Oxford-100-Manual.pdf - 第38页

Plasma lab System 100 Oxford Instruments Plasma Technology System Manual 3.1 Introduction The Plasma lab System 100 is a modular plasma processing system. It can be configured to carry out Reactive Ion Etching (RIE), Pla…

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System
Manual
Oxford
Instruments
Plasma
Technology
Plasma
lab
System
100
3.
Description
3.
Description
3-1
3.1
Introduction
3-2
3.2
PC
2000
Hardware
and
software
with
licence 3-2
3.2.1
Hardware
3-2
3.2.2
PC
2000
software
and single-user Iicence
3-2
3.3
94-100-0-RIE RIE
base
unit
3-2
3.3.1 Frame
3-3
3.3.2 Power
box
assembly
3-3
3.3.3 System
controller
3-3
3.3.4 Interlocks
3-5
3.3.5 Services 3-6
3.4
94-100-3-41C
ICP
180
chamber
kit
with
gate
valve
3-7
3.4.1 94-100-3-00/21P
Process
chamber electrical
heating
kit.. 3-8
3.4.2 94-100-3-00/05 200mm
Pumpdown
pipe
heater
kit
3-8
3.5
94-100-5-12A
Cryo
1
heated
-150/400C
helium-assisted
lower
electrode
..............•••.....••..3-9
3.6
94-100-6-500/200
500W
RF
generator
1OIPT
AMU
kit
3-12
3.7
94-100-6-56ICP
180
Inductively
Coupled
Plasma Source
3-12
3.8 Vacuum
system
3-12
3.9
Gas
handling
system
3-14
3.9.1 94-81-9-51/8
Gas
pod
(PLC
version) 3-14
3.9.2 94-81-9-11 Standard
non-toxic
gas line 3-16
3.9.3 94-81-9-21 Standard toxic gas line 3-17
3.9.4 94-81-9-00/4
Gas
line
interlock
kit
3-17
3.10
94-100-10-05C
Single
wafer
automatic
load
lock
3-18
3.10.1
Wafer
transfer
mechanism
operating
principle 3-19
3.10.2 Functional Description 3-20
3.10.3
Wafer
support
(end
effector)
3-22
Fig 3.1: Typical
control
system 3-4
Fig 3.2: 94-100-3-41C process chamber
3-7
Fig 3.3: 94-100-5-12A Cryo /
heated
-150/
400C He
lower
electrode
3-11
Fig 3.4:
UC
Davis 94-721001 vacuum system 3-13
Fig 3.5: 94-81-9-51
Gas
pod
3-15
Fig 3.6: 94-81-9-11 Standard
non-toxic
gas lines 3-16
Fig 3.7: 94-81-9-21 Standard toxic gas
line
3-17
Fig 3.8: Single
wafer
automatic
load lock 3-18
Fig 3.9: Simplified
wafer
transport
mechanism
operation
3-19
Fig 3.10:
Automatic
load lock, side
view
3-20
Fig 3.11:
Automatic
load lock
wafer
transport
mechanism
3-21
Table 3.1: Consequences
of
open circuit interlocks 3-6
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Description
Page
3-1
of
22
UC
Davis 94-721001
Issue
1:
March 06
Plasma
lab
System
100
Oxford
Instruments
Plasma
Technology
System Manual
3.1
Introduction
The
Plasma
lab
System
100
is
a
modular
plasma processing system.
It
can be
configured
to
carry
out
Reactive Ion Etching
(RIE),
Plasma Enhanced Chemical
Vapour
Deposition
(PECVD),
Inductively Coupled Plasma
(ICP)
and Electron Cyclotron Resonance
(ECR)
processes.
The system can be
tailored
to
suit
different
rates
of
throughput
using
transfer
and load lock
chambers
with
manual
or
automatic
loading.
Combinations
of
processes can be achieved by using a
transfer
chamber
robot
to
serve
up
to
four
process chambers.
3.2
3.2.1
3.2.2
PC
2000
Hardware
and
software
with
licence
Hardware
The system
is
controlled
and
monitored
by a
PC
compatible
computer
with
a
Microsoft
Windows
Operating
System. The
computer
is
fitted
with
a
floppy
disk drive and a CD-ROM
drive
to
allow
software
updates.
