IPC-7093 CN 2011 底部端子元器件(BTC)设计和组装工艺的实施.pdf - 第6页
特别感谢以下⼈⼠，他们的奉献使 这个项⽬得以实现。在这⾥特别 强 调 那些为这份标准的开发作出了重⼤贡献 的个⼈。 Dudi Amir, Intel Corporation Richard Arnold, Continental Automotive Systems Raiyomand Aspandiar, Intel Corporation Scott Buttars, Intel Corporation Beverley Chris…
鸣谢
任何包含复杂技术的标准都要有大量的资料来源。我们不可能罗列所有参与和支持本标准开发的个人和单位，下面
仅列出组装与连接工艺委员会(5-20)底部端子元器件(BTC)任务组(5-21h)的主要成员。然而，我们不得不提到IPC
TGAsia 5-21hC技术组的成员，他们力求译文文字的信达雅，为此标准中文版的翻译、审核付出了艰苦的劳动。我
们在此一并对上述各有关组织和个人表示衷心的感谢。
组装与连接⼯艺委员会 底部端⼦元器件(BTC)任务组 IPC董事会技术联络员
主席
Leo P. Lambert
EPTAC Corporation
联合主席
Ray Prasad
Ray Prasad Consultancy Group
Vern Solberg
Solberg Technical Consulting
Peter Bigelow
IMI Inc.
Sammy Yi
Aptina Imaging Corporation
底部端⼦元器件(BTC)任务组
Dudi Amir, Intel Corporation
Richard Arnold, Continental
Automotive Systems
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
David Bernard, ordson DAGE X-ray
Systems
Scott Buttars, Intel Corporation
Fritz Byle, Astronautics Corp. of
America
Beverley Christian, Research In
Motion Limited
Michael Davisson, Agilent
Technologies
C. Don Dupriest, Lockheed Martin
Missiles and Fire Control
Harold Ellison, Quantum Corporation
Werner Engelmaier, Engelmaier
Associates, L.C.
Rei Fang, Cypress Semiconductor
Zhen Feng, Flextronics
Joe Fjelstad, Verdant Electronics
Mark Fulcher, Continental Automotive
Systems
Lionel Fullwood, WKK Distribution
Ltd.
Ava Fung, Trimble avigation
Thomas Gardeski, Gemini Sciences
David Geiger, Flextronics
International
Michael Green, Lockheed Martin
Space Systems Company
Hue Green, Lockheed Martin Space
Systems Company
Bill Hanna, Agilent Technologies
Gaston Hidalgo, Samsung
Telecommunications America
Craig Hillman, DfR Solutions
David Hillman, Rockwell Collins
Constantin Hudon, Varitron
Technologies Inc.
Bruce Hughes, U.S. Army Aviation &
Missile Command
Greg Hurst, BAE Systems
Jennie Hwang, H-Technologies Group
Clyde Ishikawa, Trimble avigation
Glenn Koscal, Carsem
William Kunkle, MET Associates Inc.
Murad Kurwa, Flextronics
International
Paul Lotosky, Cookson Electronics
Todd MacFadden, Bose Corporation
Brian Madsen, Continental
Automotive Systems
Kelly Miller, SigmaPoint
Technologies Inc.
David elson, Adtran Inc.
Jack Olson, Caterpillar Inc.
Richard Otte, PROMEX
Industries, Inc.
Ray Prasad, Ray Prasad Consultancy
Group
Eric Radza, SiTIme Corporation
Stanton Rak, Continental Automotive
Systems
Robert Rowland, RadiSys Corporation
Greg Ruiz, Flextronics
Jeff Shubrooks, Raytheon Company
Jerry Smith, Foxconn PCE
Technology Inc.
Vern Solberg, Solberg Technical
Consulting
Richard Stadem, General Dynamics
Info. Sys., Inc
Becky Travelstead, TechSearch
International Inc.
Cheryl Tulkoff, DfR Solutions
E. Jan Vardaman, TechSearch
International Inc.
Teresita Villavert, Flextronics
Bill Werner, Trimble avigation
Robert Wettermann, BEST Inc.
Dewey Whittaker, Honeywell Inc.
