00198711-01_UM_X-Serie-S_EN.pdf - 第19页

Instruction manual SIPLACE X-Series S 1 Introduction From software version 713.0 Edition 11/201 9 1.2 Placement machine description 19 1.2 Placement machine description 1.2.1 SIPLACE X4i S 1 Fig. 1.2 - 1 SIPLACE X4i S pl…

1 Introduction Instruction manual SIPLACE X-Series S

1.1 Important notes on the instruction manual From software version 713.0 Edition 11/2019

C&P20 P2 Collect&Place head with 20 segments, SIPLACE SpeedStar for top placement

performance

CPP Collect&Pick&Place head, SIPLACE MultiStar CPP

DCA Direct chip attach

DC Dual conveyor

EDIF Energy and data interface

ESD Electrostatically-sensitive group of components

EMC Electromagnetic compatibility

ESD Electrostatic sensitive device

SC Single conveyor

FC Flip chip

WT Waffle pack tray

WTC Waffle pack tray carrier

GCU Gantry control unit

GND Ground

I-Placement Independent placement

JTF JEDEC Tray Feeder

LBO Long Board Option

PCB Printed circuit board

MCS Machine capability study

MHCU Head control unit

MTC Matrix tray changer

P&P Pick&Place

P&P1 Pick&Place module 1

P&P2 Pick&Place module 2

NC Nozzle changer

SMD Surface mounted device

SC Station computer

TH Twin Pick&Place head, SIPLACE TwinStar

VS Vision system

WPC Waffle pack changer

Instruction manual SIPLACE X-Series S 1 Introduction

From software version 713.0 Edition 11/2019 1.2 Placement machine description

1.2 Placement machine description

1.2.1 SIPLACE X4i S

Fig. 1.2 - 1 SIPLACE X4i S placement machine

The SIPLACE X4i S placement machine is distinguished by

– High precision,

– Intelligent placement optimization,

– Intelligent configuration strategies,

– Placement performance up to the high end process range

1 Introduction Instruction manual SIPLACE X-Series S

1.2 Placement machine description From software version 713.0 Edition 11/2019

Three placement methods are possible for processing the components:

– Collect&Place,

– Pick&Place and

– A combination of Collect&Place and Pick&Place (mixed mode).

The SIPLACE X4i S placement machine has four gantries. The two gantries in placement area 1

and the two gantries in placement area 2 point inwards.

These can be quickly and accurately positioned by linear motors, moving independently of one

another in the X and Y directions.

The SIPLACE X4i S placement machine has two placement areas, one single conveyor or one

dual conveyor. Two boards can be placed at the same time on dual conveyors.

There are four locations available for supplying components. These can be fitted with component

trolleys and configured with up to 40 tracks. At locations 2/3 or 1/4, the table positions for the rel-

evant placement area can be configured on the innermost or outermost position.

1.2.1.1 Overview of placement head configuration

CPP_H = SIPLACE Multistar CPP in high assembly position

CPP_L = SIPLACE Multistar CPP in low assembly position

Placement area 1 Placement area 2

C&P20 P / C&P20 P C&P20 P / C&P20 P

C&P20 P / C&P20 P CPP_L/CPP_L

C&P20 P / C&P20 P TH / TH

C&P20 P / C&P20 P CPP_H/TH

C&P20 P2 / C&P20 P2 C&P20 P2/C&P20 P2

C&P20 P2 / C&P20 P2 CPP_L/CPP_L

C&P20 P2 / C&P20 P2 TH / TH

C&P20 P2 / C&P20 P2 CPP_H/TH

CPP_L/CPP_L CPP_L/CPP_L

CPP_L/CPP_L CPP_H/TH

CPP_L/CPP_L TH / TH