DEUKYX-193-6100_G5S2_VOL6.pdf - 第13页
DEUKYX 193-6100 Inhalt-4 Inhalt Seite 2.6 (F01) Placeable Data .............................................................. 2-129 (F01_01) Machine Name .............................................................. 2-1…
DEUKYX
193-6100
Inhalt-3
Inhalt
Seite
2.4 (D01) Control Data .................................................................... 2-99
„SIGMA-G5SII Series“ Registerblattes ............................................. 2-99
(D01_01) Selected nozzle #1 .......................................................... 2-99
(D01_02) Selected nozzle #22 ...................................................... 2-106
(D01_03) Selected nozzle #3 ........................................................ 2-106
„SIGMA Series Common“ Registerblattes ...................................... 2-107
(D01_04) Control Mode ................................................................. 2-107
(D01_05) Cmpnt pos correction X, Y [mm] .................................... 2-107
(D01_06) Pick-up pos correction X, Y [mm] .................................. 2-108
(D01_07) Auto fdr axis adjustment X, Y ........................................ 2-108
(D01_08) Error process 1 .............................................................. 2-109
(D01_09) Error process 2 .............................................................. 2-110
(D01_10) Vertical cmpnt data [mm] ............................................... 2-111
(D01_11) Pick-up level [mm] ......................................................... 2-112
(D01_12) Placement level [mm] .................................................... 2-113
(D01_13) Focus adjustment .......................................................... 2-114
(D01_14) Tape feed dclr [%] .......................................................... 2-114
(D01_15) Collection after interlock ................................................ 2-114
(D01_16) Rejected cmpnt disch pos ............................................. 2-114
(D01_17) Placement height feedback ........................................... 2-115
(D01_18) Cmpnt thickness check [mm] ......................................... 2-115
(D01_19) Capture mode ................................................................ 2-115
(D01_20) Pressure insert operation .............................................. 2-116
(D01_21) Pick-up loading limit ....................................................... 2-116
(D01_22) Splicing supply ............................................................... 2-116
(D01_23) Pick-up difference detn X, Y, und Angle ......................... 2-117
(D01_26) Layer No. ....................................................................... 2-117
(D01_27) Placement offset specication ....................................... 2-118
(D01_28) Component pushing operation ...................................... 2-119
(D01_29) Comp Drop detection ..................................................... 2-120
(D01_30) Tape pocket position detection ...................................... 2-120
2.5 (E01) Carrier Data .................................................................. 2-121
(E01_01) Carrier Data ................................................................... 2-121
(E01_02) Tape end detection ........................................................ 2-125
(E01_03) Magnetic Type ............................................................... 2-125
(E01_04) Teaching motion ............................................................ 2-125
(E01_05) Tray data........................................................................ 2-126
(E01_06) Stick data ....................................................................... 2-128
DEUKYX
193-6100
Inhalt-4
Inhalt
Seite
2.6 (F01) Placeable Data .............................................................. 2-129
(F01_01) Machine Name .............................................................. 2-129
Kapitel 3 Standardbezeichnungen für Component Library
1. Benennungsregeln für Component Library ........................................... 3-1
2. Benennungsregeln für eine benutzerdenierte
Component Library ............................................................................. 3-1
3. Benennungsregeln für Standard-Component Library .............................. 3-2
3.1 Allgemeine Bauteile (ohne ICs) .................................................. 3-2
3.1.1 Bauteilname, Bauteilgröße, Bauteildicke, Hersteller-Nr.,
Anzahl der Anschlüsse ...................................................... 3-2
3.1.2 Serien-Nr. .......................................................................... 3-6
3.1.3 Herstellerabkürzung .......................................................... 3-7
3.1.4 Gehäusespezikationen .................................................... 3-8
3.2 ICs ............................................................................................ 3-12
3.2.1 Bauteilname und Anschlussanzahl .................................. 3-12
3.2.2 Serien-Nr. ........................................................................ 3-13
3.2.3 Herstellerabkürzung ........................................................ 3-13
3.2.4 Gehäusespezikationen .................................................. 3-14
Kapitel 4 Erstellen einer neuen Component Library
1. Schritte für die Datenerstellung ............................................................ 4-1
2. Bestimmung der Bauteilform ................................................................ 4-3
2.1 Schritte zur Bestimmung ............................................................. 4-3
2.2 Typische Beispiele für die einzelnen Bauteile ............................. 4-7
3. Vermessen des Bauteils ....................................................................... 4-9
3.1 Nicht bedrahtete Bauteile ........................................................... 4-9
3.1.1 Zylindrische Bauteile ......................................................... 4-9
3.1.2 Rechteckige Bauteile ....................................................... 4-11
3.1.3 Komplexe Bauteile ........................................................... 4-13
3.2 Area-Array-Bauteile .................................................................. 4-16
3.2.1 BGA / CSP ....................................................................... 4-16