Air Transport Systems
Ian Williams, Intel Corporation
Bob Willis, The SMART Group
Linda Woody, Lockheed Martin
Missile & Fire Control
Dongji Xie, Flextronics International
2011年3月 IPC-7093-C
iii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,,,`,,,```,``````,`,,`,`-`-`,,`,,`,`,,`---
特别感谢以下⼈⼠，他们的奉献使这个项⽬得以实现。在这⾥特别强调那些为这份标准的开发作出了重⼤贡献
的个⼈。
Dudi Amir, Intel Corporation
Richard Arnold, Continental
Automotive Systems
Raiyomand Aspandiar, Intel
Corporation
Scott Buttars, Intel Corporation
Beverley Christian, Research In
Motion Limited
Werner Engelmaier, Engelmaier
Associates
David Hillman, Rockwell Collins
Bruce Hughes, U.S. Army Aviation &
Missile Command
David elson, Adtran
Dick Otte, Promex
Ray Prasad, Ray Prasad Consultancy
Group
Stan Rak, Continental Automotive
Systems
Robert Rowland, RadiSys
Jeff Shubrooks, Raytheon Company
Vern Solberg, Solberg Technical
Consulting
Kris Troxel, Hewlett Packard
Bill Werner, Trimble avigation
Robert Wettermann, BEST Inc.
Bob Willis, The SMART Group
Linda Woody, Lockheed Martin
Missile & Fire Control
插图由以下企业提供：
Amkor Technologies: Figures, 3-5, 3-6, 3-7, 4-28, 4-29, 4-35, 6-8, 6-16, 6-17, 6-21, 6-22, 6-23, 8-1, 8-2, 8-3, 8-5, Table 4-7
Analog Devices: Figures 4-40, 4-42,6-4, 6-8, 6-11, 6-14, 7-24, 7-27, 7-28, Table 4-9
BEST Inc.: Figures 7-28, 7-33, 7-34, 7-35
Continental Automotive Systems: Figures 7-19, 7-20, 7-21, 7-22
Fairchild Semiconductor: Figure 4-36
Intersil: Figure 4-37
Intel Corporation: Figures 9-3, 9-4, 9-10, 9-11, 9-12, 9-19, 9-20, 9-21, 9-27, 9-28
JEDEC: Figures 4-6, 4-7, 4-8, 4-12, 4-13, 4-17, 4-18, 4-20, 4-21, 4-38, 4-39, 4-43
Martin GmbH: Figure 7-32
Mini Micro Stencil: Figure 7-29
ational Semiconductor: Figures 4-41, 6-3, 6-9, 7-1, 7-2, 7-3, 7-10, 7-11, 7-15
QPL Group: Figure 6-2
Raytheon Co.: Figure 7-14, 7-18
IPC TGAsia 5-21hC技术组成员：
李建江(主席)
谢自力
黄志宏
覃大勇
宋复斌
周峰
李易展
黄艳斌
李春灵
何健
向雪莲
史玉泉
张奇坤
史洪宾
曾翔宇
黄国城
张超
上海忠麟电子企业有限公司
上海忠麟电子企业有限公司
兢陆电子(昆山)有限公司
上海忠麟电子企业有限公司
天弘(东莞)科技有限公司
株洲南车时代电气股份有限公司
宜特科技股份有限公司
巴诺(上海)信息科技有限公司
中国电子科技集团公司第四十一研究所
福建捷联电子有限公司
精博电子(南京)有限公司
南京华士电子科技有限公司
无锡普洛菲斯电子有限公司
三星电子有限公司
深圳爱升精密电路科技有限公司
英业达股份有限公司
中国电子科技集团公司第四十一研究所
IPC-7093-C 2011年3月
iv
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,,,`,,,```,``````,`,,`,`-`-`,,`,,`,`,,`---
⽬录
1 范围 ............................................................................ 1
1.1 目的 ..................................................................... 1
1.2 内容 ..................................................................... 1
2 适⽤⽂件 ................................................................... 1
2.1 IPC ........................................................................ 1
2.2 JEDEC .................................................................. 1
3 标准选择和BTC实施管理 ....................................... 2
3.1 术语及定义 ......................................................... 2
3.1.1 底部端子元器件(BTC) ...................................... 2
3.1.2 元器件贴装位置 ................................................. 2
3.1.3 导电图形* ........................................................... 2
3.1.4 焊盘图形* ........................................................... 2
3.1.5 元器件混装技术* ............................................... 2
3.1.6 印制板组装 ......................................................... 2
3.1.7 表面贴装技术(SMT)* ....................................... 2
3.2 BTC概要 .............................................................. 2
3.3 不同元器件结构描述 ......................................... 3
3.4 总经营成本 ......................................................... 6
3.5 QF类型BTC封装的设计和组装过程注
意事项 ................................................................. 6
3.6 未来的需求和期望 ............................................. 8
4 元器件考虑 ............................................................... 8
