00198371-01_UM_SWS-EN.pdf - 第23页
User manual SIPLACE Wafer System (SWS) 1 Introduction Edition 04/2018 1.2 Description of functions 23 1.2.4 Pickup & transfer process in de t ail (example of die attach process) 1.2.4.1 Flip chip segment 1 (pickup pr…
1 Introduction User manual SIPLACE Wafer System (SWS)
1.2 Description of functions Edition 04/2018
22
Fig. 1.2 - 5 Ejection process - piercing (basic principle)
1.2.3.5 Pickup process
During the pickup process, the die is transferred to the tool or to the nozzle of the flip unit. The flip
unit transfers the die on it either to the placement head (flip chip process) or to the die attach unit
(die attach process).
The die attach unit rotates the die again and then presents it to the placement head.
The following equipment is required for this step:
Flip unit
Die attach unit (optional)
1
Ejection needle
Vacuum cap
Ejection system - piercing needles
Active component - ready for pickup
Wafer foil
The wafer foil is sucked up by vacuum
at the vacuum cap
User manual SIPLACE Wafer System (SWS) 1 Introduction
Edition 04/2018 1.2 Description of functions
23
1.2.4 Pickup & transfer process in detail (example of die attach process)
1.2.4.1 Flip chip segment 1 (pickup process)
1
Fig. 1.2 - 6 Flip chip segment 1 - pickup process to transfer position (basic principle)
(1) The wafer X-Y travels to the next chip.
(2) The flip chip rotary unit segment 1 turns to the handover position "Die Attach".
(3) Image recognition of the next chip is performed from the camera "free" position.
Wafer
Camera
(2)
(3)
(1)
1 Introduction User manual SIPLACE Wafer System (SWS)
1.2 Description of functions Edition 04/2018
24
1.2.4.2 Flip chip segment 1 (transfer process)
1
Fig. 1.2 - 7 Flip chip segment 1 - transfer process (basic principle)
(1) The flipper transfer X axis of the flip chip swivel part segment 1 is moved to the transfer po-
sition.
(1)