00198371-01_UM_SWS-EN.pdf - 第90页
4 Setting up and commissioning User m anual SIPLACE Wafer System (SWS) 4.2 Infrastructure at the installation location Edition 04/2018 90
User manual SIPLACE Wafer System (SWS) 4 Setting up and commissioning
Edition 04/2018 4.2 Infrastructure at the installation location
89
4.2.4 Removing the transport locks
– Remove all adhesive tape and cable ties which were attached as transportation locks to the
various components:
– Reject bin is fixed with gray adhesive tape
– Wafer table for X axis is fixed with cable ties
– Wafer table for Y axis is fixed with cable ties
– Gripper is fixed with cable ties
– Flip unit is fixed with cable ties
– Wafer changer feed axis (if present)
4.2.5 Removing the corrosion protection from the guide rails
Check whether the SWS has been treated with corrosion protection agent. This must be removed
before setting up the SWS.
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4.2.6 Power supply
After performing final adjustment, connect the SWS to the power supply.
CAUTION
Reduced product life of bearings and guide rails!
If the corrosion protection agent is mixed with the bearing grease on the axes this can
greatly reduce the service life of the bearings and guide rails.
You should therefore remove the corrosion protection from all the axes and bearings
when you traverse the machine axes for the first time during commissioning.
Grease all the axes and bearings with the grease described in the maintenance in-
structions.
CAUTION
Risk of damaging bearing grease!
Alcohol will damage the bearing grease in the guide carriages.
When cleaning the guide rails and scales, make sure that alcohol does not get into
the guide trolley.
4 Setting up and commissioning User manual SIPLACE Wafer System (SWS)
4.2 Infrastructure at the installation location Edition 04/2018
90
User manual SIPLACE Wafer System (SWS) 5 SWS tasks
Edition 04/2018 5.1 Filling the magazine
91
5 SWS tasks
This chapter contains a number of subjects that are intended to help you during your daily work
on a SIPLACE line. For example, you are provided with preventative measures that you can take
to minimize the down time on the machine to obtain the highest possible level of efficiency for the
SIPLACE line during production.
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5.1 Filling the magazine
Refill the magazine with the wafer frames so that the centering notches of the wafers frames
point to the opening of the magazine.
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PLEASE NOTE
Correct usage with qualified personnel
Incorrect usage poses a risk to life and limb and a risk of damage to equipment.
Only appropriately qualified personnel may put the machine into operation, operate
it or perform work to the SIPLACE Wafer System. You will find further information
about this in section 1.1.5
, page 14.
Evidence of these qualifications must be obtained in training or instructions of per-
sonnel. These instructions must be given by personnel trained and authorized by SI-
PLACE. For an overview of the training courses, refer to section 1.3
, page 29.
PLEASE NOTE
When using frame adapters for 5, 4 or 7 inch wafers, make sure that you only use
every second slot.