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User Manual SIPLAC E F5/F5 HM 6 Vision functions Software version SR.407.xx 01/2001 US Edition 6.3 Component vision systems 243 6.3.2.2 T echnical dat a for the st andard component vision modul e on the 6-segment Collect…
6 Vision functions User Manual SIPLACE F5/F5 HM
6.3 Component vision systems Software version SR.407.xx 01/2001 US Edition
242
6.3.1.3 Functional description
A segment of the 12-segment Collect&Place head picks up a component at star station 1. As the
star advances, further components are picked up. Once a component reaches star station 7,
where the component vision system is located, three offset rows of LEDs evenly illuminate the
component with infrared light. The lens maps components up to 5mm high in sharp focus onto the
camera’s CCD chip. 6
The digital image of the component generated by the camera is then transferred to the vision anal-
ysis unit, where the HALE digital image processing method is used to compare the component
image with a synthetic model previously created in the GF (package form) editor. The parameters
thus obtained provide information on deviations in position, the rotational angle, lead condition,
and component reidentification. The HALE method has proved to be highly resistant to disruptive
factors such as unwanted reflection, different reflection behavior of leads, diffused light, etc, and
it is faster and more accurate than the matching method.Once the measurement is complete, the
segment advances to star station 9, and rotates the component into the correct orientation for
placement. Finally, the component is placed in the correct position on the PCB at star station 1.6
6.3.2 Component vision module on the 6-segment Collect&Place head
6.3.2.1 System description
The 6-segment Collect&Place head has its own component position recognition system in star
station 4 (see Fig. 6.1 - 3
). The vision analysis unit for PCB and component position recognition
is located in the control unit (see Fig. 6.1 - 7
). 6
The optical component position recognition system consists of a CCD camera with deflector, im-
age lens, and LED illumination system. In the standard component vision system, the usable field
of view of the CCD camera (SONY XC75 camera) measures 39 mm x 39 mm, compared to
15.7 mm x 15.7 mm on the vision system for flip-chips. For position recognition, and for the lead
test, the component is evenly illuminated by the rows of LEDs using the front lighting method, and
is projected onto the CCD chip in sharp focus by the lens. The position, rotational angle, and lead
condition parameters are determined using the h
igh-accuracy lead extraction (HALE) method of
digital image processing. 6
The vision analysis unit (MVS) was described in section 6.1.6
, page, since it performs both PCB
and component evaluation functions.
User Manual SIPLACE F5/F5 HM 6 Vision functions
Software version SR.407.xx 01/2001 US Edition 6.3 Component vision systems
243
6.3.2.2 Technical data for the standard component vision module
on the 6-segment Collect&Place head
Camera type: SONY XC75
Number of pixels: 484 x 484
Field of view: 39 mm x 39 mm
Illumination method: Front lighting (infrared light),
2 (flat and steep) LED levels
Image processing: HALE gray scale method
(H
igh Accuracy Lead Extraction)
Screen: RGB monitor (VGA mode), 640 x 484 pixels
Component sizes: 0.75 mm x 0.75 mm … 32 mm x 32 mm
Range of recognizable components: 0603 to 32 mm x 32 mm
PLCC SO, QFP, TSOP, SOT, MELF, CHIP, ICS, BGA
Minimum lead pitch: 0.5 mm
Minimum ball diameter for BGAs: 400 µm
6.3.2.3 Technical data for the vision module for flip-chips, bare dies,
and standard components on the 6-segment Collect&Place head (DCA option)
Camera type: SONY XC75CE
Number of pixels: 570 x 570
Field of view: 15.7mm x 15.7mm
Illumination method: Front lighting (infrared light), 4 LED levels
(even, flat, medium and steep)
Image processing: HALE gray scale method
(H
igh Accuracy Lead Extraction)
Screen: RGB monitor (VGA mode), 640 x 484 pixels
Component sizes: 0.25 mm x 0.5 mm … 13 mm x 13 mm
Range of recognizable components: flip-chips, bare dies and components up to 13mm x
13mm
Minimum lead pitch: 0.2mm
Minimum ball diameter: 110 µm
6.3.2.4 Functional description
A segment of the 6-segment Collect&Place head picks up a component at star station 1. As the
star advances, further components are picked up. Once a component reaches star station 4,
where the component vision system is located, two offset rows of LEDs evenly illuminate the
component with infrared light. The lens maps components up to 8.25 mm high in sharp focus
onto the camera’s CCD chip.
The digital image of the component generated by the camera is then transferred to the vision
analysis unit, where the HALE digital image processing method is used to compare the compo-
nent image with a synthetic model previously created in the GF (package form) editor. The
6 Vision functions User Manual SIPLACE F5/F5 HM
6.3 Component vision systems Software version SR.407.xx 01/2001 US Edition
244
parameters thus obtained provide information on deviations in position, the rotational angle, lead
condition, and component reidentification. The HALE method has proved to be highly resistant to
disruptive factors such as unwanted reflection, different reflection behavior of leads, diffused
light, etc, and it is faster and more accurate than the matching method. Once the measurement is
complete, the segment advances to star station 9, and rotates the component into the correct ori-
entation for placement. Finally, the component is placed in the correct position on the PCB at star
station 1.
6.3.3 Component camera module for the Pick&Place head
6.3.3.1 System description
Component vision module for the Pick&Place head: fine-pitch vision module 6
All the optical components of the system 6
– CCD camera (SONY XC77 camera)
– lens
– optical strip filter for suppressing unwanted reflections
are located in a dust-tight housing. The field of view of the CCD camera measures 38 mm x
38 mm. For position recognition, and for the lead test, the component is illuminated by three LED
levels using the front lighting method, and is projected onto the CCD chip in sharp focus by the
lens. The position, rotational angle, and lead condition parameters are determined for fine-pitch
components and BGAs (Ball Grid Arrays) using digital image processing methods. 6
Component vision module for the Pick&Place head: flip-chip vision module 6
All the optical components of the system, such as the 6
– CCD camera (SONY XC75C camera)
– lens
are located in a dust-tight housing. The field of view of the CCD camera measures 12.2 mm x
9.2 mm. For position recognition and for the ball test, the flip-chips are illuminated by two LED lev-
els using the front lighting method, and are projected onto the CCD chip in sharp focus by the lens.
The position, rotational angle parameters, and the number and position of the balls are determined
using digital image processing methods. 6
The vision analysis unit is described in section 6.1.6
, from page 230. 6