80S-2080F480F5.pdf - 第323页

SIPLACE 80S-20/F4/F5 User M anual 5 Vision Func tions 05/99 Issue from Software Vers ion SR.405.xx 5.6 Test Comp onent Line en gineer 5 - 91 Fig. 5.6.19 T est component menu, T est component video image With th e Return …

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5 Vision Functions SIPLACE 80S-20/F4/F5 User Manual
5.6 Test Component 05/99 Issue from Software Version SR.405.xx
5 - 90 Line engineer
5.6.4.3
Test Component
Option
NOTE
This option can only be activated if you have already loaded a package form number and a component has
been picked up.
With this option you can check the centering procedure. Every time measuring step has been carried out, the
procedure is stopped for you to check the function individually. The measurement results are displayed on the
screen but not saved.
Fig. 5.6.18
Test component
menu,
Test component
option
When this option is activated the following actions are started:
– The measurement procedure is activated.
– The video image appears on the screen.
– The header and footers are displayed.
SIPLACE 80S-20/F4/F5 User Manual 5 Vision Functions
05/99 Issue from Software Version SR.405.xx 5.6 Test Component
Line engineer 5 - 91
Fig. 5.6.19
Test component
menu,
Test component
video image
With the
Return
key you can call all defined individual steps in the measurement procedure one after the
other. Each time you press the
Return
key another measurement step is carried out and the results shown
on the screen.
Use
Esc
to quit the option. The video image closes and the
Test component
menu reappears.
GF No. = 5Test component
RET: Test component
5 Vision Functions SIPLACE 80S-20/F4/F5 User Manual
5.6 Test Component 05/99 Issue from Software Version SR.405.xx
5 - 92 Line engineer
5.6.4.4
Measure Component
Option
NOTE
This option can only be activated if you have already loaded a package form number and a component has
been picked up.
Fig. 5.6.20
Test component
menu,
Measure component
option
When this option is activated the following actions are started:
– The video image appears on the screen.
– The measurement command is given, using the predefined parameters.
– The MVS performs each component-specific measurement step in turn.
– The measurement values are displayed in the video image.
In addition, to conventional components with lead connections the 80F
4
or 80F
5
machines can also optically
center BGAs (B
all Grid Arrays) and flip-chips. The body of BGA and flip-chip components is made of passi-
vated silicon chips. Such bodies have strong reflective properties and their surfaces are wavy. The connec-
tions of these components take the form of balls with a diameter of at least 80 µm. Ball-grid arrays have their
connections, as the name suggests, arranged in the form of a grid - this means that they can be described in
terms of rows and columns.