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User manual SIPLAC E HF series 3 Technical data Software Vers ion SR.50x.xx 01/2006 US Edition 3.1 Description of the machine 93 3 T echnical dat a 3.1 Description of the machine 3.1. 1 Ove rview The SMD p lacement syste…
2 Operational safety User manual SIPLACE HF series
2.11 ESD guidelines Software Version SR.50x.xx 01/2006 US Edition
92
User manual SIPLACE HF series 3 Technical data
Software Version SR.50x.xx 01/2006 US Edition 3.1 Description of the machine
93
3 Technical data
3.1 Description of the machine
3.1.1 Overview
The SMD placement systems from the SIPLACE HF series are characterized by their high config-
uration flexibility, excellent placement rate and maximum precision. The machines cover the SMD
spectrum of components from 0201 to 125 x 10 mm² with a high placement rate.
Two placement methods are used:
–the Collect&Place method with revolver heads for components from size 0201 to fine-pitch
–the Pick&Place method with the SIPLACE TwinHead for fine-pitch and OSC components
3
Fig. 3.1 - 1 HF/3 placement machine, overview
3 Technical data User manual SIPLACE HF series
3.1 Description of the machine Software Version SR.50x.xx 01/2006 US Edition
94
The placement machines are based on a torsionally-rigid and vibration-damped cast steel ma-
chine frame. This guarantees an excellent production quality and less environmental pollution for
employees since the noise of shaking and vibration are reduced to a minimum.
The HF placement machine has two gantries. The HF/3 machine is equipped with three gantries.
There is a placement head on each gantry. These can be quickly and accurately positioned by
linear motors, moving independently of one another in the X and Y directions.
According to the head modularity principle developed by Siemens, the placement heads can be
quickly and easily changed. An overview of the placement head configuration can be found in sec-
tion 3.7
, page 115.
There are four locations for feeding components. Up to four component trolleys or, alternatively,
one or two matrix tray changers (HF/3: one MTC) can be docked in, rather than the component
trolleys.
The placement heads fetch the components from the fixed feeder modules on the component trol-
ley or from the trays in the matrix tray changer, and place the PCBs, which are also stationary.
The placement machines from the HF series have two placement areas:
– on the single conveyor, one or two PCBs can be placed concurrently.
– on the dual conveyor, up to four PCBs can be placed concurrently.
The principle of the "stationary component supply" and "stationary PCB", which has proved most
suitable for all SIPLACE placement machines, has a number of significant advantages:
– There are no downtimes for topping up components or splicing tapes.
– The vibration-free component feeder means that even the smallest components (e.g. 0201)
are picked up reliably.
– The PCB, which does not move during the placement process, prevents the components slip-
ping.
– The combination of placement heads with nozzle changers always guarantees an optimum
nozzle configuration for every placement process, thus minimizing traversing paths and opti-
mizing the placement sequence.
High flexibility, cost-effectiveness and set-up reliability combine to ensure that the SIPLACE HF
series provides high productivity. Minimum down times increase utilization and thus help to in-
crease productivity.