00193407-02 HWWS SIPLACE Machine Accuracy EN.pdf - 第38页

. Seite 2 © Siemens AG . . Änderungen vorbehalten SIPLACE Placement Systems Mapping Attention: For more information on Mapping see TI No 10C 03034 PCB Mapping. During PCB mapping the PCB-camera measures t he cross fiduci…

. Seite 1

SIPLACE

Placement Systems

Mapping

. Seite 2

SIPLACE

Placement Systems

Mapping

Attention: For more information on Mapping see TI No 10C03034

PCB Mapping.

During PCB mapping the PCB-camera measures the cross fiducials on a highly precise glass

plate. This glass plate is calibrated with a measurement machine and this data is taken into

consideration during the measurement sequence.

The linearity of the X and Y axis guidance system for PCB-camera movement is measured

within the entire placement area.

RV-Mapping.

During RV-mapping the C&P head places the new calibration tool onto the mapping glass board

exactly at the nominal positions of the glass plate. The PCB-camera measures the placement

accuracy of these placements.

The linearity of the X and Y axis guidance system for C&P head movement is measured by the

segment offset bottom at these positions.

IC-Mapping.

During IC-mapping the Twin head places the new calibration tool on the mapping glass

board exactly at the nominal positions of the glass plate. The PCB-camera measures the

placement accuracy of these placements.

The linearity of the X and Y axis guidance system for Twin head movement is measured by

the segment offset bottom at these positions.

. Seite 3

SIPLACE

Placement Systems

Mapping Plates (Glass)