PCBRM_User_Manual_R9.pdf - 第60页

PCBRM15 & PCBRM System 5. 2 User’s Manual Chapter 4: Process es & Appl icati ons Part No. 4005.00.906 4- 18 9. Move PCB in the Y - Axis and align component/lead pattern over the flow well. Use the APS over arm an…

PCBRM15 & PCBRM System 5.2 User’s Manual

Chapter 4: Processes & Applications

Part No. 4005.00.906 4-17

Z-Axis

Positioning Knob

8. Raise Z-Axis using Z-Axis height adjustment wheel and adjust PCB to a height of 1/16” above the

flow well.

• For System 5.2, loosen Z-Axis lock knob and then tighten. The Z-Axis height is now set for

repetitive applications.

1/16”

PCBRM15 & PCBRM System 5.2 User’s Manual

Chapter 4: Processes & Applications

Part No. 4005.00.906 4-18

9. Move PCB in the Y-Axis and align component/lead pattern over the flow well. Use the APS over arm

and cleaning hood to locate, if so equipped. Lock the X-Axis carrier lock.

10. Adjust the Y-Axis stop to set position of PCB in the carrier arms.

• For System 5.2, move the right X-Axis lock to the left until hand stop against center bracket.

APS

Overarm

Cleaning

Hood

Flow

Well

Y-Axis PCB Stop

Center Bracket

X-Axis Lock

PCBRM15 & PCBRM System 5.2 User’s Manual

Chapter 4: Processes & Applications

Part No. 4005.00.906 4-19

X-Axis

Carrier Lock

Z-Axis

Adjustment Wheel

11. Remove PCB from carrier arms.

• For System 5.2, unlock X-Axis carrier lock.

12. Turn on machine and let temperature stabilize. Adjust temperature as required.

• For System 5.2 turn on preheater. Adjust temperature as required.

Note

ALWAYS HEAT SOAK FLOW WELLS FOR A MINIMUM OF 15 MINUTES BEFORE FLOWING SOLDER.

13. Set solder flow rate. Starting at zero, set mode switch to continuous.

14. Slowly increase flow rate until solder flows off the edge(s) of the flow well. Flow rate is now set for

that flow well. Different flow rate is required for different size flow wells.

Solder Flow