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User Manual HS-50 6 Vision functions Software-Version 5.01Edition 01/99 6.7 Guidelines for Describing Package Form s 299  Display component Always identical? No No Yes Error message occurred? Yes Modify package form as …

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6 Vision functions User Manual HS-50
6.7 Guidelines for Describing Package Forms Software-Version 5.01 Edition 01/99
298
Irregular
FDC
Regular
F
ully defined Comp.
P
artially defined
C
omponent
Ball Grid Array
Body dimensions
Body dimensions Body dimensions
SAVE
Continue programming at the station
New component
GF file
present?
No
Yes
Program additional file information
Please note that when
standard package form
are used by TEST
COMPONENT,
the component detection
may be changed (copy the
GF file [ _.SST file ] again,
if necessary).
Program GF file with
No. > 1499
Select package type
Program GF file with
No. > 1499
Enter
user comment
Enter
user comment
Enter
user comment
Enter
user comment
GF nominal dimensions
and tolerances
GF nominal dimensions
and tolerances
GF nominal dimensions
and tolerances
GF nominal dimensions
and tolerances
Program
group of leads,
lead model data
Program
group of leads,
lead model data
Program
ball pitch,
lead model data
Editing data
Nozzle type (camera)
sensor system type,
vacuum checks/
editing parameters/
reduction in acceleration
Editing data
Nozzle type (camera)
sensor system type,
vacuum checks/
editing parameters/
reduction in acceleration
Editing data
Nozzle type (camera)
sensor system type,
vacuum checks/
editing parameters/
reduction in acceleration
Editing data
Nozzle type (camera)
sensor system type,
vacuum checks/
editing parameters/
reduction in acceleration
User Manual HS-50 6 Vision functions
Software-Version 5.01Edition 01/99 6.7 Guidelines for Describing Package Forms
299
Display component
Always identical?
No
No
Yes
Error message
occurred?
Yes
Modify package form as required in "Vision system“ and "Test component“
Send program and set-up with this package form to the station and set up
Revolver head
Pick-up GF (component)
Pick&Place placement head
Pick up GF (component)
Measure component
Check GF (component), press
Return for next meas. step
Display component
Check GF (component), press
Return for next meas. step
Measure GF (component)
Repeat meas. process several
times (move component onto
nozzle to simulate picking up
different components)
and check results
Assemble component
several times
Important note:
The manipulation of
components at the station
must remain the exception,
rather than the rule.
In general, only a few
components have to be
changed.
1. Handling error: pick-up angle,
nozzle type, CO on nozzle etc.
2. Display component
3. Modify lighting
4. Modify measuring modes
and measuring parameters
5. Modify component dimension
6. Modify pin/ball contrast
7. Modify pin/bal
dimensions
8. Program contrast
(program table)
6 Vision functions User Manual HS-50
6.7 Guidelines for Describing Package Forms Software-Version 5.01 Edition 01/99
300
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*) LEAD with combined analysis windows for each row of pins replaces the CORNER measuring
method.
Measurement of the spacing is replaced by measurement of the (standardized) lead deviation.
If one or more of the results are outside the tolerance, the component will not be placed.
If the component cannot be centered correctly, additional measuring methods may be omitted.
You should, however, carry out all the rough centering steps since these reduce the size of the
measuring window.
In the ’Test component’ menu, the components are optically centered in the individual measur-
ing steps, via the ’Check component’ function, but the results are not output.
In the ’Test component’ menu, the components are optically centered in the individual measur-
ing steps, via the ’Measure component’ function, but the results are not output.
If the components are larger than 32 mm x 32 mm, a multiple measurement will be carried out
Design
SIZE
ROW
CORNER
Lead *)
Combined
Lead Separate
analysis window
Grid
Ball
Result of the last measuring
step
PDC without lead G/F
X, Y, (∆φ), Component
length, width, (quality)
PDC rounded image G/F Angular tolerance
Small FDCs, e.g.
2 leads
G/F
X, Y, (∆φ), Component
length, width, (quality)
FDC, regular with short
rows of PINs
G F (F)
Max. deviation from the spac-
ing: X, Y, ∆φ,
(quality)
FDC, regular with long
rows of PINs
G F (F)
Max. deviation from the spac-
ing: X, Y, (∆φ),
quality
FDC irregular with short
rows of PINs
G(G)F(F)
X, Y, number of PINs
(quality), max. deviation from
the spacing
FDC, irregular with long
rows of PINs
G(G)F(F)
X, Y, number of PINs
(quality), max. deviation from
the spacing
FDC, irregular with one
row of PINs, several PIN
models or spacings
GGF
X, Y, (∆φ), standardized
lead deviation (quality)
Number of PINs, secondary
offset
FDCs with circular seg-
ment PIN arrangements
(G) G F
X, Y, (∆φ), standardized
lead deviation (quality)
Number of PINs, secondary
offset
BGA, flip-chip G G F
X, Y, (∆φ), spacing,
angle, quality)
Tab. 6.7.1 Component measuring methods