MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第684页

MIL-STD-883F METHOD 5011.4 31 October 1995 4 3.5.4 I onic i mpuri ties . The ionic i mpuri ty cont ent shal l be determi ned in acc ordanc e with 3.8. 7 and shall meet the requir ements s pecif ied in t able II. Ionic c …

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MIL-STD-883F
METHOD 5011.4
31 October 1995
3
TABLE I. Requirements (Continued)
Test or Condition Test
Method
Dessicants Junction Coatings T-Wave Absorbers
Encapsulating
Compounds
Paragraph
Supplier
User Supplier
User Supplier
User Supplier
User
A C A C A C A C A C A C A C A C
Materials (3.4.1) 3.8.1 X X X X X X X X X X X X X X X X
Viscosity (3.4.2) 3.8.2 X
Pot Life (3.4.3) 3.8.3
Shelf Life (3.4.4) 3.8.4 X X X
Thermogravimetric analysis (3.5.2) 3.8.5 X X X X X
Outgassed materials (3.5.3) 3.8.6 X X X
Ionic impurities(3.5.4) 3.8.7 X X X X X
Bond strength (3.5.5) 3.8.8 X X
Coefficient of linear thermal
expansion (3.5.6)
3.8.9 X
Thermal conductivity (3.5.7) 3.8.10 X
Volume resistivity (3.5.8) 3.8.11 X
Type 1 materials
Type 2 materials X X X
Dielectric constant (3.5.9) 3.8.12 X
Dissipation factor (3.5.10) 3.8.13 X
Sequential test environment (3.5.11) 3.8.14 X X
Density (3.5.12) 3.8.15 X X X X
Mechanical integrity (3.5.13) 3.8.16
Operating life test (3.5.14) 3.8.17 X X
A= Performed at acceptance testing.
C= Performed at certification testing.
3.5 Properties of cured polymer materials
.
3.5.1 Curing of polymer materials
. The material must be capable of meeting the requirements of this document when
cured according to the supplier's instructions. The cure schedule for supplier tests shall be identical for all tests and shall be
reported. The cure schedule for the user tests shall be the minimum cure schedule plus, as a minimum, the pre-seal bake
specified in the user's assembly document and shall be reported. Deviation from the suppliers recommended cure schedule
will require verification by the user of the materials performance.
3.5.2 Thermogravimetric analysis (TGA)
.
3.5.2.1 Thermal stability
. The thermal stability of the cured material shall be determined in accordance with 3.8.5. Unless
otherwise noted, the weight loss at 200°C shall be less than or equal to 1.0 percent of the cured material weight. Equivalent
standard, i.e., "classical analytical techniques" are acceptable.
3.5.2.2 Filler content
. Polymeric materials using a filler to promote properties such as electrical and thermal conductivity
shall be tested in accordance with 3.8.5 to determine the inorganic filler content. For acceptance testing, the percent filler
content shall not differ from the filler content in the certified materials by more than ±2 percent.
3.5.3 Outgassed materials
. Outgassing of the cured material shall be determined in accordance with 3.8.6. Outgassed
moisture, as determined in 3.8.6.1, shall be less than or equal to 5,000 ppmv (0.5 percent V/V) for 3 packages (0 failures) or
5 packages (1 failure). Other gaseous species present in quantities greater than or equal to 100 ppmv (0.01 percent V/V)
shall be reported in ppmv or percent V/V. The data obtained in 3.8.6.2 shall also be reported in the same manner but for
information only. The outgassing of the cured getter shall be determined in accordance with 3.8.6. The vapor content of the
package with getter shall not exceed 2000 ppmv after 24 hours at 150°C and 3000 ppmv after 1000 hours at 150°C.
MIL-STD-883F
METHOD 5011.4
31 October 1995
4
3.5.4 Ionic impurities
. The ionic impurity content shall be determined in accordance with 3.8.7 and shall meet the
requirements specified in table II. Ionic content analysis shall be in triplicate for certification and single analysis for
acceptance testing. Failure at acceptance shall require the passing of two additional samples.
TABLE II. Ionic impurity requirements
.
