SM310 Programming Tutorial(Chi, Ver4).pdf - 第10页
Samsung Component Pla cer SM310 Pr ogramming T utorial 2.3. PCB Edit (1) .................. ........ ............ ........ ............ ................. ......... ..... 2-3 2.3.1. Board ( 板 ) .....................…
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本说明书的构成
本说明书的构成 .................................................................................................. 1
主目录 .................................................................................................. 1
前言 ................................................................................................... i
有关安全问题 .................................................................................................. ii
安全注意事項(Safety Precaution) ........................................................................iii
有关保障 ..................................................................................................iii
关于说明书 ..................................................................................................ix
第 1 章.
一般基板 Program(Chip专用) ................................................................ 1-1
1.1.
PCB Edit 概要及作业顺序...................................................................... 1-1
1.1.1.
PCB Edit Overview (概要).........................................................................1-1
1.1.2.
PCB Edit Procedure (作业顺序) ................................................................1-1
1.2.
File (创建新文件) – 步骤 1 (STEP 1)..................................................... 1-3
1.3.
PCB 编辑 (1) ........................................................................................1-4
1.3.1.
板 (Board) [F2] .........................................................................................1-4
1.3.2.
Part (工作元件登记) – 4 (STEP 4))................................................1-13
1.3.3.
Feeder (喂料器的登记)...........................................................................1-27
1.3.4.
Step (贴装信息登记) – 5 (STEP 5) .............................................1-28
1.3.5.
ANC Setting – 6 (STEP 6).............................................................1-29
1.3.6.
Optimizer Setup – 7 (STEP 7).......................................................1-31
1.4.
PCB Edit (2) ......................................................................................... 1-37
1.4.1.
Feeder的安装 – 8 (STEP 8) .........................................................1-37
1.4.2.
试拾取&元件识别 – 9 (STEP 9) ..................................................1-37
1.4.3.
检查Step Data(贴装信息) – 10 (STEP 10).....................................1-45
1.5.
Production (量产) .................................................................................1-46
第 2 章.
Array Board Program (Chip,异型)........................................................... 2-1
2.1.
PCB Edit 概要及作业顺序...................................................................... 2-1
2.1.1.
PCB Edit Overview (概要).........................................................................2-1
2.1.2.
PCB Edit Procedure (作业顺序) ................................................................2-1
2.2.
File (从现有PCB File中复制 – 只复制Part) – 步骤 1 (STEP 1) ............2-3
Samsung Component Placer SM310 Programming Tutorial
2.3.
PCB Edit (1) ......................................................................................... 2-3
2.3.1.
Board (板)................................................................................................ 2-3
2.3.2.
Part (工作元件登记) - 5 (STEP 5)................................................... 2-7
2.3.3.
Feeder (喂料器的登记) - 6 (STEP 6) ............................................ 2-19
2.3.4.
Step (贴装信息登记) – 7 (STEP 7) ............................................ 2-27
2.3.5.
ANC Setting – 8 (STEP 8)............................................................ 2-28
2.3.6.
Optimizer Setup - 9 (STEP 9)....................................................... 2-29
2.4.
PCB Edit (2) ........................................................................................ 2-29
2.4.1.
Feeder 的安装 – 10 (STEP 10) ................................................. 2-29
2.4.2.
拾取元件&元件识别 ................................................................................ 2-29
2.4.3.
检查Step Data(贴装信息) – 12 (STEP 12) .................................... 2-29
2.5.
Production (量产) – 步骤 13 (STEP 13) ............................................. 2-29
第 3 章.
ASCⅡ File及SSA Format形式的Import方法 ......................................... 3-1
3.1.
作业顺序 (Procedure) ........................................................................... 3-1
3.2.
File (从现有PCB File中复制 – 只复制Part)– 步骤 1(STEP 1) ............... 3-2
3.3.
PCB Edit (1) .......................................................................................... 3-2
3.3.1.
Board (板)................................................................................................. 3-2
3.3.2.
Step – 3(STEP 3) ........................................................................... 3-2
3.3.3.
Feeder (喂料器的登记) – 5(STEP 5) ............................................ 3-9
3.3.4.
ANC Setting – 6 (STEP 6).............................................................. 3-9
3.3.5.
Optimizer Setup - 7 (STEP 7)......................................................... 3-9
3.4.
PCB Edit (2) ........................................................................................ 3-10
3.4.1.
Feeder的安装 – 8 (STEP 8)......................................................... 3-10
3.4.2.
试拾取 &元件识别 – 9 (STEP 9) ................................................ 3-10
3.4.3.
检查Step Data(贴装信息) – 10 (STEP 10) .................................... 3-10
3.4.4.
量产(Production) .................................................................................... 3-10
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前言
i
非常感谢您购买.三星泰科株式会社生产的高速贴片机(以下称“设备”)。此设备的
工作原理是将部件从部件提供装置（如喂料器上）拾取,然后装贴在提供的 PCB
上。
此设备包括高速运行区,真空压力运行装置和高电压区。如果有关设备操作不正
确，有可能造成人员损伤或死亡。
操作人员包括软件编程人员、安装人员、基本系统硬件和附加装置（如喂料器的维
护及维修人员）。
使用本设备之前必须阅读本说明书，并且充分理解说明书的内容后再操作。
读完本说明书之后请妥善保管在您身边，以便随时查询疑问点。
未接受过有关本设备培训的人员禁止操作此设备。
另外，本公司还进行各种装备运用培训，详细事项请与本公司全球培训中心
咨询。
为确保设备安全操作和维护，操作人员必须清楚设备潜在的危险发生区域。更
多信息请参照 “ (Safety Precaution) (iii ) “。
如果操作人员在未经三星泰科株式会社事先同意的情况下改造设备，或没有按
照此应用说明书的方法维修设备，将有可能严重损伤设备安全。
绝不可以使用未经三星泰科株式会社承认的方法对设备进行改造或维修。
Samsung Techwin Co., Ltd.
Semi-conductor Systems business division
(http://www.samsung-smt.com)
STS Co., Ltd.
The Representative C/S Company
DongBang Rental B/D 3F, 333-1, Sangdaewon1-dong, Joongwon-gu, Sungnam-shi,
Gyeonggi-do, Republic of Korea (Post Code: 462-807)
Tel: +82-31-743-6500, 6732~4
Fax: +82-31-743-6784