IPC-7351-2005_表面贴装焊盘布局设计和标准通用要求.pdf - 第78页
Pin 1 on T op Center Bumper Quad Flat P acka ges Land P attern P acka ge Outline Component Examples Zero Rotation Bump QFP (Pin 1 on Side or Center) Pin 1 on Upper Left Land P attern Quad Flat Pa ck ag es Pin 1 on Upper …
Pin 1 on Upper Left
Small Outline
Gullwing
Components
Small Outline
J-Lead
Components
Land Pattern
Pin 1 on Upper Left
SOIC, SOP & SOIC
TSSOP
Pin 1 on Upper Left
Land Pattern
Package Outline Component Examples
Zero Rotation
Land Pattern
SOIC J-Lead
Pin 1 on Upper Left
Land Pattern
SOT
Components
Pin 1 on Upper Left
Land Pattern
TO
Components
SOT23-3
SOT23-5
SOT343 SOT223
TO252 (DPAK)
Figure 16-1 Zero Component Rotations for Common Package Outlines (continued)
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Pin 1 on Top Center
Bumper Quad
Flat Packages
Land Pattern
Package Outline Component Examples
Zero Rotation
Bump QFP (Pin 1 on Side or Center)
Pin 1 on Upper Left
Land Pattern
Quad Flat
Packages
Pin 1 on Upper Left
Land Pattern
Land Pattern
Pin 1 on Upper Left
Ceramic Flat
Packages
CFP
Pin 1 on Upper Left
Land Pattern
Square QFP
Rectangular QFP
Figure 16-1 Zero Component Rotations for Common Package Outlines (continued)
IPC-7351 February 2005
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Pin 1 on Top Center
Leadless Chip
Carriers
Quad Flat
No-Lead
Components
Land Pattern
Pin 1 on Upper Left
Land Pattern
Package Outline Component Examples
Zero Rotation
Ceramic Quad
Flat Packages
Pin 1 on Upper Left
Land Pattern
Land Pattern
Land Pattern
Plastic Leaded
Chip Carriers
CQFP
Pin 1 on Top Center
Pin 1 on Top Center
PLCC Square
PLCC Rectangular
Figure 16-1 Zero Component Rotations for Common Package Outlines (continued)
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