An
Arcnet
interface
card,
for
communicating
with
the
Programmable Logic Controllers
(PLCs),
is
fitted
in
one
of
the
expansion slots.
If
required, a
modem
can be
fitted
to
use
the
'PC
Anywhere'
software.
PC
2000
software
and
single-user
licence
The
PC
2000
control
software
runs
as
a Windows-based
application
allowing
multiple
levels
of
system control:
SYSTEMS
MANAGER,
SYSTEMS
ENGINEER,
PROCESS
DEVELOPER,
MAINTENANCE
ENGINEER,
PROCESS
EDITOR
and
OPERATOR,
all
of
which
are
accessed
by
password entry.
The system status
is
displayed
on
graphic
mimic diagrams
with
all
operational
parameters and
status displays accessible
through
pop-up
windows
selected using
the
mouse.
All
the
major
process parameters are accessible
from
the
recipe and process step set-up pages, including
definition
of
gases
on
each line and calculation
of
mass
flow
settings in sccm's. The
software
includes data
logging
to
disk
of
user-selectable
run-time
process parameters
for
off-line
verification
and analysis
of
process conditions.
Processing recipes can be
formulated
and stored in
the
computer
and
the
system can be run
in
fully
automatic
mode
using
the
recipes.
Alternatively,
the
system can be run in
the
manual
mode
with
each phase
of
the
process
controlled
and
initiated
separately.
All
the
parameters
can be
monitored
in real
time
using
the
PC
2000 software.
3.3 94-100-0-RIE
RIE
base
unit
The
Plasma
lab
System
100 process
module
base
unit
houses
the
process chamber, electronic
sub systems,
control
units, services and
power
supplies.
The
module
is
mechanically
MESC
compatible
and
is
constructed using proven
Oxford
Instruments Plasma Technology
hardware
designs.
The system
is
fully
interlocked
to
protect
the
system
hardware
from
service
failure
and
to
protect
the
operator
from
electrical shock
during
maintenance procedures. A lock
out
valve
and associated padlock,
mounted
on
the
frame, can be used
to
prevent
operation
of
all
pneumatically
operated
devices
during
servicing.
UC
Davis 94-721001
Issue
1:
March 06
Description
Page
3-2
of
22 Printed: 22-Mar-06, 7:29
System
Manual
Oxford
Instruments
Plasma
Technology
Plasma
lab
System 100
3.3.1
3.3.2
3.3.3
Frame
The
frame
is
constructed
from
steel
with
removable
access
panels. Casters and adjustable
feet
fitted
to
the
bottom
of
the
frame
enable
it
to
be easily manoeuvred,
then
levelled and locked
into
position.
Power
box
assembly
The
power
box
assembly
is
mounted
on
the
outside
of
the
frame. This distributes mains
power
to
the
+24V and ±15V
power
supply
unit,
the
frame
mounted
electrical units and
the
remote
auxiliary units. For circuit details
of
the
unit,
refer
to
the
relevant
drawing
in
Volume
2
of
this manual.
A 24V EMO (Emergency
Off)
circuit connects all
the
EMO
buttons
mounted
externally
on
the
machine.
If
any
of
these EMO
buttons
are pressed in, all
the
power
outputs
from
the
power
supply boxes are disabled.
NOTE: Freestanding auxiliary units such
as
water
recirculators, Residual
Gas
Analysers, and
the
system
control
PC,
are
not
powered
via
the
base
unit
power
box. These
require
dedicated electrical service points. These accessories remain live
when
the
system
EMO
is
pressed.
If
it
is
required
that
all accessories are
powered
off
when
the
EMO
is
pressed,
the
user must
supply a
power
distribution
unit
with
outlets
for
the
accessories, and
contact
the
factory
for
electrical
access
to
the
machine EMO circuit.
System
controller
The system
is
controlled
from
a
remote
IBM
compatible
PC
computer
terminal
using
Oxford
Instruments Plasma Technology's
'PC
2000'
software
via a Programmable Logic
Controller
(PLC)
housed
in
the
console cabinet.
See
Fig 3.1.
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Description
Page 3-3
of
22
UC
Davis 94-721001
Issue
1: March 06