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Document Feedback CMV12000 Soldering & Storage Information Datasheet • PUBLIC DS000603 • v6 - 00 • 2023 -Sep- 22 84 │ 82 Figure 103 : Solder Reflow Profile Graph 12.2 Storage Image sensors should be stored unde r the…

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CMV12000
Soldering & Storage Information
Datasheet • PUBLIC
DS000603 • v6-00 • 2023-Sep-22
84 │ 81
12 Soldering & Storage Information
12.1 Soldering
CMV12000 is not shipped in a moisture barrier package. When reflow soldering, a dry bake needs to
be performed upfront! The CMV12000 device has passed MSL3 testing. Figure 103 shows the
maximum recommended thermal profile for a reflow soldering system (following Standard J-STD-020).
If the temperature/time profile exceeds these recommendations, damage to the image sensor can
occur.
Attention
1. Image sensors with color filter arrays (CFA) and micro lenses are especially sensitive to high
temperatures. Prolonged heating at elevated temperatures may result in deterioration of the
optical performance of the sensor.
2. A socket (see 9.2) is the safest way to avoid any thermal stress. When not using a socket, to
avoid heating up the device we recommend to use manual hand soldering. Wave soldering
can be used with precautions (see below). Reflow soldering is not recommended.
Manual soldering: Use partial heating method and use a soldering iron with temperature control. The
soldering iron tip temperature is not to exceed 350 °C with a 270 °C maximum pin temperature. Touch
for a 2 seconds maximum duration per pin. Avoid touching and global heating of the ceramic package
during soldering. Failure to do so may alter device performance and reliability.
Wave soldering: Wave solder dipping can cause damage to the glass and harm the imaging capability
of the device. Avoid the solder to come in contact with the glass or ceramic body.

Document Feedback
CMV12000
Soldering & Storage Information
Datasheet • PUBLIC
DS000603 • v6-00 • 2023-Sep-22
84 │ 82
Figure 103:
Solder Reflow Profile Graph
12.2 Storage
Image sensors should be stored under the following conditions:
● Dust free
● Temperature between 20 °C and 40 °C
● Humidity between 30% and 60% RH
● Avoid radiation, electromagnetic fields, ESD and mechanical stress

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CMV12000
Revision Information
Datasheet • PUBLIC
DS000603 • v6-00 • 2023-Sep-22
84 │ 83
13 Revision Information
Document Status
Product Status
Definition
Product Preview
Pre-Development
Information in this datasheet is based on product ideas in the planning phase
of development. All specifications are design goals without any warranty and
are subject to change without notice
Preliminary Datasheet
Pre-Production
Information in this datasheet is based on products in the design, validation or
qualification phase of development. The performance and parameters shown
in this document are preliminary without any warranty and are subject to
change without notice
Datasheet
Production
Information in this datasheet is based on products in ramp-up to full production
or full production which conform to specifications in accordance with the terms
of ams-OSRAM AG standard warranty as given in the General Terms of Trade
Other definitions
Draft / Preliminary:
The draft / preliminary status of a document indicates that the content is still under internal review and subject to change without
notice. ams-OSRAM AG does not give any warranties as to the accuracy or completeness of information included in a draft /
preliminary version of a document and shall have no liability for the consequences of use of such information.
Short datasheet:
A short datasheet is intended for quick reference only, it is an extract from a full datasheet with the same product number(s) and
title. For detailed and full information always see the relevant full datasheet. In case of any inconsistency or conflict with the
short datasheet, the full datasheet shall prevail.
Changes from previous version to current revision v6-00
Page
Updated total frame time
39
● Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
● Correction of typographical errors is not explicitly mentioned.