KE-3010A_动作说明书.pdf - 第4页
动作说明书 3-6 芯片跳起检测 ..................................................................................................... 3-34 3-6-1 概要 .......................................................................................…
动作说明书
目 录
1 电气部分简略 ......................................................................................... 1-1
1-1 电气部的布局 ....................................................................................................... 1-1
2 各驱动轴（X，Y，Z，θ 轴）的说明 ...................................................... 2-1
2-1 Y 轴 ..................................................................................................................... 2-1
2-1-1 组成 ................................................................................................................................. 2-1
2-1-2 性能 ................................................................................................................................. 2-2
2-1-3 故障检测（外部编码器的断线检测） .............................................................................. 2-2
2-2 X 轴 ..................................................................................................................... 2-3
2-2-1 组成 ................................................................................................................................. 2-3
2-2-2 性能 ................................................................................................................................. 2-3
2-2-3 故障检测（外部编码器的断线检测） .............................................................................. 2-3
2-3 贴装元件用的贴装头轴（Z，θ 轴） ..................................................................... 2-4
2-3-1 LNC60 轴 ........................................................................................................................ 2-4
2-3-2 IC 贴装头轴 ..................................................................................................................... 2-6
3 关于各项功能 ......................................................................................... 3-1
3-1 原点复归动作 ....................................................................................................... 3-1
3-1-1 X，Y，Z，θ 轴 ................................................................................................................ 3-1
3-1-2 支撑台原点复归动作 ....................................................................................................... 3-4
3-2 基板传送 .............................................................................................................. 3-5
3-2-1 传送电动机 ...................................................................................................................... 3-6
3-2-2 支撑台 ............................................................................................................................. 3-7
3-2-3 基板夹紧时的程序 ........................................................................................................... 3-9
3-2-4 基板传送同步时间图 ..................................................................................................... 3-10
3-3 吸嘴更换动作 ..................................................................................................... 3-12
3-3-1 有 θ 修正时 .................................................................................................................... 3-12
3-3-2 无 θ 修正时 .................................................................................................................... 3-13
3-3-3 激光测定 ....................................................................................................................... 3-14
3-4 激光识别、VCS 识别元件的贴装流程 ................................................................ 3-15
3-4-1 激光识别元件的贴装流程 .............................................................................................. 3-15
3-4-2 VCS 识别元件的贴装流程 ............................................................................................. 3-16
3-5 Zθ 轴动作 .......................................................................................................... 3-17
3-5-1 Z 轴的速度分类 ............................................................................................................. 3-17
3-5-2 Z 轴的动作行程 ............................................................................................................. 3-19
3-5-3 Z 轴的速度比，加速度比 ............................................................................................... 3-28
3-5-4 θ 轴的速度比，加速度比 ............................................................................................... 3-32
动作说明书
3-6 芯片跳起检测 ..................................................................................................... 3-34
3-6-1 概要 ............................................................................................................................... 3-34
3-6-2 判定方法 ....................................................................................................................... 3-34
3-7 真空同步时间 ..................................................................................................... 3-37
3-7-1 元件类别的分类 ............................................................................................................. 3-37
3-7-2 吸附时的真空同步时间 .................................................................................................. 3-37
3-7-3 贴装时的真空同步时间 .................................................................................................. 3-38
3-7-4 向废弃箱之外废弃元件时的真空同步时间 ..................................................................... 3-39
3-7-5 向废弃箱废弃元件时的真空同步时间 ............................................................................ 3-40
3-8 激光识别动作 ..................................................................................................... 3-41
3-8-1 LNC60 ........................................................................................................................... 3-41
3-8-2 FMLA ............................................................................................................................ 3-44
3-9 激光识别异常 ..................................................................................................... 3-49
3-10 送料器的驱动 ..................................................................................................... 3-52
3-11 VCS 识别动作 .................................................................................................... 3-56
3-11-1 部元件图像识别，贴装动作时间曲线 ............................................................................ 3-57
