00198371-01_UM_SWS-EN.pdf - 第116页

6 Options User manual SIPLACE Wafer System (SWS) 6.3 SWS wafer stretcher (expander) Edition 04/2018 116 6.3.4 Setting the stretchi ng height mechanically The stretching height can be me chan ically set at the SWS wafer s…

User manual SIPLACE Wafer System (SWS) 6 Options

Edition 04/2018 6.3 SWS wafer stretcher (expander)

115

6.3.3 Description

While picking dies from a wafer, there is a danger that the die could begin to tilt. This can be

caused by an irregular adhesion of the die on the foil or an eccentric positioning of the needle. In

the case of dies which are positioned closely to one another, the neighboring die could be touched

and mutual damage can not be ruled out.

To prevent this, the wafer foil is stretched before the die is picked. This increases the distances

between the dies on the foil and makes it possible to pick dies without risks. The larger distances

between the dies also makes it easier for the Vision system to recognize them.

After the downholder plate has moved up and the clamp has been opened, the wafer foil sags. A

wafer with a sagging foil can not be moved back into the magazine.

Once the clamp and the downholder plate have been opened, the stretched wafer foil is warmed

up by the heater module. This shrinks the wafer foil (sag less than 9 mm) so that it can be moved

back into the magazine.

Fig. 6.3 - 3 SWS wafer stretcher (expander) with stretched wafer foil

(1) Stretched wafer foil in the SWS wafer stretcher (expander)

6 Options User manual SIPLACE Wafer System (SWS)

6.3 SWS wafer stretcher (expander) Edition 04/2018

116

6.3.4 Setting the stretching height mechanically

The stretching height can be mechanically set at the SWS wafer stretcher (expander) in four

steps. The relevant settings must be performed at six different points.

6.3.4.1 Preparations

 Close all current processes on the SWS module.

 Move the wafer table into the changeover position.

 Select Manual operations -> Wafer handling systems -> Go to change position.

 Open the clamp.

 Select Manual operations -> Wafer handling systems ->Open wafer clamp.

– The clamp will open and the expansion ring will move downwards.

 Open the expander

 Select Manual operations -> Wafer handling systems ->Release stretcher.

– The downholder plate will move upwards.

 Select Settings -> Shut down machine.

SWS GUI and Linux are shut down properly. 6

 Switch off the SWS at the main switch.

CAUTION

Avoid damage to the gripper

The gripper could be damaged while you are working on the wafer support.

 Push the gripper in the direction of the wafer lift and out of the wafer support working

area.

User manual SIPLACE Wafer System (SWS) 6 Options

Edition 04/2018 6.3 SWS wafer stretcher (expander)

117

6.3.4.2 Settings

Fig. 6.3 - 4 SWS wafer stretcher (expander) - setting the stretching height

 Loosen the screw (2) at all four points (1).

 Push the screw (2) to the position for the required stretching height (2, 4, 6, or 8 mm).

 Tighten the screw (2).

 At both points (3), turn the screw to the position for the required stretching height (2, 4, 6, or

8 mm).