Tracker-2800-2800S.pdf - 第74页

74 SECTION 5 T ESTING INTEGR A TED CIRCUITS 5-1. DIGITAL INTEGRAT ED CIRCUITS Digital integrated circuit (IC) chips are made from transis tors on a common substrate. Their analo g signatures are typicall y variations of …

6. Place the red test probe to the SCR's anode lead and the black test probe to the SCR's cathode lead.

7. Observe the SCR's anode-gate signature.

Gate-Anode Gate-Cathode Anode-Cathode

Figure 4-31. Signatures of a SCR - C106B Type at 20V and 10K.

8. Connect the Tracker 2800 DC Voltage Source to the Gate. Increase the DC Voltage Source level

while observing the anode-cathode signature.

Figure 4-32. Testing a SCR using the DC Voltage Source

Review

Solid state photosensitive switch components are turned on by light.

SCRs and TRIACs are solid state switches that are turned on by a control input pin called a gate. SCRs

conduct current in one direction while TRIACs conduct current in both directions.

Applications

The SCR and TRIAC can also be a problem to troubleshoot. They may be used to switch large

currents. Quite often these components are susceptible to degradation and eventual failure. The Tracker

can easily show these failure.

Using the arrows buttons to

increase/decrease the DC voltage level

SECTION 5 TESTING INTEGRATED CIRCUITS

5-1. DIGITAL INTEGRATED CIRCUITS

Digital integrated circuit (IC) chips are made from transistors on a common substrate. Their analog

signatures are typically variations of the discrete diode and transistor signatures. Most logic ICs,

contain multiple circuits in one chip. These chips can have pins from 14 to over 200, although quite

often many pins share quite similar signatures. This can make troubleshooting easier by giving us an

easy-to-find signature to use as a comparison. In this section, it is important to understand how the

Tracker 2800 and ASA respond to these circuits.

Integrated Circuit Failures

A functioning IC may stop working for a number of reasons. Some of the most common causes of IC

failures are:

 EOS - Electrical Over Stress. The IC’s maximum electrical specifications have been exceeded. This

condition may result in the IC developing internal shorts and opens.

 ESD - Electrostatic Discharge. Repeated exposure may cause internal resistance to develop in the

IC junctions. This internal resistance may vary from 5 k to 25 k with a typical value of 20 k. ESD

exposure can cause internal flaws such as resistance, opens and shorts.

 Dendrites - A process flaw, that results in particles growing between conductors on a substrate

causing shorts.

 Ionic - Contamination introduced at the time of manufacturing that contamination develops into

leakage between substrate channels. This causes 5 k to 25 k of resistance.

 Purple Plague - Destructive interaction between gold and aluminum metal layers. Junction

connections become very brittle and may cause internal opens.

 Corrosion or Electromigration - Another process flaw in which aluminum metallization causes

pinholes, corrosion and resistance. This will create opens and resistance.

Digital Integrated Circuits

Before we examine the analog signatures of an IC, let's study the block diagram of a 74LS245 octal bi-

directional bus buffer to introduce some basic concepts. This IC is a member of the low power

Schottky transistor-transistor logic family (LSTTL). Examine the block diagram for this chip below.

You will see that there are only four different kinds of circuits on this chip.

Figure 5-1. Digital IC 74LS245 Block Diagram.

 Circuit 1 - Pins 2 through 9 and 11 through 18 are all the same function. Each pin is connected to

both an input and an output of a buffer.

 Circuit 2 - Pins 1 and 19, although they have different names, are both enables and are inputs to

AND gates.

 Circuit 3 - Power supply ground input, pin 10.

 Circuit 4 - Power supply V

input, pin 20.

Each circuit type will produce a different analog signature. Because there are only four types of circuits

on the chip, there will be only four unique analog signatures when out of circuit.

Signatures of a Digital IC

Do the following to display the analog signatures of a digital IC (out of circuit):

1. Select the 5V, 10K, 200Hz Range.

2. Place or clip the black test lead from the Tracker 2800's Common jack to the IC's ground pin. For

this example, the ground pin of the 74LS245 is pin 10.

3. Use the red test lead from the Tracker 2800's Channel A jack. Probe each pin of the IC and view its

signature on Tracker 2800's signature display. For this example, pins 2 to 9 and 11 to 18 are all

buffer circuits so they will have identical signatures. (Note: This is only for ICs out of circuit.)