IPC-7093 CN 2011 底部端子元器件(BTC)设计和组装工艺的实施.pdf - 第4页

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IPC-7093 CN
底部端⼦元器件(BTC)设计和组
装⼯艺的实施
由IPC组装与连接工艺委员会(5-20)
IPC底部端子元器件(BTC)任务组(5-21h)
开发；由IPC TGAsia 5-21hC技术组翻译
鼓励本标准的使用者参加未来修订版的开发。
联系方式：
IPC
3000 Lakeside Drive
Suite 309S
Bannockburn, Illinois
60015-1249
Tel 847 615.7100
Fax 847 615.7105
IPC 中国
电话：400-621-8610
+86-21-2221-0000
邮箱：BDAChina@ipc.org
网址：www.ipc.org.cn
上海青岛深圳北京苏州成都
If a conflict occurs
between the English
and translated versions
of this document, the
English version will
take precedence.
本文件的英文版本与翻
译版本如存在冲突, 以
英文版本为优先。
®
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,,,`,,,```,``````,`,,`,`-`-`,,`,,`,`,,`---
此页留作空白
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,,,`,,,```,``````,`,,`,`-`-`,,`,,`,`,,`---
鸣谢
任何包含复杂技术的标准都要有大量的资料来源。我们不可能罗列所有参与和支持本标准开发的个人和单位，下面
仅列出组装与连接工艺委员会(5-20)底部端子元器件(BTC)任务组(5-21h)的主要成员。然而，我们不得不提到IPC
TGAsia 5-21hC技术组的成员，他们力求译文文字的信达雅，为此标准中文版的翻译、审核付出了艰苦的劳动。我
们在此一并对上述各有关组织和个人表示衷心的感谢。
组装与连接⼯艺委员会 底部端⼦元器件(BTC)任务组 IPC董事会技术联络员
主席
Leo P. Lambert
EPTAC Corporation
联合主席
Ray Prasad
Ray Prasad Consultancy Group
Vern Solberg
Solberg Technical Consulting
Peter Bigelow
IMI Inc.
Sammy Yi
Aptina Imaging Corporation
底部端⼦元器件(BTC)任务组
Dudi Amir, Intel Corporation
Richard Arnold, Continental
Automotive Systems
Raiyomand Aspandiar, Intel
Corporation
Elizabeth Benedetto, Hewlett-Packard
Company
David Bernard, ordson DAGE X-ray
Systems
Scott Buttars, Intel Corporation
Fritz Byle, Astronautics Corp. of
America
Beverley Christian, Research In
Motion Limited
Michael Davisson, Agilent
Technologies
C. Don Dupriest, Lockheed Martin
Missiles and Fire Control
Harold Ellison, Quantum Corporation
Werner Engelmaier, Engelmaier
Associates, L.C.
Rei Fang, Cypress Semiconductor
Zhen Feng, Flextronics
Joe Fjelstad, Verdant Electronics
Mark Fulcher, Continental Automotive
Systems
Lionel Fullwood, WKK Distribution
Ltd.
Ava Fung, Trimble avigation
Thomas Gardeski, Gemini Sciences
David Geiger, Flextronics
International
Michael Green, Lockheed Martin
Space Systems Company
Hue Green, Lockheed Martin Space
Systems Company
Bill Hanna, Agilent Technologies
Gaston Hidalgo, Samsung
Telecommunications America
Craig Hillman, DfR Solutions
David Hillman, Rockwell Collins
Constantin Hudon, Varitron
Technologies Inc.
Bruce Hughes, U.S. Army Aviation &
Missile Command
Greg Hurst, BAE Systems
Jennie Hwang, H-Technologies Group
Clyde Ishikawa, Trimble avigation
Glenn Koscal, Carsem
William Kunkle, MET Associates Inc.
Murad Kurwa, Flextronics
International
Paul Lotosky, Cookson Electronics
Todd MacFadden, Bose Corporation
Brian Madsen, Continental
Automotive Systems
Kelly Miller, SigmaPoint
Technologies Inc.
David elson, Adtran Inc.
Jack Olson, Caterpillar Inc.
Richard Otte, PROMEX
Industries, Inc.
Ray Prasad, Ray Prasad Consultancy
Group
Eric Radza, SiTIme Corporation
Stanton Rak, Continental Automotive
Systems
Robert Rowland, RadiSys Corporation
Greg Ruiz, Flextronics
Jeff Shubrooks, Raytheon Company
Jerry Smith, Foxconn PCE
Technology Inc.
Vern Solberg, Solberg Technical
Consulting
Richard Stadem, General Dynamics
Info. Sys., Inc
Becky Travelstead, TechSearch
International Inc.
Cheryl Tulkoff, DfR Solutions
E. Jan Vardaman, TechSearch
International Inc.
Teresita Villavert, Flextronics
Bill Werner, Trimble avigation
Robert Wettermann, BEST Inc.
Dewey Whittaker, Honeywell Inc.
Air Transport Systems
Ian Williams, Intel Corporation
Bob Willis, The SMART Group
Linda Woody, Lockheed Martin
Missile & Fire Control
Dongji Xie, Flextronics International
2011年3月 IPC-7093-C
iii
Copyright Association Connecting Electronics Industries
Provided by IHS under license with IPC
Not for Resale, 11/27/2015 17:57:03 MST
No reproduction or networking permitted without license from IHS
--`,`,,,,,,`,,,```,``````,`,,`,`-`-`,,`,,`,`,,`---