SOM-1655-002.pdf - 第18页

17 Tg0742-PM-SO 0301-001 4.Scope of Actions 4. Scope of Actions (1) The component is picked up (taken out) from the feeder . (2) The component recognition operation is performed. (3) The placement head is moved to the po…

16 Tg0742-PM-SO0301-001

3. Rough View of Machine

Fig. 2 V. Bend Detection Unit

Fig. 1 Main Machine of TIM-X100

3. Rough View of Machine

-marked area is specially specified.

(Front Side of Machine)

V. Bend Detection

Sensor Head

V. Bend Detection Unit

Controller

Feeder Base

Tray Feeder

Fixed Recognition Camera

V. Bend Detection Unit

17 Tg0742-PM-SO0301-001

4.Scope of Actions

4. Scope of Actions

(1) The component is picked up (taken out) from the feeder.

(2) The component recognition operation is performed.

(3) The placement head is moved to the position where the V. bend

detection is performed.

• While the placement head is moving, the following actions are

performed.

The placement head stands by at the position where the scan-

ning is started.

X, Y and Z are corrected for the component to be picked up

based on the component recognition results.

The component stands by at the specified angle where the

scanning is started.

(4) V. bend detection is performed.

• Batch Scanning is employed for batch detection.

• Scanning is performed twice for divided detection.

(5) The following processing is performed based on the V. bend detec-

tion results.

OK: The component is placed.

NG: The component is discarded.

Ref. : The V. bend judgment criteria are set in the component

library.

Fig. 3

18 Tg0742-PM-SO

4.1 Measurement

Principle of Lead Bend Measurement

• The laser beam hits the lead and its reflection is detected at the

light receiving element.

• When the lead height is changed, the detection position on the

light receiving elements is also changed. Therefore, the lead

height is detected by obtaining the detection position on the light

receiving element.

Lead Bend Amount Inspection Procedure

• The scanning type laser displacement gauge (Infrared Laser,

Class 1) is used for lead bend amount detection.

• The successive height data of a component to be measured in

the direction X can be obtained by laser scanning of the compo-

nent in the direction X using polygon mirror.

Then, the three dimensional data on the bottom of the compo-

nent to be measured can be obtained by laser scanning of the

component in the direction Y.

The lead position is calculated based on the obtained three

dimensional data and the lead bend is inspected.

Reference : The laser beam of class 1 has been designed to be safe

for humans.

This level of beam does not damage your retina even if

you watch it for 100 seconds without blinking.

Fig. 4

Fig. 5

0301-001

4.1 Measurement

V. Bend Detection Unit

Light Receiving Element

The difference in height can be seen as the

difference in the detection position on the light

receiving element.

Laser Beam

Secondary Operation

Method in Direction Y

Chipped Component to be Measured

Direction X (Laser Operation Direction)

Direction ZLight Receiving

Movement Direction

of Component to be

Measured

Light Emitting