M3plus_OperationManual_e.pdf - 第220页

B - 7 B Alignment T ype glossar y 2. Alignment T ype glossar y 2.1.1 Alignment Type definition The following explains the type and definition of "Alignment Type" settings classified for each "Alignment Gro…

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Alignment Type glossary

2. Alignment Type glossary

Component with leads protruding

from one direction.

Component with leads protruding

from two directions

and the number of leads diagonally

positioned is different.

Component with leads protruding

from two directions

and the numbers of lead diagonally

positioned is the same.

Component with leads protruding

from four directions

and the number of leads diagonally

positioned is the same.

Component with leads protruding

from four directions

and the number of leads diagonally

positioned is different.

Component with leads protruding

from one direction.

Oppositely positioned lead shapes

are the same

Oppositely positioned lead shapes

are different

Lead protrudes out from

molded body

Lead does not protrude out from

molded body

Lead protrudes out from

molded body

Lead does not protrude out from

molded body

Lead shape differs in

each direction

Number of leads is insufficient

Lead shapes are different in

one direction

Alignment type setting

Lead component, Nonstandard

Component type Alignment Type

Con-E

Mini-Tr/SOT

P-Tr/Con-NS

SOP

SOJ

QFP

PLCC

Con-NSEW

OffLead

Special

25004-5E-20

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Alignment Type glossary

2. Alignment Type glossary

2.1.1 Alignment Type definition

The following explains the type and definition of "Alignment Type" settings classified

for each "Alignment Group".

Alignment Group: Chip

• Std.Chip (Standard chip)

This setting does not identify the component, but detects the four corners of the component and then

calculates the center and angle of the component. Select this setting first when recognizing box type

chips. If the component cannot be recognized by this setting, try using "Sp.Chip" or "Small Chip".

• Melf Chip

This is specially for Melf chips.

• Bare Chip

This is specially for bare chips.

• Cylinder

This is suited for components with a cylindrical shape and no direction.

• Sp.Chip (Special chip)

This setting has a parameter used to recognize "Lead Width" in addition to the "Std.Chip" setting.

Select this to recognize box type chips which cannot be recognized correctly by the "Std.Chip"

setting. If it is still difficult to recognize the component by this setting, try with "Odd.2Ends".

• Small Chip

This is suited for small chip components such as 0603 whose light-reflecting area is smaller than the

actual size.

Alignment Group: IC

• Odd.2Ends

This mode has a parameter used for recognizing the lead width and length by using "LeadWidth" and

"ReflectLL." in addition to the "Std.Chip" mode. This mode is suited for recognizing box type chips

which cannot be recognized by "Std.Chip" or "Sp.Chip".

• Mini Tr/SOT

This mode is for mini mold components with the same shape leads in the N and S direction, but

whose number of leads in each direction is different.

• P-Tr

This mode is for components having leads in the N and S direction, and whose number of leads in

each direction is different like "Mini-Tr/SOT", and also the shape of opposing leads is different.

• SOP

This is for components having the same shape leads and same number of leads in the E and W

direction, and whose leads protrude out from the molded body.

• SOJ

This is for components having the same shape leads and same number of leads in the E and W

direction like "SOP", but whose leads do not protrude out from molded body.

• QFP

This is for components having the same shape leads in four directions of N, S, E and W, and the

same number of oppositely positioned leads (N to S and E to W), and whose lead protrudes out from

molded body.

• PLCC

This is for components having the same shape leads in four directions of N, S, E and W, and the

same number of oppositely positioned leads (N to S and E to W) like "QFP", but whose leads do not

protrude out from molded body.

• OffLead

This is used for components which can be defined by "Con-NSEW" but some of the leads are

removed. Input this setting for each direction.

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Alignment Type glossary

2. Alignment Type glossary

Alignment Group: Connector

• Con-E (Connector E)

This is for components having the same leads only in the E direction.

• Con-NSEW (Connector NSEW)

This setting is suited for components having leads in four directions of N, S, E and W, but the

number of leads and their shape in each direction are different. Only one type of lead shape can be

set for each direction.

• Odd.Con

Use this setting for connectors suitable for "Con-E" having off leads.

• Special

This can be used for components having irregularly arranged leads. For example, components having

leads in four directions of N, S, E and W like "Con-NSEW", but whose number of leads and the

shape in each direction are different. Although "Con-NSEW" allows setting only one type of lead

shape in each direction, "Special" allows setting two types, making it usable for various components

with irregular shapes. This setting cannot be used with the lead coplanarity function.

Alignment Group: Special

• Odd.Chip

This setting automatically determines whether to recognize a component as "white" or "black",

making it suited for components such as bare chips which are difficult to judge as reflective or non-

reflective against the background (PCB). This mode is also appropriate for BGA components with a

light reflective portion on the body.

• AsMark

This setting recognizes components as a mark and is therefore suited for specially shaped compo-

nents.

• Sp. Quad

This is used for square or rectangular components which reflect light at the four sides of the package

making it difficult to distinguish the leads from the package.

• Gravity

This detects the center-of-gravity of a target (black or white) in the specified area, allowing reliable

recognition of various components with irregular shapes. When using this setting, test-mount the

component after setting the data, and check the mounting shift (distance from center of mounting

position to center of the component). Then enter the shift amounts in "Cntr. Offset XYR" of the

Shape parameters.

• Ignore

This does not perform image processing.

Alignment Group: Ball

• Simple BGA

This is specially for BGA components. The number of ball leads can be checked, but the ball lead

positions and nicks are not checked.

• BGA

This is specially for BGA components. The ball lead positions can be edited to check the lead

positions and nicks.

• FlipChip

This is specially for flip chip components and can be used only when a vision camera with a side

lighting unit is used.