MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第661页
MIL-STD-883F METHOD 5010.4 18 June 2004 11 3.5 Quali fic ation and quali ty conf ormance pr ocedur es . Quali ficati on and quali ty conf ormance s hall be per form ed in accor dance wit h A.4.4 qual ific ation proc edur…
MIL-STD-883F
METHOD 5010.4
18 June 2004
10
3.4.9 Electrical measurements.
3.4.9.1 Interim (pre- and post-burn-in) electrical parameters
. Interim (pre- and post-burn-in) electrical testing shall be
performed when specified, to remove defective devices prior to further testing or to provide a basis for application of percent
defective allowable (PDA) criteria when a PDA is specified. The PDA shall be 5 percent or one device, whichever is greater.
This PDA shall be based, as a minimum, on failures from group A, subgroup 1 plus deltas (in cases where delta parameters
are specified) with the parameters, deltas, and any additional subgroups (or subgroups tested in lieu of A-1) subject to the
PDA as specified in the applicable device specification or drawing. If no device specification or drawing exists, subgroups
tested shall at least meet those of the most similar device specification or Standard Microcircuit Drawing. In addition, for
class level S the PDA shall be 3 percent (or one device, whichever is greater) based on failures from functional parameters
measured at room temperature. For class level S screening, where an additional reverse bias burn-in is required, the PDA
shall be based on the results of both burn-in tests combined. The verified failures after burn-in divided by the total number
of devices submitted in the lot or sublot for burn-in shall be used to determine the percent defective for that lot, or sublot and
the lot or sublot shall be accepted or rejected based on the PDA for the applicable device class. Lots and sublots may be
resubmitted for burn-in one time only and may be resubmitted only when the percent defective does not exceed twice the
specified PDA, or 20 percent, whichever is greater.
3.4.9.2 Pattern failures
. Pattern failure criteria may be used as an option for class level B, provided that:
a. Inspection lot size is less than 500 devices.
b. Pre burn-in electrical testing is done.
3.4.9.2.1 Pattern failures criteria
. A maximum number of pattern failures (failures of the same part type when the failures
are caused by the same basic failure mechanism) shall apply as specified in the acquisition document. If not otherwise
specified, the maximum allowable pattern failures shall be five. Accountability shall include burn-in through final electrical
test.
3.4.9.2.2 Pattern failure resubmission
. When the number of pattern failures exceeds the specified limits, the inspection
lot shall be rejected. At the manufacturer's option, the rejected lot may be resubmitted to burn-in one time provided:
a. The cause of the failure has been evaluated and determined.
b. Appropriate and effective corrective action has been completed to reject all devices affected by the failure cause.
c. Appropriate preventive action has been initiated.
3.4.10 Burn-in
. Device burn-in shall be performed in accordance with the requirements of method 1015 conditions A, B,
C, D, or E. Regardless of power level, devices shall be able to be burned-in at their maximum rated operating temperature.
For devices whose maximum operating temperature is stated in terms of ambient temperature, T
A
, table I of method 1015
applies. For devices whose maximum operating temperature is stated in terms of case temperature, T
C
, and where the
ambient temperature would cause T
J
to exceed 200°C for class level B or 175°C for class level S, the ambient operating
temperature may be reduced during burn-in from 125°C to a value that will demonstrate a T
J
between 175°C and 200°C (for
both class levels S and B) and T
C
equal to or greater than 125°C without changing the test duration. Data supporting this
reduction shall be available to the acquiring and qualifying activities upon request.
3.4.11 Final electrical measurements
. Final electrical testing of microcircuits shall assure that the microcircuits tested
meet the electrical requirements of the applicable device specification or drawing and shall include, as a minimum, the tests
of group A, subgroups 1, 2, 3, 4 or 7, 5 and 6, or 8, and 9.
3.4.12 Radiographic
. The radiographic screen may be performed in any sequence after PIND test and before external
visual inspection. Only one view is required for flat packages and leadless chip carriers having lead (terminal) metal on four
sides.
3.4.13 External visual inspection
. All devices shall be inspected in accordance with MIL-STD-883, method 2009, prior to
acceptance for shipment
MIL-STD-883F
METHOD 5010.4
18 June 2004
11
3.5 Qualification and quality conformance procedures
. Qualification and quality conformance shall be performed in
accordance with A.4.4 qualification procedures and A.4.5 quality conformance inspection of appendix A of MIL-PRF-38535
except as modified herein. The qualification device shall be used for QCI testing in accordance with 3.5.3 herein, as well as
for qualifying the process line. Life testing requirements shall follow the same criteria as burn-in (3.4.10 herein) for reduced
temperature.
3.5.1 Qualification testing
. Initial product process qualification shall be in accordance with MIL-STD-883 method 5005.
Change to qualified product shall be addressed in accordance with MIL-STD-883, method 5005 and appendix A of
MIL-PRF-38535, A.3.4.2. The SEC shall be used for group D inspection whenever practical; where the SEC cannot be
used, another die may be used (for gate arrays, 60 percent or greater utilization required). Utilizing the qualification device
the process monitor, the manufacturer shall demonstrate:
a. Process control and stability.
b. Process/device reliability.
c. Design and simulation control.
