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3 Technical data and assemblies I nstruction manual SIPLACE CA4 V 2 3.1 Placement performance and accuracy F rom software version 713 .0 Edition 12/2019 96 3.1.1 Placement performance and accuracy with changeover table (…
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblies
From software version 713.0 Edition 12/2019 3.1 Placement performance and accuracy
95
3 Technical data and assemblies
3.1 Placement performance and accuracy
3
PLEASE NOTE
Benchmark values
The following table lists the benchmark values (as defined in the "Scope of Service and
Delivery SIPLACE CA") for SMT placement per placement area.
3 Technical data and assemblies Instruction manual SIPLACE CA4 V2
3.1 Placement performance and accuracy From software version 713.0 Edition 12/2019
96
3.1.1 Placement performance and accuracy with changeover table (SMT)
3
Placement head types:
SIPLACE SpeedStar (C&P20 M2)
SIPLACE MultiStar (CPP M)
Placement performance:
The placement performance is affected by the different head combinations and positions, plus the
conveyor configuration. Individual options and customized applications also influence the placement
performance. On request, SIPLACE can calculate the actual performance of your product on your
machine configuration.
Placement accuracy: SIPLACE benchmark value [components/h]
The values are measured during the machine acceptance tests and correspond to the conditions set
out in the SIPLACE scope of service and supply.
The relevant placement accuracy is only guaranteed if the room temperature is between 18°C and
28°C, does not vary by more than ± 1°C and was stable at least 48h before the placement process.
Single lane and dual lane conveyor with pickup from changeover table (SMT)
Process 4 gantries are evaluated statistically together.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Placement performance
2 x C&P20 M2 2 x C&P20 M2 25 µm/3 126,500
2 x C&P20 M2 2 x CPP M_L 25 µm/3 105,500
2 x CPP M_L 2 x CPP M_L 25 µm/3 85,500
Process: 4 gantries are evaluated statistically together.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Placement performance
2 x C&P20 M2 2 x C&P20 M2 20 µm/3 126,000
2 x C&P20 M2 2 x CPP M_L 20 µm/3 105,500
2 x CPP M_L 2 x CPP M_L 20 µm/3 85,000
Panel lane conveyor with pickup from changeover table (SMT)
Process 2 gantries work in one placement area and are evaluated independently from
one another for statistical purposes.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Placement performance
2 x C&P20 M2 2 x C&P20 M2 15 µm/3 83,000
2 x C&P20 M2 2 x CPP M_L 15 µm/3 73,000
2 x CPP M_L 2 x CPP M_L 15 µm/3 63,000
Instruction manual SIPLACE CA4 V2 3 Technical data and assemblies
From software version 713.0 Edition 12/2019 3.1 Placement performance and accuracy
97
3.1.2 Placement performance and accuracy with SWS
Placement head types:
SIPLACE SpeedStar (C&P20 M2)
SIPLACE MultiStar (CPP M)
Placement performance:
The placement performance is affected by the different head combinations and positions, plus the
conveyor configuration. Individual options and customized applications also influence the placement
performance. On request, SIPLACE can calculate the actual performance of your product on your
machine configuration.
Placement accuracy: SIPLACE benchmark value [components/h]
The values are measured during the machine acceptance tests and correspond to the conditions set
out in the SIPLACE scope of service and supply.
The relevant placement accuracy is only guaranteed if the room temperature is between 18°C and
28°C, does not vary by more than ± 1°C and was stable at least 48h before the placement process.
Panel lane conveyor with pickup from SIPLACE Wafer System
Process
4 gantries are evaluated statistically together.
The CMK value is NOT included in the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x C&P20 M2 2 x C&P20 M2 20 µm/3 46,000 30,000
2 x C&P20 M2 2 x CPP M_L 20 µm/3 43,500 29,500
2 x CPP M_L 2 x CPP M_L 20 µm/3 41,000 29,000
Process 2 gantries work in one placement area and are evaluated independently from one
another for statistical purposes.
The CMK value is NOT included in the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x C&P20 M2 2 x C&P20 M2 12 µm/3 46,000 30,000
2 x C&P20 M2 2 x CPP M_L 12 µm/3 43,500 29,500
2 x CPP M_L 2 x CPP M_L 12 µm/3 41,000 29,000
Wafer lane conveyor with pickup from the SIPLACE Wafer System
Process 2 gantries work in one placement area and are evaluated together for statistical
purposes.
The CMK value is included IN the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x C&P20 M2 2 x C&P20 M2 10 µm/3 46,000 30,000
2 x C&P20 M2 2 x CPP M_L 10 µm/3
*a
43,500 29,500
Process 2 gantries work in one placement area and are evaluated together for statistical
purposes.
The CMK value is NOT included in the calculation.
PA 1 PA2 Accuracy Flip chip process Die attach process
2 x CPP M_L 2 x CPP M_L 10 µm/3 41,000 29,000
2 x C&P20 M2 2 x CPP M_L 10 µm/3
*b
43,500 29,500
*)a The accuracy of 10 µm/3 (the CMK value IS included in the calculation) only applies to the C&P20 M2.
*)b The accuracy of 10 µm/3
(the CMK value is NOT included in the calculation) only applies to the C&P20 M2.