3-12 S-VCS 识别动作 ................................................................................................ 3-58
3-12-1 部元件图像识别，贴装动作时间曲线 ............................................................................ 3-58
3-12-2 照明动作说明 ................................................................................................................ 3-59
3-12-3 各照明装置的最大电流值 .............................................................................................. 3-62
3-12-4 元件分类的照明默认值 .................................................................................................. 3-63
3-12-5 大型视觉元件识别样子的控制 ....................................................................................... 3-64
3-12-6 大型视觉元件高度控制 .................................................................................................. 3-65
3-12-7 大型视觉元件和已贴装元件的元件高度限制 .................................................................. 3-67
3-12-8 实效元件外形尺寸 ......................................................................................................... 3-68
3-12-9 分割识别控制 ................................................................................................................ 3-69
3-12-10 分割识别时的分割间隔 .................................................................................................. 3-70
3-12-11 动态分割识别 ................................................................................................................ 3-70
3-12-12 分割识别时的方式 ......................................................................................................... 3-71
3-13 BOC 标识识别 ................................................................................................... 3-72
3-13-1 动作时间 ....................................................................................................................... 3-72
3-13-2 识别顺序 ....................................................................................................................... 3-72
3-13-3 指定标记的修正方法 ..................................................................................................... 3-73
3-13-4 OCC（Offset Correction Camera）的说明 ................................................................... 3-76
3-14 坏标记检测 ........................................................................................................ 3-78
3-14-1 坏标记检测 .................................................................................................................... 3-78
3-15 共面测定 ............................................................................................................ 3-79
3-15-1 共面测定方法 ................................................................................................................ 3-79
动作说明书
3-15-2 共面测定时的 XY 轴动作 ............................................................................................... 3-80
3-15-3 共面测定可能的元件外形尺寸 ....................................................................................... 3-80
3-15-4 共面分割测定动作 ......................................................................................................... 3-81
3-15-5 测定模式的变换 ............................................................................................................. 3-81
3-15-6 共面测定方式的不同 ..................................................................................................... 3-81
3-15-7 共线测定方式 ................................................................................................................ 3-82
4 人机部的说明 ......................................................................................... 4-1
4-1 人机部的构成 ....................................................................................................... 4-1
4-2 人机部的功能 ....................................................................................................... 4-1
5 机器控制部的说明 .................................................................................. 5-1
5-1 各基板的功能 ....................................................................................................... 5-2
5-1-1 CPU 基板 ........................................................................................................................ 5-2
5-1-2 POSITION 控制板 ........................................................................................................... 5-4
5-1-3 IEEE1394A 板 ................................................................................................................. 5-4
5-1-4 ETHERMAIN 基板 ........................................................................................................... 5-4
5-1-5 ETHERSLAVE 基板 ........................................................................................................ 5-4
5-1-6 XY RELAY 基板 .............................................................................................................. 5-4
5-1-7 BASE I/O 基板 ................................................................................................................ 5-5
5-1-8 FEEDER 基板 ................................................................................................................. 5-5
5-1-9 HEAD MAIN 基板 ............................................................................................................ 5-5
5-1-10 温度传感器基板 ............................................................................................................... 5-5
5-1-11 操作基板 ......................................................................................................................... 5-6
5-1-12 IP-X7 基板 ....................................................................................................................... 5-6
5-1-13 LIGHT CTRL 基板 ........................................................................................................... 5-6
5-1-14 SCM3 基板 ...................................................................................................................... 5-6
5-2 马达的控制方式 ................................................................................................... 5-7
5-2-1 XY 轴的控制方式 ............................................................................................................. 5-7
5-2-2 Z，θ 轴的控制方式 .......................................................................................................... 5-8
5-2-3 基板传送部的控制方式 .................................................................................................... 5-9
6 故障处理 ................................................................................................ 6-1
6-1 元件贴装 .............................................................................................................. 6-1