3.5.1.1 Detailed qualification test plan
. The manufacturer shall submit to the qualifying activity for approval a detailed
qualification test plan to assure conformance to 3.5.1 herein. The test plan shall, as a minimum, define test groups,
subgroups, conditions, and sampling plans in accordance with method 5005, as well as the tests to carry out 3.5.1.2,
3.5.1.3, and 3.5.1.4.
3.5.1.2 Database test
. For qualification, at least five PM's per wafer (located in accordance with appendix II) shall be
measured to ensure the establishment of a statistically valid database on which a decision can be made as to whether the
manufacturer's process is stable and under control.
3.5.1.3 Qualification device design and test plan
. Qualification device design and test plan to be used to qualify the
manufacturing line shall be submitted to the qualifying activity for approval. The design must meet the minimum
requirements of 3.3.4.2 herein. The test plan must include life test requirements. If a SEC is used as the qualification
device, data demonstrating process reliability from lots processed within 12 months of qualification and that an on-going
SEC program is in effect shall be submitted for qualifying activity review.
3.5.1.4 Design and simulation verification
. Design and simulation verification shall be accomplished as follows:
a. Design rule check (DRC) verification. DRC software shall be run on a design which contains known design rule
violations.
b. Electrical rule check (ERC) verification. ERC software shall be run on a design which contains known electrical
rule violations (e.g., fan-out violations).
c. Layout versus schematic (LVS) check.
d. Correct by construction. If the manufacturers' design methodology is based on a "correct by construction"
approach, distinct DRC, ERC, and LVS software is unnecessary and a, b, and c above do not apply. However,
the manufacturer shall provide suitable data to demonstrate the correct performance of "correct by construction"
software.
e. Computer aided design (CAD) system control shall be in accordance with appendix I herein.
3.5.2 Quality conformance inspection
. This procedure, as applicable to the microcircuit type and class, shall apply for all
quality conformance inspection requirements. Subgroups within a group of tests may be performed in any sequence but
individual tests within a subgroup (except group B, subgroup 2) shall be performed in the sequence indicated for groups B,
C, D, and E tests herein. Where end-point electrical measurements are required for subgroups in groups B, C, D, and E
testing herein, they shall be as specified in the applicable device specification or drawing. Where end-point measurements
are required but no parameters have been identified in the acquisition document for this purpose, the final electrical
parameters specified for 100 percent screening shall be used as end-point measurements. Electrical reject devices from the
same inspection lot may be used for all subgroups when end-point measurements are not required.
3.5.2.1 Radiation hardness
. Quality conformance inspection requirements for radiation hardness assured devices are in
addition to the normal class level S and B requirements. Those requirements are detailed in table VIII (group E) herein. The
radiation levels (M, D, P, L, R, F, G and H) are defined in appendix A of MIL-PRF-38535.
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MIL-STD-883F
METHOD 5010.4
18 June 2004
12
3.5.2.2 Quality conformance inspection
. For class level B quality conformance inspection, each inspection lot (sublot)
shall pass groups A, B, and E (when applicable) tests or be accepted in accordance with 3.5.3 herein and the periodic group
C and D tests shall be in accordance with appendix A of MIL-PRF-38535. End point electrical parameters shall be as
specified in 3.5.2.3 herein. For class level S, each QCI inspection lot shall be assembled in accordance with the class
level S requirements of appendix A of MIL-PRF-38535. Quality conformance testing for class level S shall be in accordance
with tables IV, V, VI, and VII herein.
3.5.2.3 End point electrical parameters
. Where intermediate and end point electrical measurements are required for
subgroups B, C, D, and E testing, they shall be as specified in the applicable device specification or drawing where required
and when end point parameters have not been identified, group A, subgroup 1, 2, 3, 4 or 7, and 9 shall be used for end point
measurements.
3.5.2.4 Constant acceleration
. Constant acceleration shall be performed in accordance with method 2001, test condition
E for all applicable subgroups except as allowed in accordance with 3.4.6, herein.
3.5.3 Quality conformance testing
. Conformance testing shall be performed through the use of the identified quality
conformance vehicles.
Quality conformance test
Quality conformance vehicle Frequency
Table IV Group A Actual device Each inspection lot
Table V Group B Actual device Each inspection lot
Table VI Group C SEC or actual device 3 months
Table VII Group D SEC or actual device 6 months
Table VIII Group E Actual device See MIL-PRF-38535. appendix A
3.5.3.1 Alternate group A method
. The alternate group A method below may be used provided that:
a. Inspection lot size is less than 500 devices.
b. Final electrical test shall assure that the electrical requirements of the device specification or drawing are met and
shall include the tests of group A, subgroups 1, 2, 3, 4 or 7, 5 and 6 or 8, 9, as a minimum.
c. All test software and procedures are under document control.
3.5.3.1.1 In-line verification testing
.
a. For each test set up (and operator for manual testing), production runs correlation unit to assure that the accuracy
requirements of MIL-STD-883 4.5.2 are being met.
b. Testing is performed using the verified set up.
c. At the completion of testing utilizing the verified set up (not to exceed 8 hours and at the change of operators) a
separate party (QA or QA designate) then verifies the production testing by:
(1) Checking visually to verify that the correct fixture, equipment, software, and procedure(s) were used.
(2) Actual testing of controlled known good device utilizing the fixtures, set ups, software and procedures that
were used by production. Variables data for all required group A tests shall be read and recorded for the
controlled unit. This data shall be maintained with the lot.