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SIPLACE 80S -20/F4 User Manual 6 Vision functions Software version SR.407.xx 01/2001 US Edition 6.6 Test Component 323 6.6.4.14 Information on Measurement Modes As far as con ventiona l componen ts with lead conn ections…

6 Vision functions SIPLACE 80S-20/F4 User Manual

6.6 Test Component Software version SR.407.xx 01/2001 US Edition

322

Measuring mode menu 6

Click on the ’Measuring mode’ field to call up the Measuring mode menu. 6

Fig. 6.6 - 34 Test component menu, Meas. mode option

– In the left column of the box, the desired measuring method can be activated or deactivated by

clicking with the mouse. A cross indicates that you have activated the measuring method. The

‘Setting' field for calling up the sub-menu changes from grey to black.

Use the ‘Hex input’ field to call up the ‘Measuring mode 2’ input menu for directly entering hex

values. Please follow the instructions on page 321

Å Select ‘Accept’ to close the ‘Measuring mode’ menu. The modified measuring conditions will

be entered into the package form file on the station computer.

Å Select ‘Abort’ to interrupt the operation without transferring the data and to return to the ‘Test

component’ menu.

SIPLACE 80S-20/F4 User Manual 6 Vision functions

Software version SR.407.xx 01/2001 US Edition 6.6 Test Component

323

6.6.4.14 Information on Measurement Modes

As far as conventional components with lead connections are concerned, component centering is

essentially based on four measurement methods used to determine the position (X and Y-coordi-

nates, Φ = skew) of the component and the lead parameters: 6

– Size mode

– Row mode

– Corner mode

– Lead mode

For BGAs (B

all Grid Arrays) and flip-chips new algorithms have been implemented in order to de-

termine the position (X and Y-coordinates, Φ = skew) of the component and the ball parameters

(see Section 6.6.4.4

on page 297 ): 6

– Grid mode

– Ball mode

In accordance with your specifications any measurement method can be omitted from this se-

quence. However, it is not possible to change the way this sequence runs. 6

Definition of the measuring methods 6

– Size

This measurement method has been especially developed for small components. On the basis

of the information on dimension parameters the position and rotation of small components is

determined rapidly and reliably.

This method is very resistant to unwanted intrusive elements such as ink markings.

The size mode also employs profiling. You can have the profile formed along either the width

or the length of the component. You should make your choice within the options field. The de-

fault selection is for profiling along the longer side.

– Row

This measurement method is based on information from one row of leads.

This method is very fast and supplies approximate values for the coordinates and rotational

angle of the component.

– Corner (Component inspection)

The measurement results provide precise information on the coordinates and rotation of the

component, the number of leads, the pitch and the row offset.

This method is not sensitive to fluctuations in the lead dimensions.

– Lead (Leads inspection)

This method is used to obtain information from an inspection of every single lead.

6 Vision functions SIPLACE 80S-20/F4 User Manual

6.6 Test Component Software version SR.407.xx 01/2001 US Edition

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The following combinations of measurement methods are used: 6

– Size — Corner — Lead (see table in Section 6.6.4.15

) or

– Row — Corner — Lead (see table in Section 6.6.4.15

)

– Grid (component inspection with the F machines)

The measurement results will provide information on the approximate coordinates and approx-

imate rotation of the component. In addition, you will be informed of the quality of measure-

ment.

– Ball (determination of the ball position on F machines)

The measurement results will provide precise information on the approximate coordinates and

approximate rotation of the component. In addition, you will be informed of the maximum ball

offset and the quality of measurement.

6.6.4.15 Recommendations regarding the Optimum Sequence of Measurement Methods

The following table contains our recommendations for the optimum sequence of measurement

methods for particular components. The following abbreviations are used: 6

B = ball C = corner G = grid

L = lead R = row S = size

L applies to irregularly shaped components with separate windows 6

Component

Measurement sequence

SRGC L B

MELF S L

CHIP S L

SOT S C L

SOJC6 S C

SOJC14 R C

LCC R C L

PLCC R C L

QFP R C L

TAB R C

BGA, flip-chip S G B

Bare dies S