Total ionic content
specific electrical conductance)
Hydrogen (pH)
Chloride
Sodium
Potassium
Flouride
<
4.50 millisiemens/meter
4.0 <
pH < 9.0
<
200 ppm
<
50 ppm
<
50 ppm
<
50 ppm
Other ions present in quantities > 5 ppm shall be reported in ppm.
3.5.5 Bond strength
. The bond strength of a polymeric material shall be determined in accordance with 3.8.8 at 25°C,
and 25°C after 1,000 hours at 150°C. The bond strength shall meet as a minimum the 1.0X requirement specified in figure
2019-4 of method 2019 of MIL-STD-883 at each test condition. The manufacturer should test to shear or until twice the
minimum 1.0X shear force is reached.
MIL-STD-883F
METHOD 5011.4
31 October 1995
5
3.5.6 Coefficient of linear thermal expansion
. The coefficient of linear thermal expansion shall be determined from -65°C
to 150°C in accordance with 3.8.9. The coefficient of linear thermal expansion shall be ±10% of the value required in the
users material specification or purchase order. This requirement shall apply to the material as it is configured for actual use.
This requirement shall not apply to glass supported polymeric films.
3.5.7 Thermal conductivity
. The thermal conductivity shall be determined at 121°C ±5°C in accordance with 3.8.10. The
thermal conductivity shall be greater than or equal to 1.5 watt/meter-K for type I polymers and greater than or equal to .15
watt/meter-K for type II polymers.
3.5.8 Volume resistivity
. The volume resistivity shall be determined in accordance with 3.8.11. The volume resistivity of
conductive materials at 25°C, at 60°C, at 150°C, and at 25°C after 1,000 hours at 150°C shall be less than or equal to 5.0
microhm-meter for silver-filled polymers and less than or equal to 15.0 microhm-meter for gold-filled polymers. The volume
resistivity of insulative materials shall be greater than or equal to 0.1 teraohm-meter at 25°C and greater than or equal to 1.0
megohm-meter at 125°C.
3.5.9 Dielectric constant
. The dielectric constant of insulative polymeric materials shall be determined in accordance with
3.8.12 and shall be less than or equal to 6.0 at both 1 kHz and 1 MHz for this type of polymer but shall be less than or equal
to 3.5 at 1 kHz and 1 MHz for materials used for dielectric layers.
3.5.10 Dissipation factor
. The dissipation factor of insulative polymers shall be determined in accordance with 3.8.13 and
shall be less than or equal to 0.03 at 1 kHz and less than or equal to 0.05 at 1 MHz.
3.5.11 Sequential test environment
. The polymeric material shall withstand exposure to the test conditions specified in
3.8.14. After exposure to the complete sequence of environmental conditions, the test specimens shall show no evidence of
mechanical degradation. For adhesives the measured bond strength of components shall meet as a minimum the 1.0X
requirement specified on figure 2019-4 of method 2019 of MIL-STD-883.
3.5.12 Density
. The density of microwave or RF absorbing materials shall be tested in accordance with 3.8.15. The
acceptable value shall be that which is within ±10% of the value required on the user's material specification or purchase
order.
3.5.13 Mechanical integrity
. Particle getter integrity shall be verified after different levels of environmental stress.
3.5.13.1 Getter integrity (short term)
. When tested in accordance with 3.8.16.1 all samples shall pass the criteria for
PIND as defined in MIL-STD-883 method 2020.
3.5.13.2 Getter integrity (long term)
. When tested in accordance with 3.8.16.2 all samples shall pass the criteria for
PIND as defined in MIL-STD-883, method 2020, both initially and after storage at 150°C for 1,000 hours. The salted
particles shall remain attached to the getter material in the original position with no attachment and reattachment when
viewed at 30X to 60X magnification.
3.5.13.3 Getter integrity (vibration)
. When tested in accordance with 3.8.16.3 the sample shall pass PIND as defined in
MIL-STD-883, method 2020, the salted particles shall remain attached to the getter material in the original position, with no
detachment and re-attachment when viewed at 30X to 60X.
3.5.14 Operating life
. When tested in accordance with 3.8.17, the comparison between initial and post test electrical data
shall not indicate parametric shifts, which are unique to the test group containing getter material.