00198371-01_UM_SWS-EN.pdf - 第63页
User manual SIPLACE Wafer System (SWS) 3 Technical data and assemblies Edition 04/2018 3.2 Ambient conditions and connection values 63 3.2.4 Compressed air specification 3 3.2.5 Dimensions and weight 3 Compressed air sup…
3 Technical data and assemblies User manual SIPLACE Wafer System (SWS)
3.2 Ambient conditions and connection values Edition 04/2018
62
3.2 Ambient conditions and connection values
3.2.1 Ambient conditions for packaging, transportation and storage
3
3.2.2 Environmental conditions for operation
3
3.2.3 Electrical ratings and energy consumption
3
3
Temperature range Between -25°C and 55°C
Atmospheric humidity Up to 95%
Ambient pressure Up to 1.700 m height without pressure equalization
Room temperature Between 15°C and 35°C
Atmospheric humidity 30% to 75%
(on average not higher than 45%, so that there is no risk of
condensation on the machine.)
Ambient pressure > 750 mbar (corresponds to 2500 m above mean sea level)
PLEASE NOTE
Use of a residual current protection device
The low ground leakage current of the system makes it possible to use an upstream
residual current protection device at the customer end. This must be all-current sen-
sitive (RCD type B).
Electrical ratings
Supply voltage Fuse
Mains power supply 3 x 380 V~ to 3 x 415 V~ ± 10 %; 50/60 Hz
3 x 200 V~ to 3 x 230 V~ ± 10 %; 50/60 Hz
*a
3 x 16A characteristic C
3 x 16A characteristic C
*b
Mains power con-
nection
Cable 4 x 2.5 mm² with CEKON connector (3 x 380 V~ to 3 x 415 V~)
Cable 4 x 2.5 mm² (3 x 200 V~ to 3 x 230 V)
Energy consumption
With heater Without heater
Nominal apparent power 2.8 kVA 0.8 kVA
Nominal active power 2.6 kW 0.6 kW
*)a With options package
*)b e.g. Siemens circuit breakers in accordance with IEC and UL 489 (order no.: 5SJ4 316-7HG42)
or
EATON Industries circuit breaker FAZ-C16/3-NA 16A 3p (UL 489, CSA C22.2 no. 5, IEC 60947-2)
User manual SIPLACE Wafer System (SWS) 3 Technical data and assemblies
Edition 04/2018 3.2 Ambient conditions and connection values
63
3.2.4 Compressed air specification
3
3.2.5 Dimensions and weight
3
Compressed air supply
Compressed air pressure values
p
min
p
max
0.5 MPa = 5.0 bar
1.0 MPa = 10 bar
Operating pressure 0.48 MPa ± 0.025 MPa (4.8 bar ± 0.25 bar)
Compressed air connection Plastic hose PUN 6 to SIPLACE CA4 V2.
Compressed air specification
Particle size 0.1 µm
Particle density 0.1 mg/m³
Maximum oil content (class 1) Particle density 0.01 mg/m³
Pressure dewpoint (class 4) Dewpoint + 3°
Length 1650 mm
Width 650 mm
Height of SWS
With open sliding door
1479 mm
1940 mm at PCB conveyor height 930 mm (default)
1910 mm at PCB conveyor height 900 mm (option)
1960 mm at PCB conveyor height 950 mm (SMEMA)
Weight
Without magazine 350 kg
3 Technical data and assemblies User manual SIPLACE Wafer System (SWS)
3.2 Ambient conditions and connection values Edition 04/2018
64
3.2.5.1 Overview of dimensions
3
Fig. 3.2 - 1 Overview of measurements - SIPLACE Wafer System
(1) 1650 mm
(2) 650 mm
(3) 1479 mm
(4) 510 mm