SIPLACE X-Series (SIPLACE X-Series S, from SC 708.1) Edition 05/2015 EN User manual.pdf - 第150页

3 Technical data and assemblies User manual SIPLACE X-Series 3.5 Placement head From software version 708.1 Version 05/2015 150 3.5.7.2 T echnical dat a T win St ar SIPLACE T winStar with compon ent camera typ e 33 (fine…

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User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 708.1 Version 05/2015 3.5 Placement head
149
3.5.7.1 Description
This sophisticated placement head consists of two placement heads of the same type coupled to-
gether. Both heads work using the Pick&Place principle. The TwinStar is suitable for processing
complex and large components. Two components are picked up by the placement head, optically
centered on the way to the placement position and rotated into the necessary placement angle.
They are then placed gently and accurately onto the PCB with a controlled blast of air.
New nozzles (type 5xx) have been developed for the TwinStar. With an adapter you can also use
the nozzles of type 4xx from the Pick&Place head and nozzles of type 8xx and 9xx from the Col-
lect&Place heads.
3 Technical data and assemblies User manual SIPLACE X-Series
3.5 Placement head From software version 708.1 Version 05/2015
150
3.5.7.2 Technical data Twin Star
SIPLACE TwinStar
with component camera type 33
(fine pitch camera)
with component camera type 25
(flip chip camera)
Component range
*a
0402 to SO, PLCC, QFP, BGA, special
components, bare dies, flip-chips
0201 to SO, PLCC, QFP, sockets, plugs, BGA,
special components, bare dies, flip-chips,
shields
Component specs
*b
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
*c
25 mm (higher available on request)
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
55 mm x 45 mm (single measurement)
For use with two nozzles (multiple mea-
surement)
50 mm x 50 mm or
69 mm x 10 mm
For use with one nozzle
85 mm x 85 mm or
125 mm x 10 mm
up to 200 mm x 125 mm (with restric-
tions)
100 g
25 mm (higher available on request)
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 mm x 0.3 mm
16 mm x 16 mm (single measurement)
55 mm x 55 mm (multiple measurement)
100 g
Programmable set-down
force
1.0 N - 15 N
2.0 N - 30 N
*d
1.0 N - 15 N
2.0 N - 30 N
d
Nozzle types
*e
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
gripper
Nozzle spacing for P&P
heads
70.8 mm 70.8 mm
X/Y accuracy
*f
± 26 µm / 3σ, ± 35 µm / 4σ ± 22 µm / 3σ, ± 30 µm / 4σ
Angular accuracy ± 0.05° / 3σ, ± 0.07°/ 4σ ± 0.05° / 3σ, ± 0.07° / 4σ
Illumination level 6 6
Possible illumination level
settings
256
6
256
6
*)a Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
*)b If the MultiStar and TwinStar are combined in the same placement area, the maximum component height may be restricted .
*)c If standard nozzles are used
*)d SIPLACE High-Force Head.
*)e Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
*)f The SIPLACE benchmark value is measured during the machine acceptance tests. It corresponds to the conditions set out in
the SIPLACE scope of service and supply.
User manual SIPLACE X-Series 3 Technical data and assemblies
From software version 708.1 Version 05/2015 3.6 Gantry system
151
3.6 Gantry system
3.6.1 Position of gantries in SIPLACE X4i S / X4i S micron
3
Fig. 3.6 - 1 Position of gantries - SIPLACE X4i S / X4i S micron
(1) Y axis, gantry 1 and gantry 4
(2) X axis, gantry 1
(3) X axis, gantry 2
(4) Y axis, gantry 3 and gantry 4 (concealed)
(5) X axis, gantry 3
(6) X axis, gantry 4
(T) Direction of PCB transport
(1)
(3)
(6)
(4)
(2)
(5)