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DEUKYX 193-6100 Inhalt-3 Inhalt Seite 2.4 (D01) Control Data .................................................................... 2-99 „SIGMA-G5SII Series“ Registerblattes ............................................. 2-…
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(B01_08) Comp. Graphic additional display .................................... 2-26
(B01_09) Lead Data ........................................................................ 2-27
(B01_10) Lead Type ........................................................................ 2-30
(B01_11) Group ............................................................................... 2-36
(B01_12) Corner Data ..................................................................... 2-44
(B01_13) Edge Data ........................................................................ 2-49
(B01_14) Electrical Contact Data .................................................... 2-52
(B01_15) Elctd Type Data ............................................................... 2-55
(B01_16) Electrode Group Data ...................................................... 2-56
(B01_17) Shape Data ...................................................................... 2-61
(B01_18) Type ................................................................................. 2-61
(B01_19) Group ............................................................................... 2-62
(B01_20) Comp.Graphic Data (Grasche Bauteildaten) ................. 2-64
2.3 (C01) Recognition Data ............................................................ 2-68
(C01_01) Lighting system ................................................................ 2-68
(C01_02) Recognition data set ........................................................ 2-69
(C01_03) Recognition level ............................................................. 2-70
(C01_04) Front/Back ltg recog algo ................................................. 2-74
(C01_05) Detection Method ............................................................ 2-77
(C01_06) Detection preprocessing .................................................. 2-77
(C01_07) Abnormal judgement in lead angle detection .................. 2-77
(C01_08) Detection Window ............................................................ 2-78
(C01_09) All the balls detection ....................................................... 2-78
(C01_10) Ball existence detection method ...................................... 2-78
(C01_11) Lighting pattern ................................................................ 2-79
(C01_12) Image capture method ..................................................... 2-81
(C01_13) FOV specication ............................................................ 2-81
(C01_14) Mold size tolerance set .................................................... 2-82
(C01_15) Outward length detn / Outward length tol [mm] ............... 2-83
(C01_16) Lead width detn / Lead width tol [mm] ............................. 2-84
(C01_17) Lead posn (Latl dir) detn / Lead posn (Latl dir) tol [mm] .. 2-85
(C01_18) Lead Posn (Long dir) detn / Lead posn (Long dir) tol [mm] . 2-86
(C01_19) ElektdPos erkenn / ElektdPos Toler. [mm] ....................... 2-87
(C01_20) Electd size detn / Electd size tol [mm] ............................. 2-87
(C01_21) Polarity detn ..................................................................... 2-88
(C01_22) Reverse Check ................................................................ 2-95
(C01_23) Lighting method ............................................................... 2-98
(C01_24) Extended lighting ............................................................. 2-98
(C01_25) Shape pos detn / Shape pos tol [mm] ............................. 2-98
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2.4 (D01) Control Data .................................................................... 2-99
„SIGMA-G5SII Series“ Registerblattes ............................................. 2-99
(D01_01) Selected nozzle #1 .......................................................... 2-99
(D01_02) Selected nozzle #22 ...................................................... 2-106
(D01_03) Selected nozzle #3 ........................................................ 2-106
„SIGMA Series Common“ Registerblattes ...................................... 2-107
(D01_04) Control Mode ................................................................. 2-107
(D01_05) Cmpnt pos correction X, Y [mm] .................................... 2-107
(D01_06) Pick-up pos correction X, Y [mm] .................................. 2-108
(D01_07) Auto fdr axis adjustment X, Y ........................................ 2-108
(D01_08) Error process 1 .............................................................. 2-109
(D01_09) Error process 2 .............................................................. 2-110
(D01_10) Vertical cmpnt data [mm] ............................................... 2-111
(D01_11) Pick-up level [mm] ......................................................... 2-112
(D01_12) Placement level [mm] .................................................... 2-113
(D01_13) Focus adjustment .......................................................... 2-114
(D01_14) Tape feed dclr [%] .......................................................... 2-114
(D01_15) Collection after interlock ................................................ 2-114
(D01_16) Rejected cmpnt disch pos ............................................. 2-114
(D01_17) Placement height feedback ........................................... 2-115
(D01_18) Cmpnt thickness check [mm] ......................................... 2-115
(D01_19) Capture mode ................................................................ 2-115
(D01_20) Pressure insert operation .............................................. 2-116
(D01_21) Pick-up loading limit ....................................................... 2-116
(D01_22) Splicing supply ............................................................... 2-116
(D01_23) Pick-up difference detn X, Y, und Angle ......................... 2-117
(D01_26) Layer No. ....................................................................... 2-117
(D01_27) Placement offset specication ....................................... 2-118
(D01_28) Component pushing operation ...................................... 2-119
(D01_29) Comp Drop detection ..................................................... 2-120
(D01_30) Tape pocket position detection ...................................... 2-120
2.5 (E01) Carrier Data .................................................................. 2-121
(E01_01) Carrier Data ................................................................... 2-121
(E01_02) Tape end detection ........................................................ 2-125
(E01_03) Magnetic Type ............................................................... 2-125
(E01_04) Teaching motion ............................................................ 2-125
(E01_05) Tray data........................................................................ 2-126
(E01_06) Stick data ....................................................................... 2-128
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2.6 (F01) Placeable Data .............................................................. 2-129
(F01_01) Machine Name .............................................................. 2-129
Kapitel 3 Standardbezeichnungen für Component Library
1. Benennungsregeln für Component Library ........................................... 3-1
2. Benennungsregeln für eine benutzerdenierte
Component Library ............................................................................. 3-1
3. Benennungsregeln für Standard-Component Library .............................. 3-2
3.1 Allgemeine Bauteile (ohne ICs) .................................................. 3-2
3.1.1 Bauteilname, Bauteilgröße, Bauteildicke, Hersteller-Nr.,
Anzahl der Anschlüsse ...................................................... 3-2
3.1.2 Serien-Nr. .......................................................................... 3-6
3.1.3 Herstellerabkürzung .......................................................... 3-7
3.1.4 Gehäusespezikationen .................................................... 3-8
3.2 ICs ............................................................................................ 3-12
3.2.1 Bauteilname und Anschlussanzahl .................................. 3-12
3.2.2 Serien-Nr. ........................................................................ 3-13
3.2.3 Herstellerabkürzung ........................................................ 3-13
3.2.4 Gehäusespezikationen .................................................. 3-14
Kapitel 4 Erstellen einer neuen Component Library
1. Schritte für die Datenerstellung ............................................................ 4-1
2. Bestimmung der Bauteilform ................................................................ 4-3
2.1 Schritte zur Bestimmung ............................................................. 4-3
2.2 Typische Beispiele für die einzelnen Bauteile ............................. 4-7
3. Vermessen des Bauteils ....................................................................... 4-9
3.1 Nicht bedrahtete Bauteile ........................................................... 4-9
3.1.1 Zylindrische Bauteile ......................................................... 4-9
3.1.2 Rechteckige Bauteile ....................................................... 4-11
3.1.3 Komplexe Bauteile ........................................................... 4-13
3.2 Area-Array-Bauteile .................................................................. 4-16
3.2.1 BGA / CSP ....................................................................... 4-16