IPC-7093 CN 2011 底部端子元器件(BTC)设计和组装工艺的实施.pdf - 第114页
LGA ( Land Grid Array ) 盘 栅阵 列 LMC ( Least Material Condition ) 最 小材 料 条 件 MCM ( Multichip Module ) 多芯片模块 MCM-L ( Multichip Module-Laminate ) 多芯片模块 - 层压 板 MCP ( Multichip Package ) 多芯片 封装 MD ( Metal Defined ) 指 定 金属 MDS …
10 术语及缩写
AABUS (As Agreed Upon Between User
and Supplier)
由供需双方协商确定
ASIC (Application Specific IC)
专用集成电路
ASM (Array Surface Mount)
阵列表面贴装
ASMP (Application Specific Module
Packaging)
专用模块封装
BGA (Ball Grid Array)
球栅阵列
BOC (Board-On-Chip)
芯片上板
BT (Bismaleimide-Triazine)
双马来酰亚胺三嗪
BTC (Bottom Termination Component)
底部端子元器件
CBGA (Ceramic Ball Grid Array)
陶瓷球栅阵列
CGA (Column Grid Array)
柱栅阵列
COB (Chip-On-Board)
板上芯片
CPU (Central Processing Unit)
中央处理单元
CSP (Chip Scale Packages)
芯片级封装
CTE (Coefficient of Thermal Expansion
)
热膨胀系数
CTF (Critical To Function)
关键功能
DAP (Die Attach Pad)
芯片连接盘
DBDPE (Decabromodiphenyl Ether)
十溴二苯醚
Df (Dissipation Factor)
耗散因子
DF (Dual Flat o-Lead)
双列扁平无引线
DfR (Design for Reliability)
可靠性设计
DIG (Direct Immersion Gold)
直接浸金
Dk (Dielectric Constant)
介电常数
EEPIG (Electroless ickel/Electroless
Palladium/Immersion Gold)
化学镍钯/浸金
EIG (Electroless ickel Immersion Gold)
化学镍浸金
FAT (Flux Activation Time)
助焊剂激活时间
FBGA (Fine Pitch Ball Grid Array)
细间距球栅阵列
FC (Flip Chip)
倒装芯片
FPT (Fine Pitch Technology)
细间距技术
HASL (Hot Air Solder Leveling)
热风焊料整平
HAST (Highly Accelerated Stress Testing)
加速应力测试
HDB (High Density Printed Boards)
高密度印制电路板
I/O (Input/Output)
输入/输出
IMC (Intermetallic Compound)
金属间化合物
IR (Infrared)
红外
LCP (Liquid Crystal Polymer)
液晶高分子化合物
LFBGA (Low-Profile Fine-Pitch Ball
Grid Array)
低外形细间距球栅阵列
2011年3月 IPC-7093-C
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Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
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LGA (Land Grid Array)
盘栅阵列
LMC (Least Material Condition)
最小材料条件
MCM (Multichip Module)
多芯片模块
MCM-L (Multichip Module-Laminate)
多芯片模块-层压板
MCP (Multichip Package)
多芯片封装
MD (Metal Defined)
指定金属
MDS (MDS Device Subassembly)
多元器件子组件
MLC (Multilayer Ceramic)
多层陶瓷
MMB (Moisture Membrane Bag)
隔潮袋
MMC (Maximum Material Conditions)
最大材料条件
MSL (Moisture Sensitivity Level)
湿敏等级
SMD (on Solder Mask Defined)
非阻焊限定
OEM (Original Equipment Manufacturer)
原始设备制造商
OSP (Organic Solderability Preservative)
有机
可焊性保护
PBB (Polybrominated Biphenyl)
多溴化联二苯
PBBO (Polybrominated Biphenyl Oxide)
多溴联苯氧化物
PBDE (Polybrominated Diphenyl Ether)
多溴联苯醚
PBGA (Plastic Ball Grid Array)
模封球栅阵列
PCA (Printed Circuit Assembly)
印制电路组装
PCB (Printed Circuit Board)
印制电路板
PCM (Phase Change Materials)
相变材料
PLCC (Plastic Leaded Chip Carrier)
塑料有引线芯片载体
PSA (Pressure Sensitive Adhesive)
压敏粘胶剂
PTH (Plated Through Hole)
镀覆孔
QF (Quad Flat o-Lead)
方形扁平无引线
QFP (Quad Flat Pack)
方形扁平封装
RDS (Rectangular Die Size)
矩形芯片尺寸
RF (
Radio Frequency)
射频
RFID (Radio Frequency Identification)
射频标识
RMS (Root Mean Square)
均方根
RoHS (Restriction of Harmful Substance)
有害物质限制
SDRAM (Synchronous Dynamic Random
Access Memory)
同步动态随机存取内存
SMD (Solder Mask Defined)
阻焊限定
SMOBC (Solder Mask Over Bare Copper)
裸铜上覆盖阻焊膜
SMT (Surface Mount Technology)
表面贴装技术
SO-DIMM (Small Outline-Dual In-Line
Memory Module)
小外形双排直列内存模组
SOIC (Small Outline Integrated Circuit)
小外形集成电路
SO (Small Outline o-Lead)
小外形无引线封装
SPC (Statistical Process Control)
统计过程控制
IPC-7093-C 2011年3月
102
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
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SRAM (Static Random Access Memory)
静态随机存取内存
SSO (Synchronously Switching Output)
同步开关输出
TAB (Tape Automatically Bonding)
载带自动键合
TBBPA (Tetrabromobisphenol A)
四溴双酚－A
T
d
(Decomposition Temperature )
分解温度
TFBGA (Thin Profile Fine Pitch Ball
Grid Array)
薄形细间距球栅阵列
T
g
(Transition Temperature)
转化温度
TIM (Thermal Interface Temperature)
热界面温度
UFPT (Ultra Fine Pitch Technology)
超细间距技术
UtRAM (Uni-Transistor Random
Access Memory)
单晶随机存取内存
UUT (Unit Under Test)
待测试产品
UV (Ultraviolet)
紫外
VFBGA (Very-Thin Profile Fine-Pitch
Ball Grid Array)
极薄外形细间距球栅阵列
11 参考⽂献
1. D. Bernard and B. Willis, Common Process
Defect Identification of QF Packages Using
Optical and X-Ray Inspection. SMTAI Proceed-
ings, 2007
2. F. Schuler, M. Rosch, Johannes Horber, Klaus
Feldmann, Reliability Aspects of Electronic
Devices for Advanced Packages, Circuit World,
Vol 34, o 3, 2008.
3. A. Syed, and W. J. Kang, Board Level Assembly
And Reliability Considerations For Qfn Type
Packages, SMTAI Proceedings, 2003
4. Engelmaier, W., Surface Mount Solder Joint
Reliability: Issues, Design, Testing, Prediction,
Workshop otes, Engelmaier Associates, Inc.,
Mendham, J, 1995.
2011年3月 IPC-7093-C
103
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,,,`,,,```,``````,`,,`,`-`-`,,`,,`,`,,`---