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1 Introduction User manual SIPLACE Wafer System (SWS) 1.2 Description of functions Edition 04/2018 18 1.2.3 Basic die present ation process The basic die presenta tion process supported by the SWS can be divid ed into 3 …

User manual SIPLACE Wafer System (SWS) 1 Introduction

Edition 04/2018 1.2 Description of functions

1.2.2 Basic SWS Functions

The main die handling components are the wafer table, the magazine lift, the ejection system, the

flip unit and the control unit with corresponding SWS software.

The wafer with the relevant die is loaded from the magazine and fixed onto the wafer table. The

wafer table places the die using the ejector system, which releases the die from the wafer foil, and

transfers it to the flip unit.

The flip unit then processes this using two different functions:

– The flip unit rotates the die by 180° and makes this available for pickup by the placement

head.

or 1

– The flip unit transfers it to the die attach unit. The placement head approaches this and the

die is placed on the board in the same position as it was on the wafer.

The SIPLACE CA4 V2 uses a high precision SIPLACE placement head which has been specifi-

cally selected for maximum accuracy and fulfillment of all requirements in normal and restricted

conditions (see "Scope of delivery and services" for details of restrictions).

The following options are available to support the whole spectrum of process-oriented functions:

– Linear dipping unit

– Die attach unit

– Barcode scanner

– Wafer stretcher

– Inspection camera

PLEASE NOTE

All movable positioning axes in the SWS are servo axes!

1 Introduction User manual SIPLACE Wafer System (SWS)

1.2 Description of functions Edition 04/2018

1.2.3 Basic die presentation process

The basic die presentation process supported by the SWS can be divided into 3 main steps:

– Die recognition and positioning for ejection (inc. inkspot recognition)

– Ejection process

– Die attach or flip chip process.

Fig. 1.2 - 1 Basic die presentation process (basic principle)

There are two main ways to process dies:

– Flip chip process

– Die attach process

User manual SIPLACE Wafer System (SWS) 1 Introduction

Edition 04/2018 1.2 Description of functions

1.2.3.1 Flip chip process

The flip chip process is the standard method for SWS. The die is rotated by 180° before placement

(face down placement).

Fig. 1.2 - 2 Flip chip process (basic principle)

The flip chip process steps are:

– Step 1: Die release

– Step 2: The die is rotated by 180° and is passed on to the placement head. Parallel to this,

the next die is taken up by the second nozzle of the flip unit.