SIPLACE X-Series (SIPLACE X-Series S, from SC 708.1) Edition 05/2015 EN User manual.pdf - 第148页
3 Technical data and assemblies User manual SIPLACE X-Series 3.5 Placement head From software version 708.1 Version 05/2015 148 3.5.7 SIPLACE T winSt ar for high precision IC placement 3 Fig. 3.5 - 13 SIPLACE T winStar f…
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 708.1 Version 05/2015 3.5 Placement head
147
3.5.6.9 Technical data for SIPLACE MultiStar (CPP)
3
SIPLACE MultiStar (CPP)
with component camera type
30
with component camera type
33 (stationary camera)
Component range
*a
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-spe-
cific standards, the component packaging tolerances and the component tolerances.
01005 mm to 27 mm x 27 mm 0402 to 50 mm x 40 mm
*b
*)b A diagonal of 69 mm is possible during multiple measurements (e.g. 64 mm x 10 mm).
Component spec.
Max height
*c
Max. height
*d
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*)c CPP head: in low installation position (stationary component camera not possible).
*)d CPP head: in high installation position
6.0 mm
8.5 mm
0.3 mm
0.15 mm
0.25 mm
*e
0.35 mm
*f
0.14 mm
e
0.20 mm
f
0.4mm x 0.2mm
27 mm x 27 mm
4 g
*)e For components < 18 mm x 18 mm
*)f For components ≥ 18 mm x18 mm
11.5 mm
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0mm x 0.5mm
50 mm x 40 mm
8 g
Programmable set-down
force
1.0 - 10 N 1.0 - 10 N
Nozzle types 20xx, 28xx 20xx, 28xx
X/Y accuracy
*g
*)g The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the
conditions set out in the SIPLACE scope of service and supply.
± 41 µm/3σ
± 55 µm/4σ
± 34 µm/3σ
± 45 µm/4σ
Angular accuracy
± 0.4° / 3σ
*h
, ± 0.5° / 3σ
*i
± 0.5° / 4σ
h
, ± 0.7° / 4σ
i
*)h Component dimensions between 6 mm x 6 mm and 27 mm x 27 mm.
*)i Component dimensions smaller than 6 mm x 6 mm.
± 0.2° / 3σ
± 0.3° / 4σ
Illumination level 5 6
Possible illumination
level settings
256
5
256
6
3 Technical data and assemblies User manual SIPLACE X-Series
3.5 Placement head From software version 708.1 Version 05/2015
148
3.5.7 SIPLACE TwinStar for high precision IC placement
3
Fig. 3.5 - 13 SIPLACE TwinStar for high precision IC placement
3
(1) Pick&Place module 1 (P&P1) - the TwinStar consists of 2 Pick&Place modules
(2) Pick&Place module 2 (P&P2)
(3) DP axis
(4) Z axis drive
(5) Incremental distance measuring system for the Z axis
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 708.1 Version 05/2015 3.5 Placement head
149
3.5.7.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The TwinStar is suitable for processing
complex and large components. Two components are picked up by the placement head, optically
centered on the way to the placement position and rotated into the necessary placement angle.
They are then placed gently and accurately onto the PCB with a controlled blast of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.