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<Ignore Center
Offset>
The Center Offset means that if a part was picked up at a point deviated from
the center of the part by a certain distance, it will be dumped regardless of
the part search result.
Therefore, if this function is selected for chip part, the Center Offset is
not checked when performing vision check.
That is, it means that the part will not be placed according to the search
result. If this function is not selected, the machine will dump the part when
it is picked up with its pickup point being deviated from the center by more
than 20% compared to the size of the part.
The reason to dump the part is that if it is picked up with the pickup point
being greatly deviated from the part center, the placement accuracy decreases
because the extent of the part movement becomes great according to the
corrected value after correction.
This is applied only to Chip-rect, Chip-tantal, Chip-Aluminum, Melf, etc.
<MFOV Type> Setup the type of multi-recognition. This function is activated only when
‘Fix1 Cam ~ Fix2 Cam’ is selected in the <Camera No.> combo box.
Selectable types are as follows
- None : Does not use multi-recognition type.
- Cross 2P : Performs multi-recognition of the two diagonal edges.
- Cross 4P : Performs multi-recognition of four edges.
- Linear H : Performs multi-recognition horizontally in two parts.
- Linear V : Performs multi-recognition vertically in two parts.
<MFOV Length> Input the moving distance for multi-recognition
<EX Param> Indicates the dialog box used to set up details related to recognition. In the
case of the general part, the recognition related details do not need to be
set. This is applied only to SOP, SOP2, SOJ, SOJ2, QFP, PLCC, UserIC, BGA,
Flip-Chip.
<Moveˇ>
Used for parts recognition test by manually picking up parts.
<Test>
Tests component recognition by using the set align data
<Image Capture>
Helps to specify the optimum lighting value.
<Auto Teach>
Automatically finds out the component align data. If Auto Teach is successfully performed,
following dialog box is displayed
* Auto Teach is supported only for CHIP-Rect, TR, TR2,BGA, SOP, SOP2, SOJ,
SOJ2, QFP, PLCC and FLIPCHI.
<Make Image> Displays the component shape recognized by the MMI through the SMVision window
by assembling the split images after performing split recognition of the
component.
Connection Items
Align Vision CHIP, Align Vision CHIP-Rect, Align Vision CHIP Melf, Align Vision CHIP TR, Align Vision CHIP
Trimmer, Align Vision SOP, Align Vision SOJ, Align Vision SOP2, Align Vision SOJ2, Align Vision QFP, Align
Vision User IC, Align Vision BGA, Align Vision FLIPCHIP
SM400 User's Manual
共同Align Data (Common Align Data)
寿Align Data
<相机号>
选择识别部品的摄象机。可选择的摄象机如下。
1~12: 1~ 6Head
1: 1(1)
2: 2(2)
<Light Control>
设定识别部品用摄象机的照明度。按下此按钮时,显示以下画面
<<>>
设定排列尺寸。
<对准 Z 高度>
+
<门槛> .SMVision 0~255
‘Threshold Value’
<自动>
<>
<误差 H[+]>
识别部品时,以百分比设定允许上误差。
<误差 L[-]>
识别部品时,以百分比设定允许下误差。
<区域补偿>
, AreaMargin ‘0
AreaMargin ‘0
AreaMargin
0~6
<重复角度>