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Slide 11 NXE: 3400C improvements with higher productivity Demon strated in ASML factory , shipping to the customers ATP test: 26x33mm 2 , 96 fields, 20mJ/cm 2 Source with Modular Vessel collector sw ap <8hrs Inline ti…

NXE:3400B: 13 nm resolution at full productivity

Supporting 5 nm logic, <15nm DRAM requirements

Slide 10

New Flex-illuminator

outer sigma to 1.0

Inner sigma to 0.06

reduced PFR* (0.20)

Overlay set up

Set-up and modelling

improvements

Reticle Stage

Improved clamp flatness

for focus and overlay

Projection Optics

Continuously Improved

aberration performance

Wafer Stage

Flatter clamps, improved

dynamics and stability

125WPH

Reduced overhead

Improved source power

*PFR = pupil fill ratio

Overlay

Imaging/Focus

Productivity

Resolution 13 nm

Full wafer CDU

< 1.1 nm

DCO < 1.4 nm

MMO < 2.0 nm

Focus control

< 60 nm

Productivity

≥ 125 WPH

Public

Slide 11

NXE: 3400C improvements with higher productivity

Demonstrated in ASML factory, shipping to the customers

ATP test: 26x33mm

, 96 fields, 20mJ/cm

Source with Modular Vessel

collector swap <8hrs

Inline tin refill

Wafer Handler

@ ≥170WPH

Faster Reticle Align /

reduced wafer

overhead

Reticle Handler

Improved productivity

DGL Membrane

(optional)

Optics

Transmission improvement

OFP:3400B (standard)

ORION

UV-LS 2

Gen

≤ 1.3 nm

Public

Slide 12

World class overlay performance now at 170wph on

NXE:3400C systems

Overlay well in spec at 170 WPH throughput

DCO

MMO

Public