00198371-01_UM_SWS-EN.pdf - 第77页
User manual SIPLACE Wafer System (SWS) 3 Technical data and assemblies Edition 04/2018 3.4 Description of the SWS modules 77 3 3.4.7 W afer changer system The wafer changer system consists of the magazine lif t and the w…
3 Technical data and assemblies User manual SIPLACE Wafer System (SWS)
3.4 Description of the SWS modules Edition 04/2018
76
3.4.6 Ejector tool
3
Fig. 3.4 - 7 Ejector tool
(1) Vacuum cap
(2) Guidance head for accommodating ejection needles
The die ejector is used to release the die from the wafer foil. It consists of the Z axis and the ejector
tool.
The ejector tool is positioned on the Z axis, fixed with prisms and held with magnets.
The wafer foil is picked up by vacuum suction at the vacuum cap, the needle system moves up
and releases the die from the wafer foil. The die can now be taken up by the nozzle of the flip unit.
The needle configuration of the ejector tool needs to be adjusted to the size of the die and can
therefore be configured to suit requirements.
The ejector tool can be equipped with 2 different needle types:
– Non-piercing needles
These cause the wafer foil to curve upwards and so release the die. The wafer foil is not
pierced in this case, so that the components are not touched by the needles.
– Piercing needles
These pierce the foil and lift the die directly off the foil.
1
2
User manual SIPLACE Wafer System (SWS) 3 Technical data and assemblies
Edition 04/2018 3.4 Description of the SWS modules
77
3
3.4.7 Wafer changer system
The wafer changer system consists of the magazine lift and the wafer changer with gripper.
The wafer changer system is needed to ensure a fully automatic production with the SWS. The
operator is only needed for refilling the magazine lift with new wafer magazines.
The wafers are provided in a wafer magazine. The wafer magazine is placed by the user into the
wafer magazine lift. The magazine lift lifts the wafer magazine into the appropriate height so that
the corresponding wafer is in handover position. In this position the wafer changer can take the
wafer out of the magazine and push it back in after the wafer has been processed.
The wafer changer consists primarily of the gripper unit and the guidance rails. The gripper unit
takes up the wafer and moves it to the position currently required.
PLEASE NOTE
No automatic ejector tool changeover
In this first version there is no automatic ejection tool changer available.
The SWS can therefore only continuously process dies which can be released using the
same ejector tool.
3 Technical data and assemblies User manual SIPLACE Wafer System (SWS)
3.4 Description of the SWS modules Edition 04/2018
78
3
Fig. 3.4 - 8 Wafer changer system
(1) Wafer changer with gripper
(2) Magazine lift
1
2