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10 SI PLACE G SIPLACE 80S/F/G User’s Manual 10.8 Gluing Tips and Tricks Ed ition 07/97 from Software Vers ion SR.010.xx 10 - 56 ❏ The nozz le has b een in us e for too lo ng. Clean t he nozzle as describ ed in the ma int…

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SIPLACE 80S/F/G User’s Manual 10 SIPLACE G
Edition 07/97 from Software Version SR.010.xx 10.8 Gluing Tips and Tricks
10 - 55
You are using a new
adhesive and have
entered the parame-
ters in the MA data, but
the quality is poor and
the points are smeared
See ’Smeared points’
The new adhesive has very different flow prop-
erties
Select a larger spacer than the one specified.
The diameters differ
greatly within a charac-
teristic curve
You are using the wrong spacer. Insert the correct spacer.
If the compressed air is switched over, the
metering pressure between two successive
point sizes will change.
The different metering pressure has caused
the point to be built up slightly differently. This
may cause the diameter of a larger metering
stage to be smaller than that of the previous
metering stage.
The PCB flexes when the adhesive points are
applied.
Insert the PCB support.
The adhesive characteristic curve is incorrect. Load the correct characteristic curve and
restart the machine. In the Single functions, set
the cartridge to ’full’. PLEASE NOTE: If the
cartridge is no longer full, you must insert a
new cartridge.
You have loaded a new
characteristic curve,
but the point sizes are
still incorrect
You did not set the cartridge to ’full’ after load-
ing the characteristic curve.
Insert a new, full cartridge and confirm using
the ’New cartridge’ function.
You must not confirm a ’New cartridge’ after
changing the spacer angle.
The z axis causes a
crash
The clamping rails is bent. Check the clamping rail and straighten or
replace it, if necessary.
The zero point correction for the z axis is incor-
rect.
Check the zero point correction and reset, if
necessary.
The motor or tacho is defective. Notify the Service department.
The adhesive point
positions migrate on
the PCB
The PCB is not clamped sufficiently because
the clamping rail is bent.
Check the conveyor belt and set the PCB
transport width.
The PCB has not been set down correctly. Check the conveyor belt and set the PCB
transport width.
The x/y scale is dirty. Clean the scale with alcohol.
The connection between the incremental
encoder and mini gantry motor is defective
Visually inspect the motor,
notify the Service department.
The nozzle has been
damaged
The nozzle is colliding with defects on the
PCB.
Check the PCB for defects (screws, bent
leads).
The nozzle is colliding with hard objects (the
nozzle is made of aluminum).
Check the storage conditions and handling
when the nozzle is inserted.
The clamping rail is bent. Check the clamping rail and straighten or
replace it, if necessary.
The nozzle is clogged You have stored the nozzle in alcohol / spirit. If you clean the nozzle with alcohol / spirit, sim-
ply rinse it out afterwards. Then immediately
blow the nozzle out with compressed air.
(Long-term contact with alcohol will cause the
adhesive to harden, even at room tempera-
ture).
We recommend that you use the cleaning
agent Zestron HC.
Replace any nozzles with hardened-on adhe-
sive residues.
Malfunction Cause Remedy
10 SIPLACE G SIPLACE 80S/F/G User’s Manual
10.8 Gluing Tips and Tricks Edition 07/97 from Software Version SR.010.xx
10 - 56
❏
The nozzle has been in use for too long. Clean the nozzle as described in the mainte-
nance instructions.
Replace any nozzles with hardened-on adhe-
sive residues.
’Error in DP from the
line computer’
The programmed metering stages cannot be
used with the specified characteristic curve.
Adjust the characteristic curve and the range of
metering stages. Reprogram the metering
stages, if necessary.
The data in the placement program is incor-
rect.
Press <F1> to switch screens and read the
detailed error message.
Malfunction Cause Remedy
SIPLACE 80S/F/G User’s Manual
Edition 07/97 from Software Version SR.010.xx
11 - I
Contents
Page
11 Station Extensions
11.1 Nozzle-Changer for Revolver Head. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 3
11.1.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 3
11.1.2 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 4
11.1.2.1 Software Recommendation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 4
11.1.3 Method of Functioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 4
11.1.4 Notes on Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 6
11.1.5 Service Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 6
11.1.6 Position Recognition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 7
11.2 Nozzle Changer for IC Head (ICPW20) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 9
11.2.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 9
11.2.2 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 10
11.2.3 How It Works . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 10
11.2.4 Notes for the Operator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 11
11.3 PCB Bar-Code. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 13
11.3.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 13
11.3.2 Notes on Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 14
11.3.3 How It Works . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 14
11.3.4 Parametrization and Adjustment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 14
11.3.4.1 Adjusting the Reading Beam . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 16
11.3.5 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 17
11.4 Component Bar-Code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 19
11.4.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 19
11.4.2 Notes on Operating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 20
11.4.3 Operating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 21
11.4.3.1 Flow diagram for operating sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 22
11.5 Flip Chip Vision Module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 - 23
11.5.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 - 23
11.5.2 Safety Information concerning the Components Vision Systems in the 80F Machine. . . .11 - 24