PCBRM_User_Manual_R9.pdf - 第46页

PCBRM15 & PCBRM System 5. 2 User’s Manual Chapter 4: Process es & Appl icati ons Part No. 4005.00.906 4-4 Main Power Reset Switch Solder Flow Rate Control Hi/Low Flow Wel l Heater Adju st Flow Well Heater Box Spr…

PCBRM15 & PCBRM System 5.2 User’s Manual

Chapter 4: Processes & Applications

Part No. 4005.00.906 4-3

(B)

Solder Pot

Pump

Solder

1/2”

Solder

Level

Pump Housing

Pump Sleeve

Impeller

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4 Processes & Applications

4.1 Adding Solder

CAUTION:

USE INSULATED GLOVES WHEN WORKING AROUND HEATED AREA. BE CERTAIN THE MODE

SWITCH IS IN THE OFF POSITION (NEUTRAL POSITION.)

• Remove Pot Cover (A).

• Insert Baffle Assembly (B) into Pump.

• Power up system by depressing main power and reset switch on the PCBRM module.

• When the pot reaches 500°F (260°C), place solder bars into pot until solder level is reached.

• Using gloves provided, place pot cover back on pot once solder has melted.

• Power up preheater panels (for PCBRM Systems only).

PCBRM15 & PCBRM System 5.2 User’s Manual

Chapter 4: Processes & Applications

Part No. 4005.00.906 4-4

Main Power

Reset Switch

Solder Flow Rate Control

Hi/Low Flow Well Heater Adjust

Flow Well Heater Box

Spring Tabs

Screw

4.2 Flow Well Set-Up

• Push the Main Power and Reset Switches. Process temperature is factory set at 500˚F (adjust as

required).

• Using insulated gloves, push down on flow well and insure it is completely seated on pump. If

required, adjust Spring Tabs of well or tighten Clampable Shank (screw) as required to insure flow

well maintains firmly positioned on pump.

PCBRM15 & PCBRM System 5.2 User’s Manual

Chapter 4: Processes & Applications

Part No. 4005.00.906 4-5

Flow Well

Heater

Control Box

Note Routing

Of Heater Cable

• Connect flow well heaters to power, if applicable. Adjust heaters as required.

• Allow machine to reach and stabilize temperature—typically 45 minutes.

• After flow well has heat soaked for 15 minutes, set Solder Flow Rate Control to zero. Mode Switch

and Cycle Machine set to Continuous. Slowly increase Solder Flow Rate Control until solder fills the

flow well and starts flowing over the ends.

• Solder may solidify in flow well if not heat soaked. Do not increase flow rate. Allow flow well to

heat soak further.

• Select Mode Switch to Off position (center).