Oxford-100-Manual.pdf - 第119页

System Manual Oxford Instruments Plasma Technology WARNING PlasmalabSystem 100 BEFORE PROCEEDING WITH ANY MAINTENANCE WORK, READ SECTION 1 - HEALTH AND SAFETY. 6. Maintenance 6. Maintenance 6-1 6.1 Customer support facil…

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PlasmalabSystem100
Oxford
Instruments
Plasma
Technology
System Manual
Hide
events
after
selection
button
Show
all
events
button:
5.9 Log
files
Displays all events
before
and including
the
highlighted
event.
Displays all previously
hidden
events.
While
PC
2000
is
running,
two
log
files are
maintained,
one
for
the
system log and
the
other
for
the
data log. These files are stored
on
your
hard disk in
the
folder
C:\Optsyslg. Details
of
the
log
files are
as
follows.
System
log
file
- The
filename
for
this
file
is
of
the
form
sOCaabb
where
aa
represents
the
month,
e.g. 06
(for
June) and
bb
represents
the
day
of
the
month,
e.g.
11
(for
the
eleventh
day).
Data
log
file
- The
filename
for
this
file
is
of
the
form
p1caabb
where
aa
represents
the
month,
e.g. 06
(for
June) and
bb
represents
the
day
of
the
month,
e.g.
11
(for
the
eleventh
day).
When
PC
2000
is
shut
down
correctly (select
the
System menu,
then
the
Exit
option),
both
log
files are
automatically
saved and closed.
If
PC
2000
is
then
started again,
the
files are
automatically
opened
and
their
data
is
available via
the
System Log page and
the
Select Log
Data page.
If
PC
2000
is
not
shut
down
correctly, e.g.
the
PC
is
switched
off
or
the
PC
'hangs' etc.,
one
or
both
of
the
log
files can become
corrupted.
If
this
happens,
the
next
time
PC
2000
is
started
the
corrupt
log file(s)
will
be
detected
and
reported
on-screen
by
an
error
dialogue. To
correct this
problem,
use
the
following
procedure:
1)
Close
PC
2000.
2)
Use
Windows
Explorer
to
navigate
to
C:\Optsyslg.
3)
Delete
the
reported
log
file.
4)
Re-start
PC
2000.
UC
Davis 94-721001
Issue
1:
March 06
Operating
Instructions
Page 5-52
of
52
Printed: 22-Mar-06. 10:42
System
Manual
Oxford
Instruments Plasma Technology
WARNING
PlasmalabSystem
100
BEFORE
PROCEEDING WITH
ANY
MAINTENANCE WORK, READ SECTION 1 - HEALTH
AND
SAFETY.
6.
Maintenance
6.
Maintenance
6-1
6.1
Customer
support
facilities
6-3
6.2
General 6-4
6.3
Safety maintenance 6-5
6.3.1 Inspection and renewal 6-5
6.3.1.1
Quartz
components
6-5
6.3.1.2
Alumina
components
6-5
6.4
94-100-BW-2F
Base
wired
2-frame
kit
6-6
6.4.1
Weekly
6-6
6.4.2
Monthly
6-6
6.4.3
Three-Monthly
6-7
6.4.4
Annually
6-7
6.4.5 Changing
the
gas
bottles
6-7
6.4.6 Etch cleaning 6-7
6.5
94-100-3-41C
ICP
180 chamber
kit
with
gate
valve 6-9
6.5.1
Monthly
6-9
6.5.2 O-rings 6-9
6.6
Top
electrode 6-10
6.6.1
Monthly
6-10
6.6.2 Six-monthly (tools
with
a removable showerhead) 6-10
6.6.3
Annually
(tools having
access
to
the
gas
inlet
isolation assembly
from
the
top
side only) 6-10
6.7
94-100-5-12A Cryo He
lower
electrode
6-11
6.7.1
Monthly
6-11
6.8
94-100-6-500/200V
RIE
500W
RF
generator
/
OIPT
AMU
kit..
6-12
6.8.1
Three-monthly
6-12
6.9
Vacuum system 6-13
6.9.1 Active Pirani
gauge
6-13
6.9.2 Capacitance
manometer
6-13
6.9.2.1 Six-monthly (or
as
necessary) 6-13
6.9.3 Penning
gauge
6-13
6.9.3.1 Dismantling
the
body
tube
6-14
6.9.3.2 Cleaning 6-15
6.9.4
Turbomolecular
pumps 6-15
6.9.4.1 Daily 6-15
6.9.4.2 Re-greasing
of
turbo
pumps
fitted
to
process chambers 6-15
6.9.4.3 2000
to
8000 hours
(3
to
12 months):
pump
relubrication
6-15
6.9.4.4 Alcatel
turbo
pumps
fitted
with
bake-out
collars 6-16
6.9.5 Rotary vane pumps 6-16
6.10
Gas
handling
system 6-17
6.10.1
Wall-mounted
gas
pod
6-17
6.10.1.1
Annually
6-17
6.10.2 Mass
flow
controllers 6-17
6.10.2.1
Annually
(or
as
necessary) 6-17
6.10.3 Filters 6-17
6.10.3.1
Annually
(or
as
necessary) 6-17
6.11
Pump lubricants 6-18
Printed: 22-Mar-06, 7:41
Maintenance
Page
6-1
of
22
UC
Davis 94-721001
Issue
1:
March 06
PlasmalabSystem100
Oxford
Instruments
Plasma
Technology
WARNING
System Manual
BEFORE
PROCEEDING WITH
ANY
MAINTENANCE
WORK, READ SECTION 1 • HEALTH
AND
SAFETY.
6.11.1 General 6-18
6.11.2 Perfluorised polyethers 6-18
6.11.3 Hydrocarbon lubricants 6-19
6.12
94-1
00-5-12A Cryo I
heated
-150 I 400C He
lower
electrode
wafer
clamping
plate
changeover procedure 6-19
6.13
Adjusting
the
lower
electrode
wafer
clamp clamping force
6-21
6.14
Automatic
load lock end
effector
adjustments
for
different
wafer
sizes
6-22
Fig 6.1: 94-1 00-5-12A Cryo
I
heated
-150 I 400C
He
lower
electrode 6-20
Fig 6.2: Clamping force
adjustment
6-21
Fig 6.3: End
effector
wafer
size adjustments 6-22
UC
Davis 94-721001
Issue
1:
March 06
Maintenance
Page 6-2
of
22
Printed: 22-Mar-06,
7:41