Series (SIPLACE X-Series S, from SC 708.1) Edition 05/2015 EN User manual.pdf - 第104页
2 Operational safety User manual SIPLACE X-Series 2.10 ESD guidelines From software version 708.1 Version 05/2015 104
User manual SIPLACE X-Series 2 Operational safety
From software version 708.1 Version 05/2015 2.10 ESD guidelines
103
2.10.3 Handling ESD modules
Do not touch electronic modules unless it is absolutely essential to do so in order to carry out other
work. If it is necessary, make sure that you do not touch the pins or printed conductors when you
pick up flat modules.
Do not touch components unless
you are constantly earthed by an ESD wrist strap or
you are wearing ESD shoes or ESD shoe earthing strips on an ESD floor.
Always discharge yourself before you touch an electronic module. To do this, simply touch a con-
ductive and earthed object immediately before you touch the module (such as unpainted parts of
a switch cabinet, a water pipe, etc.).
Do not allow modules with chargeable and highly insulating materials to touch one another, e.g.
plastic films, insulating table surfaces or items of clothing made from synthetic fibers.
Always place the modules on a conductive surface (table with an ESD coating, conductive ESD
foam, ESD bag or container).
Do not move the assemblies near to data view devices, monitors or television units. Keep a min-
imum distance of > 10 cm to monitors.
2.10.4 Measurements and modifications to ESD modules
Do not take measurements on the modules unless the following conditions are fulfilled:
– the measuring device is earthed (e.g. via PE conductors) or
– you discharge the measuring head just before taking measurements with a potential-free
measuring device (e.g. by touching an unpainted metal part of the controller casing).
Always use an earthed soldering iron if you carry out any soldering work.
2.10.5 Dispatching ESD modules
Always store modules and components in conductive packaging (e.g. metallized plastic bags
or metal sleeves) and dispatch them in conductive packaging.
If the packaging is not conductive, place the modules in a conductive envelope before pack-
aging. Use conductive expanded rubber, ESD bags, domestic aluminum foil or paper, for ex-
ample. NEVER use plastic bags or film. 2
If the module has integral batteries, ensure that the conductive packaging does not touch or
short-circuit the battery terminals and, if necessary, first cover the terminals with insulating
tape or material.
2 Operational safety User manual SIPLACE X-Series
2.10 ESD guidelines From software version 708.1 Version 05/2015
104
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 708.1 Version 05/2015 3.1 Performance data
105
3 Technical data and assemblies
3.1 Performance data
3.1.1 Definition of placement performance
The placement performance is influenced by the different head combinations and head positions,
plus the conveyor configurations. Individual options and customized applications also influence
the placement performance. On request, SIPLACE can calculate the actual performance of your
product on your machine configuration.
IPC value [components/h]
According to the vendor-neutral conditions of the IPC 9850 standard published by the Association
of Connecting Electronics Industries.
SIPLACE benchmark value [components/h]
The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds
to the conditions set out in the SIPLACE scope of service and supply.
Theoretical maximum output value [components/h]
The theoretical maximum output value is calculated from the most favorable conditions for each
machine type and setting, and corresponds to the theoretical conditions normally used in the in-
dustry.