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SIPLACE 80S/F/G User’s Manual 7 Vision Systems Edition 07/97 from S oftware Version SR.010.xx 7.7 Guidelines for Describing P ackage Forms Line engi neer 7 - 103 7.7.5 Parameters for the Measuring Methods Possi ble seque…

7 Vision Systems SIPLACE 80S/F/G User’s Manual

7.7 Guidelines for Describing Package Forms Edition 07/97 from Software Version SR.010.xx

7 - 102 Line engineer

–

If the components are larger than 32 mm x 32 mm, a multiple measurement will be carried out automati-

cally in the vision system.

7.7.4 Test Package Form - Visual Representation / Programming Mea-

surement Types

–

In the ’Test component’ menu, a component is picked up and then moved to the camera and mapped in its

0° position. The component is displayed with respect to its insertion angle at the revolver head of the S-15/

F3.

Fig. 7.7.5

Order in which package forms are programmed at the station

Important note:

The manipulation of

components at the station

must remain the exception,

rather than the rule.

In general, only a few components

have to be changed.

Are the results

constant?

Measure component

Error

Yes

Repeat the measurement

and view the results

Yes

Assemble component

several times

8. Modify the contrast sensitivity

(Program table)

7. Modify pin/ball

dimensions

6. Modify pin/ball contrast

5. Modify component dimension

4. Modify measuring modes and

measuring

3. Modify lighting

2. Display component

1. Handling error:pick-up angle,

nozzle type, component on nozzle,

Measure component

„RETURN“ next measurement

SIPLACE 80S/F/G User’s Manual 7 Vision Systems

Edition 07/97 from Software Version SR.010.xx 7.7 Guidelines for Describing Package Forms

Line engineer 7 - 103

7.7.5 Parameters for the Measuring Methods

Possible sequences of measuring methods

It is also possible to program other sequences, such as corner followed by lead or lead only. Such combina-

tions are very unusual, however. If the component is defined in the package form editor, then the measuring

methods will be pre-assigned. However, in some cases it may be necessary to modify the measuring methods

at the station so that the component can also be optically centered.

The results from the last measurement are always saved. The previous measurement is used as a rough cen-

tering step for the next measurement and thus helps to reduce the measuring window.

The more measuring methods are used, the longer the entire measuring procedure will be. A large number of

measuring methods for a component can delay the head cycle. This applies to the revolver head in SIPLACE

80S-15/F3 automatic placement machines, in particular.

PDC/

FDC

FDC FDC FDC FDC FDC

Flip

chips

S15

Flip

chips

Ball

grid

array

Size Size Size Size Row Row Size Size Size

Lead Corner Corner Corner Corner Grid Grid

Lead Lead Ball Ball

ab. 7.7.2 Possible sequences of measuring methods

7 Vision Systems SIPLACE 80S/F/G User’s Manual

7.7 Guidelines for Describing Package Forms Edition 07/97 from Software Version SR.010.xx

7 - 104 Line engineer

Fig 7.7.6 Typical measuring modes with standard components

7.7.6 Setting the Components Illumination at the Revolver Head Cam-

era

7.7.6.1 General Information on Illumination Methods

The idea of illumination setting is to obtain an image of the leads of a component which is as high-contrast as

possible. At the same time it is also important to suppress representation of the body of the component.

These instructions are intended to help you find the best possible illumination parameters. This, however,

does not imply that you rigidly comply with the values specified in these instructions. The way you should pro-

ceed is first to follow these instructions and then to adjust the parameters yourself where necessary. It may

well be that you come across one or other component the leads of which are better illuminated using values

different to the ones suggested in these instructions.

The illumination system comprises two different illumination levels. The intensities can be programmed indi-

vidually. By using the individual illumination levels one at a time or in combination with one another you can

adapt the illumination to suit a wide range of components.

Chip

Melf

BGA

Flip chip

Tantal

capacitor

0402,

0603, etc.

General

SIZE

high

resolution

Small

BGA

SIZE

LEAD

outer tip

SIZE

LEAD

outer tip

SIZE (depends

on the comp.

size)

SIZE

CORNER

outer tip

LEAD

outer tip

SOJ,

PLCC

SIZE

CORNER

Lead center

LEAD

Lead center

Large

CORNER

outer tip

LEAD

outer tip

ROW

outer tip

SO,

QFP

PLCC

CORNER

Lead center

LEAD

Lead center

ROW

Lead center

GRID

BALL

SO, SOT

QFP

Flip Chip

SIZE (depends

on the comp.

size)

GRID

BALL