MIL- STD-883F 2004 TEST METHOD STANDARD MICROCIRCUITS.pdf - 第420页
MIL-STD-883F METHOD 2032.2 18 June 2004 14 3.1.1. 10 Substr ate plug vi a defect s, “ low magnifi cati on”. W hen ins pected f rom each s ide of t he subst rate, no element shall be accept able that exhibits : a. A compl…
MIL-STD-883F
METHOD 2032.2
18 June 2004
13
Class H Class K
3.1.1.8 Metallized through-hole defects,
"high magnification"
. No element shall be
acceptable that exhibits:
a. Through-hole metallization that is not a. Same as class H.
vertically continuous or that does not
cover at least a continuous 50 percent
of the inside, circumferential surface
area unless by design.
3.1.1.9 Wrap-around connection defects,
"high magnification"
. No element shall be
acceptable that exhibits:
a. Unmetallized area in the edges of a. Same as class H.
wrap-around connections greater than 50
percent of the largest dimension of the edge
metallization (see figure 2032-8h).
FIGURE 2032-8h. Class H wrap-around connection unmetallized area criterion
.
MIL-STD-883F
METHOD 2032.2
18 June 2004
14
3.1.1.10 Substrate plug via defects, “low magnification”. When inspected from each side of the substrate, no element
shall be acceptable that exhibits:
a. A complete void through the via.
b. Any lifting, peeling, or blistering of the via metallization.
c. Via fill less than 75% of the total surface area of the via plug and less than 75% of the substrate thickness.
NOTE: These are minimum requirements. Via flatness and other requirements shall be in accordance with the
applicable detail drawings. The via fill may consist of thick film metallization.
FIGURE 2032-8Bh. Classes H and K via plug fill criteria
MIL-STD-883F
METHOD 2032.2
18 June 2004
15
Class H Class K
3.1.2 Passivation defects "high magnification"
.
No element shall be acceptable that
exhibits:
a. Either multiple lines (color fringing) or a a. Same as class H.
complete absence of passivation visible at
the edge and continuing under the
metallization (see figure 2032-8Ah).
A passivation defect that exhibits a line
of separation from the metallization is
acceptable.
NOTE: These criteria apply to conductive
substrate elements only.
NOTE: Double or triple lines at the edge
of the passivation defect indicate it can
have sufficient depth to penetrate down to
the bare substrate.
FIGURE 2032-8Ah. Class H passivation defect criteria
.