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User Manual SIPLAC E F5/F5 HM 6 Vision functions Software version SR.407.xx 01/2001 US Edition 6.7 Guidelines for Describing Pack age Forms 375 6.7.8.3 Settings for Illuminat ing St andard Component s The standar d range…
6 Vision functions User Manual SIPLACE F5/F5 HM
6.7 Guidelines for Describing Package Forms Software version SR.407.xx 01/2001 US Edition
374
Flat illumination level 6
The flat illumination level is used for illuminating BGAs, µBGAs, flip-chips, J-lead components
(PLCC), Melfs and components with convex-type leads. It tends to emphasize body and lead
edges. It is, however, less suitable for displaying bright component bodies and ceramic compo-
nents. 6
Steep illumination level 6
The main application for the steep illumination level is for reflective leads, ceramic components
and bright component bodies. It is less suitable for reflective component bodies, flip-chips or
µBGAs. 6
NOTE 6
Most components will require a combination of these illumination levels to achieve optimum illu-
mination. Using one illumination level will only be successful in exceptional cases.
6.7.8.2 Pseudo Color Representation
The pseudo color representation provides a powerful and objective assessment of the illumina-
tion, by representing a brightness value in a color. 6
A contrast of at least 4 color scales between the lead and body is required for a measurement. In
the ‘Illumination’ menu of the package form manipulator, components are displayed in the pseudo
color representation on the station computer monitor. 6
Color scale Brightness
white light
yellow
orange
red
brown
green
light blue
blue
violet
black dark
User Manual SIPLACE F5/F5 HM 6 Vision functions
Software version SR.407.xx 01/2001 US Edition 6.7 Guidelines for Describing Package Forms
375
6.7.8.3 Settings for Illuminating Standard Components
The standard range of components includes chips (0603 to 2220), tantalum capacitors, Melf com-
ponents, PLCCs, QFPs, SOs, SOJs, TSOPs, ICs, power components, flip-chips, µBGAs and
BGAs. 6
For the components which are listed below the GF interpreter in the station computer uses the
default illumination parameters listed in Fig. 6.7 - 11
: 6
– Chips (0603 to 2220)
– Tantalum capacitors (component bodies, non-reflective)
– Melf
– PLCC, QFP, SO, SOJ, TSOP, ICs, power ICs
– Flip-chips, µBGAs, BGAs
6
The odd-shaped components include 6
– power transistors
– plug connectors
– PLCC sockets
– quartz crystals
It is not generally necessary to modify the illumination parameters for different components. 6
6 Vision functions User Manual SIPLACE F5/F5 HM
6.7 Guidelines for Describing Package Forms Software version SR.407.xx 01/2001 US Edition
376
Fig. 6.7 - 11 Illumination parameters for components on the 6-segment C&P head camera (32x32)
Do not use for reflective components.
Use negative ball contrast when mapping the ball.
The description must only contain the innermost row of balls. Use negative contrast.
It must be possible to insert the components. The test must be carried out for each type.
The edge of the large cooling surface is extremely irregular on some types on account of the production methods used.
If you are unsure, do not use it for the measurement
Up to PLCC 52 base. Make sure that you are using the correct nozzle.
Describe as for a BGA, if necessary.
Describe as for an FDC. Measuring mode: size+ lead
Chip
IC
Melf
BGA
J-Lead
PLCC
BGA
BGA
0603
Gullwing
SO, SOT,
TSOP
QFP
,
PLCC-
TBGA
TBGA
ca. 180
255
1
8
6
2
7
5
3
4
6
1
2
3
4
5
7
8
150
255
flat:
steep:
150
200
flat:
steep:
120
150
flat:
steep:
255
40
flat:
steep:
200
120
flat:
steep:
255
130
flat:
steep:
150
150
flat:
steep:
70
140
flat:
steep:
0
255
flat:
steep:
200
0
flat:
steep:
200
0
flat:
steep:
0
150-200
flat:
steep:
0-30
150-200
flat:
steep:
255
150
flat:
steep:
0
150-200
flat:
steep:
200
120-180
Diagram for adjusting the illumination of components
Tantalum
capacitor
Ceramic
Plastic
0805 and
larger
General
Special components
Power
transistor
socket
Plug
Quartz
reflect. body
dull
If necessary,
use the LUT
below
Reflect.
body
Contrast
graduation