MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第338页
MIL-STD-883F METHOD 2018.4 18 June 2004 26 FIGURE 2018-15. 7,200X . Thinning at passi vation s tep wit h less than 50 percent of cr oss -sec tional area remaini ng at step (multi-le vel me tal) (reje ct).
MIL-STD-883F
METHOD 2018.4
18 June 2004
25
FIGURE 2018-14. (7,200X)
.
Thinning at passivation step with more than 50
percent of cross-sectional area remaining at
step (multi-level metal) (accept).
MIL-STD-883F
METHOD 2018.4
18 June 2004
26
FIGURE 2018-15. 7,200X
.
Thinning at passivation step with less than 50
percent of cross-sectional area remaining at
step (multi-level metal) (reject).
MIL-STD-883F
METHOD 2018.4
18 June 2004
27
FIGURE 2018-16. (6,000X)
.
Steep passivation step (MOS) (accept).