00198371-01_UM_SWS-EN.pdf - 第60页
2 Operational safety User manual SIPLACE Wafer System (SWS) 2.9 ESD guidelines Edition 04/2018 60 2.9 ESD guidelines 2.9.1 What does ESD mean? Almost all of the modules in use today are equipp ed with highly in tegrated …
User manual SIPLACE Wafer System (SWS) 2 Operational safety
Edition 04/2018 2.8 Locking the SIPLACE Wafer System and attaching warning labels
59
2.8.4 Responsibility and obligations
– It shall be the responsibility of the maintenance and service personnel to make sure this pro-
cedure is adhered to.
– It shall be the responsibility of the maintenance and service personnel’s immediate supervisor
to instruct his personnel on this procedure.
– The safety officer is responsible for managing the locking and tagging procedures for the ma-
chine.
2.8.5 Training
– The safety regulations require training for every individual. Of course, not every employee is
exposed to the same degree of danger or is involved with LO/TO as others are. So extensive
training is not necessary for everyone.
– To determine how much training to provide for each worker, the employees are divided into
three groups. Each group has its own level of training.
– Authorized employees.
– These workers actually install the locks and tags and do the preventive maintenance or
service work. So they must know the most about controlled energy. First, they must be
able to recognize all energy sources and measure the amount of energy. Authorized em-
ployees must look for energy sources out of the realm of the obvious. These energy
sources include electrical, mechanical, hydraulic, pneumatic, chemical, thermal and
gravitational. Once these workers can recognize all energy sources they must be taught
how to isolate, control, and release the energy without any risk.
– Affected employees
– These are workers who operate the machinery or equipment that may be de-energized.
Other employees who may be affected include those who work in an area that contain
equipment that may be locked/tagged out. These employees have to be instructed about
the nature of the energy control program. They must know why lock/tag out is important,
what tags and locks look like and why they must not remove tags or locks.
– All others
– As the name implies, any employee who is not affected or authorized fits into this cate-
gory. There employees include office personal, managers, and upper management. Al-
though they do not have a direct relationship to the machinery being locked or tagged,
they have to receive some training.
2 Operational safety User manual SIPLACE Wafer System (SWS)
2.9 ESD guidelines Edition 04/2018
60
2.9 ESD guidelines
2.9.1 What does ESD mean?
Almost all of the modules in use today are equipped with highly integrated MOS blocks and com-
ponents. The manufacturing techniques used mean that these electronic components are ex-
tremely sensitive to overvoltage and thus to electrostatic discharge.
The abbreviation for such modules is 'ESD' (Electrostatic Sensitive Device). ’ESD’ is used inter-
nationally. The following symbol on cabinet typeplates, racks or packaging indicates that compo-
nents which are sensitive to electrostatic discharge have been used and that the modules
concerned are also touch-sensitive.
ESDs can be destroyed by voltages and power levels that are far below the level
that can be perceived by humans. Such voltages occur if a person touches a com-
ponent or module without earthing themselves. Components that are exposed to
such overvoltages do not generally appear to be defective immediately - incorrect
behavior starts after the component or module has been in operation for some time.
2.9.2 Important measures to protect against static charging
Most plastics can easily become charged and must therefore be kept away from at-risk com-
ponents.
Always ensure that people, the workplace and packaging are safely earthed when handling
electrostatic sensitive components.
User manual SIPLACE Wafer System (SWS) 3 Technical data and assemblies
Edition 04/2018 3.1 Technical data - SWS
61
3 Technical data and assemblies
3.1 Technical data - SWS
3
Technical data Flip chip Die attach
Minimum die thickness (silicium) - without com-
ponent sensor
50 µm 50 µm
Minimum die thickness (silicium) - with compo-
nent sensor
100 µm 100 µm
Minimum bump size 50 µm n/a
Minimum bump grid 100 µm n/a
SIPLACE Wafer System SWS Horizontal system, automatic wafer change, MCM
SWS wafer size 4" to 12"
4" / 6" with adapter on request
Wafer frame 12“/8“
6" on request
4" with adapter
Wafer frame:Maximum height 12": 8.1 mm
8": 7.6 mm
6": 5.8 mm
Wafer magazine
*a
Up to 12"
Die Ejection System Programmable ejection speed (synchronous and asynchronous)
Option: Linear Dipping Unit LDU Freely programmable speed
Flux viscosity 3,000 to 100,000 cPs
Accuracy of flux height ± 5 µm
*)a Depending on the wafer magazine, you may need to mechanically adjust the base plate for the wafer magazines.