IPC-7351-2005_表面贴装焊盘布局设计和标准通用要求.pdf - 第79页
Pin 1 on T op Center Leadless Chip Carriers Quad Flat No-Lead Components Land P attern Pin 1 on Upper Left Land P attern P acka ge Outline Component Examples Zero Rotation Ceramic Quad Flat P acka ges Pin 1 on Upper Left…
Pin 1 on Top Center
Bumper Quad
Flat Packages
Land Pattern
Package Outline Component Examples
Zero Rotation
Bump QFP (Pin 1 on Side or Center)
Pin 1 on Upper Left
Land Pattern
Quad Flat
Packages
Pin 1 on Upper Left
Land Pattern
Land Pattern
Pin 1 on Upper Left
Ceramic Flat
Packages
CFP
Pin 1 on Upper Left
Land Pattern
Square QFP
Rectangular QFP
Figure 16-1 Zero Component Rotations for Common Package Outlines (continued)
IPC-7351 February 2005
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Pin 1 on Top Center
Leadless Chip
Carriers
Quad Flat
No-Lead
Components
Land Pattern
Pin 1 on Upper Left
Land Pattern
Package Outline Component Examples
Zero Rotation
Ceramic Quad
Flat Packages
Pin 1 on Upper Left
Land Pattern
Land Pattern
Land Pattern
Plastic Leaded
Chip Carriers
CQFP
Pin 1 on Top Center
Pin 1 on Top Center
PLCC Square
PLCC Rectangular
Figure 16-1 Zero Component Rotations for Common Package Outlines (continued)
February 2005 IPC-7351
69
Land Pattern
Pin A1 on Upper Left
Pin A1 on Upper Left
Land Pattern
Ball Grid Array
Components
Package Outline Component Examples
Zero Rotation
BGA
BGA Rectangular
Figure 16-1 Zero Component Rotations for Common Package Outlines
IPC-7351 February 2005
70
标准分享网 www.bzfxw.com 免费下载