00198382-03_UM_SIPLACE-CA4-V2_EN.pdf - 第16页
1 Introduction Instruction manual SIPLACE CA4 V2 1.1 Important notes on the instruction manual From software vers io n 713.0 Edition 12/2019 16 GND Ground HCU Head control uni t I-Placement Independent placeme nt JTF JED…
Instruction manual SIPLACE CA4 V2 1 Introduction
From software version 713.0 Edition 12/2019 1.1 Important notes on the instruction manual
15
1.1.5.2 SIPLACE on the World Wide Web (WWW)
We also have our own site on the Internet. Why not log onto our SIPLACE home page at http://
www.asm-smt.com.
All the menus and other information are available in two languages: You can choose between the
German and English versions.
The various headings contain information on
– Our products
– Services
– Contacts, etc.
Registered customers can also access the SIPLACE User Group. There you can call up special
information on our placement machines, such as
– Technical documentation
– Technical information
– Spare parts catalogs etc.
Registering for access to the User Group is easy:
Click on ’Register now’.
Complete the registration form and just send it off.
You will then quickly receive access authorization with USER ID and a password.
1.1.6 Abbreviations
1
A-Placement Alternating placement
PA Placement area
CO Component
C&P20 M2 High-precision Collect&Place head with 20 segments, SIPLACE SpeedStar
CPP M High-precision Collect&Pick&Place head, SIPLACE MultiStar
DLC Dual lane conveyor
EDIF Energy and data interface
ESD Electrostatically-sensitive group of components
EMC Electromagnetic compatibility
FC Flip chip
WT Waffle pack tray
WTC Waffle pack tray carrier
GCU Gantry control unit
1 Introduction Instruction manual SIPLACE CA4 V2
1.1 Important notes on the instruction manual From software version 713.0 Edition 12/2019
16
GND Ground
HCU Head control unit
I-Placement Independent placement
JTF JEDEC tray feeder
LBO Long board option
PCB Printed circuit board
PLP Panel lane conveyor
P&P Pick&Place
NC Nozzle changer
SMD Surface mounted device
SLC Single lane conveyor
SC Station computer
SWS SIPLACE wafer system
VS Vision system
WLC Wafer lane conveyor
Instruction manual SIPLACE CA4 V2 1 Introduction
From software version 713.0 Edition 12/2019 1.2 Placement machine description
17
1.2 Placement machine description
1.2.1 SIPLACE CA4 V2
1
Fig. 1.2 - 1 SIPLACE CA4 V2 placement machine
(1) SIPLACE CA4 V2
(2) Component trolley at location 2
(T) Direction of PCB conveyor
The SIPLACE CA4 V2 impresses with high configuration flexibility, top placement performance
and maximum precision. The SIPLACE CA4 V2 can place bare dies directly from the wafer, in the
flip chip or die attach process. It also supports placement of the SMT spectrum used with the SI-
PLACE X4 S in conjunction with the relevant placement heads.
Two placement methods are used on the placement machines:
– The Collect&Place method for high-speed placement of standard components
– The Pick&Place method with the CPP M in Pick&Place mode, for fast placement of special
components in the fine-pitch and super fine-pitch range
(1)
(2)