4.1 不同BTC封装类型的总体说明 .......................... 8
4.2 BTC的详细说明和标准 ...................................... 9
4.2.1 单排模封引线框封装 ......................................... 9
4.2.2 多排模封基于引线框封装 ............................... 10
4.2.3 JEDEC 95号出版物设计指南4.8 ..................... 10
4.2.4 JEDEC 95
号出版物设计指南4.23 ................... 13
4.2.5 JEDEC 95号出版物设计指南4.19 .................... 16
4.3 QF和SO封装详细说明 ............................... 18
4.3.1 制造方法 ........................................................... 18
4.3.2 缺陷类型 ........................................................... 22
4.3.3 标记选择 ........................................................... 22
4.3.4 使用的材料 ....................................................... 22
4.3.5 可焊性测试 ....................................................... 22
4.4 定制的QF和SO(DF) ............................... 22
4.5 LGA、QF和SO(DF)基于基材的
封装的详细说明 ............................................... 24
4.5.1 基于基材封装的制造方法 ............................... 24
4.5.2 缺陷类型 ........................................................... 26
4.5.3 标记选择 ........................................................... 26
4.5.4 使用的材料 ....................................................... 27
4.6 市场产品变化说明 ........................................... 27
4.6.1 MLF®，MLP和MLFP
TM
元器件的详细说明 .. 27
4.6.2 LLC™和LFCSP™元器件详细说明 ................ 29
4.7 封装和搬运 ....................................................... 31
5 安装结构 ................................................................. 32
5.1 安装结构的类型 ............................................... 32
5.1.1 有机树脂类 ....................................................... 32
5.1.2 无机结构 ........................................................... 32
5.1.3 分层(多层、顺序/叠加和高密度互连) ........... 32
5.2 安装结构的特性 ............................................... 33
5.2.1 树脂系列 ........................................................... 33
5.2.2 加固材料 ........................................................... 33
5.2.3 高温无铅制程焊接的可靠性问题 ................... 34
5.2.4 热膨胀 ............................................................... 34
5.2.5 吸湿性 ............................................................... 35
5.2.6 平整度(拱曲和扭曲) ....................................... 35
5.3 表面处理 ........................................................... 35
5.3.1 热风焊料整平(HASL) ..................................... 36
5.3.2 有机表面保护(可焊性有机保护)膜 ............... 36
5.3.3
贵金属镀层/涂层 ............................................. 37
5.4 阻焊膜 ............................................................... 40
5.4.1 湿膜和干膜阻焊膜 ........................................... 41
5.4.2 感光阻焊膜 ....................................................... 41
5.4.3 对位 ................................................................... 41
5.4.4 导通孔保护 ....................................................... 42
5.5 热扩散结构整合(例如，金属芯板) ............... 43
5.5.1 层压顺序 ........................................................... 43
5.5.2 热传导通道 ....................................................... 45
5.5.3 散热焊盘粘接 ................................................... 45
5.5.4 散热导通孔 ....................................................... 46
5.6
无焊互连结构 ................................................... 46
6 印制电路组件设计注意事项 ................................. 47
6.1
BTC元器件描述 ................................................ 47
6.1.1
BTC封装变化 .................................................... 47
6.1.2
端子形式 ........................................................... 48
6.1.3
安装条件 ........................................................... 48
6.1.4
封装公差 ........................................................... 55
6.1.5
连接技术 ........................................................... 59
2011年3月 IPC-7093-C
v
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,,,`,,,```,``````,`,,`,`-`-`,,`,,`,`,,`---